List of Other semiconductor manufacturing equipment products
- classification：Other semiconductor manufacturing equipment
181～195 item / All 2005 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Features stable solder ball mounting and improves productivity through an inline system.
- Other semiconductor manufacturing equipment
A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].
- High pressure cleaner
- Other semiconductor manufacturing equipment
- Resist Device
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).
- Other semiconductor manufacturing equipment
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
Both upper and lower surfaces can be UV irradiated. Even with an affordable version that is easy to use, we thoroughly pursue cost-effectiveness (effectiveness) in curing.
- Other semiconductor manufacturing equipment
Notice of Participation in "Semicon Japan 2018"
We will be exhibiting at "SEMICON Japan 2018," which will be held at Tokyo Big Sight in December 2018! We will be participating in the "SEMICON Japan 2018 (Back-End & General Zone)." ▼ Exhibited Products - "Ultrasonic Cutting Device CSX-400 Series" - "Chip 6-Sided Appearance Inspection Device CI-4000" - "Ultra-Low Load Compatible Flip Chip Bonder CB-600" - "Tabletop LED Light Source UV Irradiation Device" We sincerely invite you to visit our booth during this opportunity. 【Date】 December 12 (Wednesday) - 14 (Friday), 2018 10:00 AM - 5:00 PM 【Venue】 Tokyo Big Sight, East Exhibition Hall, Conference Hall 【Booth Number】 2009
![[Compact & Lightweight] UV-LED Irra...](https://image.mono.ipros.com/public/product/image/41b/2000460215/IPROS62495294798517871344.png?w=280&h=280){kind=small}
A compact LED curing device that can be used on a tabletop. It can emit light from both the top and bottom, and its affordable price is also attractive! *Demo units available for loan.
- Other semiconductor manufacturing equipment
Dust removal device compatible with thin plates. Equipped with a magnetic gear in the drive unit! This single unit can accommodate a wide range of substrate thicknesses.
- Printed Circuit Board
- LCD display
- Other semiconductor manufacturing equipment
Semi-auto FCB (Flip Chip Bonder) that meets a wide range of user needs.
- Assembly Machine
- Other semiconductor manufacturing equipment
A compact LED curing device that can be used on a tabletop. It offers irradiation capabilities and is attractively priced! *Demo units available for loan.
- Other semiconductor manufacturing equipment
Insulation coating for chip inductors
- Inductor Coil
- Other semiconductor manufacturing equipment
If you are troubled by corrosion from acids and alkalis, use Shine Kogei's Blue Armor!
- Surface treatment contract service
- Other plant design, development and maintenance
- Other semiconductor manufacturing equipment
Excellent resistance to corrosion and wear, seamless ceramic joints eliminate metal contamination.
- Pipe Fittings
- Fine Ceramics
- Other semiconductor manufacturing equipment
For resolving corrosion troubles, definitely use Shine Kogei's Blue Armor Coating!
- Surface treatment contract service
- Other semiconductor manufacturing equipment
A model that combines a membrane attachment method compatible with TAIKO(R) wafers and a heating function.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
TAIKO(R) wafer and thin wafer compatible models
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
A model suitable for processes where temperature conditions affect adhesion quality and for applications where process variation needs to be minimized.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.