List of Printed Circuit Board products
- classification：Printed Circuit Board
931～945 item / All 2069 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
The inner layer copper foil thickness can use 1/2 oz (18 μm) and in some cases 1 oz (35 μm)!
- Printed Circuit Board
Creating many benefits with flex-rigid integration! Possible multilayer structure of the flex layer.
- Printed Circuit Board
Multi-layer structure with conductor thickness of up to 500μm! We propose an optimal heat dissipation structure.
- Printed Circuit Board
Expose and form a resistive film on part of the inner layer circuit! The set resistance value can be calculated using a formula.
- Printed Circuit Board
It is possible to advance favorably in terms of the total cost of the product! Here are the benefits of bulk ordering units.
- Printed Circuit Board
It will be active in the prototype and mock-up of the panel sheet!
There may be changes in design, size, and shape before mass production. We have a suggestion for those struggling with prototype panel sheets during design reviews and internal presentations. How about trying a prototype without initial costs using the facilities of U Corporation? If you consult with us, as a manufacturer of panel sheets and operation units, we can provide suggestions from the prototyping stage. If it receives positive feedback during the review, we can smoothly transition to mass production, and we will also consider improvement proposals for any points raised. For expertise in operation components, please consult U Corporation.
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Achieve grounding of the aluminum section! This improves the usability and design flexibility of the aluminum part. By pre-installing and securing with screws, labor reduction becomes possible!
- Printed Circuit Board
- Circuit board design and manufacturing
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Achieve grounding of the aluminum section! This improves the usability and design flexibility of the aluminum part. By pre-installing and securing with screws, labor reduction becomes possible!
- Printed Circuit Board
- Circuit board design and manufacturing
The pad pitch is 0.5mm! It is suitable for fine pattern products.
- Printed Circuit Board
Minimum L/S, manufacturable layer count, board thickness, etc.! Introducing our printed circuit board specifications.
- Printed Circuit Board
We will meet our customers' needs through creativity and effort!
- Printed Circuit Board
We achieve narrow GAP implementation and miniaturization of high-quality implementation boards.
- Printed Circuit Board
Contributing to miniaturization through high-density packaging.
We support the implementation of small chip components essential for miniaturizing substrates and their narrow gap mounting. Our company has contributed to the miniaturization of Sony products by pursuing high-density mounting technology. We provide high-quality support for high-density mounting, such as the implementation of 0402 size components used in mobile devices like smartphones. Additionally, we are capable of accommodating even smaller components, such as 0201 and 03015 sizes. 【Features】 - Implementation of 0402 size components with narrow gap - Mixed mounting with large components (connectors, etc.) is possible - Capable of implementing 0201 and 03015 size components - Equipped with solder printing inspection machines, pre-reflow inspection machines, and post-reflow inspection machines to ensure high quality.
Simultaneous processing of multiple materials on a single worksheet for smartphones, automotive, and wearable fields.
- Printed Circuit Board
- Engineering Plastics
- Processing Contract
Simultaneous punching of polyimide films with adhesive, varying in size and thickness.
- Printed Circuit Board
- Engineering Plastics
- Processing Contract
We will be exhibiting at the "7th High-Performance Plastic Exhibition" during the High-Performance Materials Week 2018.
We will introduce the latest examples of composite tape processing technology at "High-Function Material Week 2018 - 7th High-Function Plastic Exhibition." Dates: December 5 (Wednesday) - December 7 (Friday), 2018, 10:00 AM - 6:00 PM (until 5:00 PM on the last day) Venue: Makuhari Messe Booth No.: 29-11 (International Exhibition Hall 5) Exhibition Content: From processing thermosetting resins and tapes to lamination processing 1. Composite tape processing of materials with different shapes, thicknesses, and materials (press processing) 2. Multi-layer high-precision tape processing using roll-to-roll (web processing) 3. Anti-reflective display devices utilizing vacuum lamination technology (lamination processing) 4. Molding and cutting products of GRFP (glass epoxy) (resin molding and processing) Based on our achievements in a wide range of industries and applications, including the automotive industry, aerospace, and mobile, we can offer various proposals that are not limited to specific industries or applications. Additionally, on the day of the exhibition, we will have a meeting space available where our development manager will be on hand to address any concerns or inquiries. We look forward to welcoming those who have questions or are interested in our offerings.
Numerous processing achievements of cushioning materials for smartphone screens, speakers, camera modules, etc.
- Printed Circuit Board
- Processing Contract
- plastic
For use in smartphones, automotive, and wearable fields, such as reinforcement plates and for conductive, shielding, and heat dissipation applications.
- Printed Circuit Board
- Engineering Plastics
- Processing Contract
We will be exhibiting at the Japan Manufacturing World 2020 "24th Mechanical Components & Materials Technology Expo."
We will be showcasing the molding and processing of thermosetting resins (such as GFRP) at the "Japan Manufacturing World 2020 - 24th Mechanical Components Technology Exhibition." Dates: February 26 (Wednesday) - February 28 (Friday), 2020, 10:00 AM - 6:00 PM (until 5:00 PM on the last day) Venue: Makuhari Messe Booth No.: 2-19 (International Exhibition Hall 1) Exhibition Contents: 1. Custom-made products of GFRP (such as GFRP) 2. Reflection reduction processing for meter cluster panels 3. Precision tape processing for mobile applications We plan to exhibit custom-made GFRP products used as mechanical and insulating parts in various fields, including aerospace and equipment, meter cluster panels for vehicles with reflection reduction processing, and tape products with applications primarily in the mobile sector. We look forward to welcoming those who have inquiries or are interested in our offerings.