List of Other semiconductor manufacturing equipment products

  • classification:Other semiconductor manufacturing equipment

421~435 item / All 2013 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!

  • Cooling system

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April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024

Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.

Automatic sleeve packaging machine without fusion seal.

  • Other semiconductor manufacturing equipment

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Our company's unique multilayer film deposition multi-mirror lamp house-equipped device.

  • Other semiconductor manufacturing equipment

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100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals.

  • Other semiconductor manufacturing equipment

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Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry] Fully automated system.

  • Other semiconductor manufacturing equipment

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Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Fully automated equipment.

  • Other semiconductor manufacturing equipment

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Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Fully automatic equipment.

  • Other semiconductor manufacturing equipment

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Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

  • Other semiconductor manufacturing equipment

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Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.

100% focus on BATCHSPRAY technology! Significant reduction of water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry].

  • Other semiconductor manufacturing equipment

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Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.

Replace hydrogen peroxide with ozone! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

  • Other semiconductor manufacturing equipment

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Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.

Remove resin residue after dry etching without using organic solvents!

  • Other semiconductor manufacturing equipment

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Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.

Make effective use of the interior of the device while saving space.

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  • Other machine elements
  • Food Packaging Machinery
  • Other semiconductor manufacturing equipment

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March 6, 2025 (Thursday) 16:00 - WEB Seminar [Safety Measures / Improving Work Efficiency] Case Studies on Solving Issues Around Doors and Covers

【Event Date and Time】 March 6, 2025 (Thursday) 16:00 - 16:45 *Participation is free. The capacity is 250 people (first come, first served). 【Highlights】 - We will introduce examples of how we solved customer challenges using our technology for lightly opening doors and lids or securely holding them in place, known as "Motion Design Tech." - Many mechanical components that contribute to safety measures and improved work efficiency will be showcased. Participants who respond to the survey after the seminar will receive a torque hinge!! *The torque hinge offered as a participation benefit is for illustration purposes. The actual product may differ in design and specifications. You can also check the details of the seminar on the registration page. We sincerely look forward to your participation.

There is a track record of adoption in semiconductor manufacturing equipment components. Contributes to weight reduction and strength improvement of products.

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  • Other semiconductor manufacturing equipment

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Processing of GaN substrates is also possible! Introduction of contact annealing lamp annealing (RTP) equipment.

  • Other semiconductor manufacturing equipment

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We flexibly respond to everything from software and hardware design to implementation and product assembly. "Yoho's adaptability" to the challenges of various manufacturers.

  • EMS
  • Other semiconductor manufacturing equipment
  • Semiconductor inspection/test equipment

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Capable of accommodating large circuit board assembly in 850×500mm size.

Supports large PCB assembly with a size of 850×500mm. [Precision] Chip size: 03015 Lead pitch: 0.3mm Adjacent pitch: 0.1mm [Supported Chips] BGA, CSP, QFN, SOP, QFP, LED, etc. [Supported Sizes] Minimum size: 50mm×50mm Maximum size: 500mm×850mm Board thickness: 0.5mm to 3.0mm

If you are troubled by contamination from waste and foreign substances after cleaning, NCC will provide solutions!

  • Other machine tools
  • Other production management systems
  • Other semiconductor manufacturing equipment

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