List of Printed Circuit Board products
- classification：Printed Circuit Board
76～90 item / All 2108 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Difficult-to-dissolve substances can also be cleaned with peeling and dissolving actions! A water-based cleaning agent that balances cleaning performance and safety.
- Cleaning agents
- Other semiconductors
- Printed Circuit Board
A page for "flux cleaner" has been added.
We have added a page for "Flux Cleaning Agent." This product selectively removes flux residues and is a water-based cleaning agent that supports the quality and reliability of electronic devices. Conventional solvent-based cleaning agents primarily rely on dissolving action to remove flux residues, but this product simultaneously exhibits both peeling and dissolving actions through its unique cleaning technology. 【Features】 ■ High cleaning performance due to unique cleaning technology ■ Removal of oxide films and prevention of re-oxidation during cleaning ■ Increased bonding strength through cleaning ■ High safety due to being a water-based cleaning agent
Solving technical challenges for large-scale deployment of IoT sensors! We propose low-cost dataization for society as a whole.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
We expand the possibilities of product design with flexible substrates! FHE enhances design freedom and creates new applications.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
Wireless communication sends data to smartphones and the cloud! FHE system configuration that allocates roles appropriately.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
Reduce manufacturing processes by applying functional ink only where necessary! A new manufacturing technology that contributes to energy savings and material waste reduction.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
We realize electronics with thin, lightweight, and flexible substrates. The design philosophy of flexible hybrid electronics in response to changes in social structure.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
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Adopts a body with embedded electrostatic discharge prevention material, an ESD-compatible laser barcode scanner capable of continuous high-speed reading.
- Printed Circuit Board
- Other semiconductors
- Other clean room equipment and facilities
Adopts a body with embedded electrostatic discharge prevention material, ESD-compatible two-dimensional barcode scanner capable of reading QR codes.
- Printed Circuit Board
- Other semiconductors
- Other clean room equipment and facilities
An explanation of the basic knowledge of photoresist essential for high-precision printing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Explaining the basic knowledge of pattern formation for the light-emitting layer in LED manufacturing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books