List of Other semiconductor manufacturing equipment products
- classification：Other semiconductor manufacturing equipment
361～375 item / All 1996 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
We flexibly respond to everything from software and hardware design to implementation and product assembly. "Yoho's adaptability" to the challenges of various manufacturers.
- EMS
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
Capable of accommodating large circuit board assembly in 850×500mm size.
Supports large PCB assembly with a size of 850×500mm. [Precision] Chip size: 03015 Lead pitch: 0.3mm Adjacent pitch: 0.1mm [Supported Chips] BGA, CSP, QFN, SOP, QFP, LED, etc. [Supported Sizes] Minimum size: 50mm×50mm Maximum size: 500mm×850mm Board thickness: 0.5mm to 3.0mm
If you are troubled by contamination from waste and foreign substances after cleaning, NCC will provide solutions!
- Other machine tools
- Other production management systems
- Other semiconductor manufacturing equipment
Challenge to a new film polishing method using multi-axis robots! You can watch it in the video.
- Other semiconductor manufacturing equipment
- Grinding Machine
We will exhibit at JIMTOF2024.
We will be exhibiting at the 32nd Japan International Machine Tool Fair JIMTOF2024. This time, in addition to our existing outer diameter grinding machines and robotic grinding machines, we will showcase a new internal diameter grinding machine, a new end face grinding machine, and a newly developed belt-type surface grinding machine, along with demonstrations. We will also provide explanations about the machines, discussions on film grinding, and talks aimed at specific machine development at the venue, so please come and visit us. Exhibition Location: East Hall E1039, Sanshin Corporation
Ultra-fast, clean, and low-load. Why not optimize the TBDB (temporary bonding and debonding) process with a photonic debonding device?
- Other semiconductor manufacturing equipment
In addition to viewing information, data analysis is possible!
- Other semiconductor manufacturing equipment
- Other analyses
- Analysis Services
Provided with the AVEVA and Stratus configuration! No setup required for customers! Ready to use immediately! The AVEVA license achieves redundancy with just one set.
- Other semiconductor manufacturing equipment
- Other process controls
- Other Auto Parts
We manufacture carriers according to customer needs for use as wafer holders in the lapping and polishing process of silicon wafer manufacturing.
- Other semiconductor manufacturing equipment
Highly accurate temperature measurement function is ideal for temperature control of heat treatment process!
- Other semiconductor manufacturing equipment
Vertical cleaning system (VTC series) saves space and contributes to the "reduction of chemical solution and pure water". World's top-class delivery record (over 400 units)
- Other semiconductor manufacturing equipment
Automatic transfer of wafers in a cassette to another cassette/Possible to add functions such as simultaneous transfer of 2 cassettes, pitch conversion, and face-to-face (back-to-back) transfer.
- Other semiconductor manufacturing equipment
IPA vapor displaces moisture and dries the object. For 4 to 8-inch wafers. Can be installed into and docked to various cleaning tools.
- Other semiconductor manufacturing equipment
Equipped with a spin cleaning unit that uses tap water. This method utilizes a cleaning solution that replaces the RCA cleaning solution.
- Other semiconductor manufacturing equipment
A heater that achieves high efficiency and clean heating without the need for insulation! The gas heater "Clean Hot" is an electric heater that utilizes bending technology!
- Other semiconductor manufacturing equipment
- Heating device
The control system is PC + PLC! Options such as the flight observation unit are also available.
- Other semiconductor manufacturing equipment