Machining Case Study | Ring Parts for S45C Quenched and Tempered Semiconductor Manufacturing Equipment

Processing S45C quenched and tempered steel using high-precision CNC machining technology. Manufacturing ring components for semiconductor manufacturing equipment.

We would like to introduce a machining case of ring parts for semiconductor manufacturing equipment. By finishing the S45C quenched material into a complex and three-dimensional shape with high precision, we achieve both functionality and durability within the equipment. The product size is Φ305× overall thickness of 2mm. The design incorporates numerous cutouts and stepped machining to avoid interference with wiring and cooling systems. Even with shapes that boast high machining difficulty, we maintain high reproducibility and quality through a 5-axis machining center and precision jigs. [Case Overview] ■ Industry: Semiconductor manufacturing equipment ■ Machining method and process: High-precision CNC cutting ■ Product size: Φ305× overall thickness of 2mm ■ Material: S45C quenched *If you are wondering whether such machining is possible, please feel free to contact us. ~ For complex machining of intricate shapes using NC lathes and machining centers, contact Ootone Seiki ~

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