List of Bonding Equipment products
- classification：Bonding Equipment
121～142 item / All 142 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
We can produce sheets from less than 1mm thick to several tens of mm thick! We meet our customers' needs with shaping processes tailored to their applications.
- Other Auto Parts
- Bonding Equipment
- Transport and handling robots
Three times the brightness. Achieving both compactness and high luminosity!
- Visual Inspection Equipment
- Bonding Equipment
- Lighting for image processing
Capable of supporting various applications such as heating processes and temperature evaluation! Maximum 400℃.
- Other heaters
- Heating device
- Bonding Equipment
This is a super compact and thin hot plate with a built-in cartridge heater, capable of reaching up to 300℃.
- Other heaters
- Heating device
- Bonding Equipment
We provide everything from circuit configurations necessary for flip chips to ultrasonic bonders.
- Bonding Equipment
- Contract manufacturing
Standard support for COF and COG substrates with one unit! A semi-automatic flip chip bonder that achieves the industry's smallest installation space and low cost.
- Bonding Equipment
- Other semiconductor manufacturing equipment
High-performance flip chip bonder for multi-variety cell production lines.
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Cell production support. Capable of handling everything from multi-variety production applications to process and material development!
- Bonding Equipment
- Other semiconductor manufacturing equipment
IC bonding device
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production use.
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Implementation Solution Service
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Notice of Participation in the 22nd Fine Tech Japan - Low Power Atmospheric Pressure Plasma Device with Reduced Ozone and Nitrogen Oxide Emissions
Well, Inc. (Location: Shinagawa, Tokyo; CEO: Naoyuki Eda), a provider of advanced semiconductor packaging solutions centered around test chips, will exhibit at the 22nd Fine Tech Japan, which will be held at Tokyo Big Sight from April 11 (Wednesday) to April 13 (Friday), 2012. Well's atmospheric pressure plasma equipment is characterized by its environmental friendliness, featuring low power consumption (CO2 reduction) while suppressing the generation of ozone and nitrogen oxides. Additionally, it does not require a vacuum chamber like conventional equipment, combining low capital investment with low running costs, which is its greatest economic advantage. On the day of the event, we will conduct a demonstration using the compact tabletop MyPL-Auto150, allowing you to experience actual large-area plasma irradiation. We sincerely look forward to your visit. 【Contact Information for Inquiries】 Well, Inc. Packaging Solutions Sales Department Tel: 03 (5715) 3501 Email: info@welljp.co.jp http://well-plasma.jp/
Real-time monitoring system for semiconductor packaging process anomalies
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Dispenser & UV irradiation device
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Ultrasonic flip chip bonder
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Next-generation soldering materials that respond to modern needs with a focus on environmental compatibility and health.
- Bonding Equipment
- Other semiconductor manufacturing equipment
- Solder
Desktop high-precision equipped machine
- Assembly Machine
- Bonding Equipment
Analysis of the LCD Implementation Device Market and Demand Trends for LCD Driver ICs
- Bonding Equipment
- Circuit board processing machine
- Other semiconductors
FC/COG/COF Bonder Market Analysis Report 2005
- Bonding Equipment
- LCD display
- Printed Circuit Board
FC/COG/COF Bonder Market FC Implementation Technology Trend Analysis 2004
- Bonding Equipment
- Other semiconductors
- Printed Circuit Board