List of Other electronic parts products
- classification：Other electronic parts
5956～5970 item / All 8549 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Ideal for micro-machining! Achieves deburring of holes and double-sided machining in one pass, which was difficult with conventional tools!
- Other machine tools
We will be exhibiting at Mecatronics Tech Japan 2021 from October 20 (Wednesday) to October 23 (Saturday)!
Our company will exhibit at "Mechatrotech Japan 2021," which will be held at Portmesse Nagoya from Wednesday, October 20 to Saturday, October 23, 2021. We will introduce our tools, including the 'Bar Off Tool' capable of chamfering and deburring from a diameter of 0.8 mm, and the 'FEM' tool breakage detection device that reliably detects breakage. We look forward to your visit. (Booth number: 2B12)
Built-in proportional amplifier, freely programmable PLC.
- Other electronic parts
- Hydraulic Equipment
- Remote Control
Due to changes in international standards, the voltage range has been expanded and the testing conditions have become stricter. The protective element SM8SF-Q is compliant with the new standards and i...
- Other electronic parts
The SMD type comes in two varieties: low voltage (3-170V) and medium voltage (14-385V), with a surge current tolerance of 30-1,200A.
- Other electronic parts
This is a proposal for overcurrent and overvoltage protection for USB Power Delivery in the product lineup offered by Bones Corporation.
- Other electronic parts
Direct connection to a through-hole type metal oxide varistor! Reduces the aging deterioration, which is a weakness of MOVs.
- Other electronic parts
Taiwan TOKEN Corporation's high voltage divider 【high precision, high voltage, high power】
- Other electronic parts
We offer our manufacturing and processing facilities to fabless companies! Let us introduce our SMT business.
- Contract manufacturing
- Processing Contract
- Other electronic parts
We can accommodate from a single prototype! We have a diverse inventory of parts and can also handle short delivery times!
- Processing Contract
- Other electronic parts
![[SMT Compatible Product] Shield Cli...](https://image.mono.ipros.com/public/product/image/178/2000586878/IPROS83610256350287956878.png?w=280&h=280){kind=small}
High reliability with stable and strong joints! The shield cover can be easily removed, improving workability.
- Other electronic parts
High-temperature applications up to 150℃ are possible! Based on our extensive experience in developing press-fit products, we can propose specifications suitable for your application.
- Other electronic parts
- Crimp Terminal
- Optical Connector
Achieving high performance and high quality! In-house integrated production from mold design to modularization.
- Other electronic parts
- Other machine elements
- Contract manufacturing
Ultra-small satellite, CubeSat, with AIS receiver
- Other electronic parts
- others
A variety of products are available, including SPXO crystal oscillators that can withstand high temperatures!
- Other electronic parts
It is possible to arrange numerous fine holes of 0.01 to 0.03 mm on the surface! Applicable to custom-shaped products according to specifications.
- Heat exchanger
- Other electronic parts
- air conditioning
Solid-phase diffusion bonding refers to [WELCON Corporation].
Capable of manufacturing complex fine three-dimensional structures! We have a proven track record in various fields such as aerospace and chemical plants. Solid-state diffusion bonding is a method of directly bonding materials together, which is significantly different from techniques like welding or brazing. This technology promotes atomic movement at the bonding interface by heating and applying pressure to the materials being joined, allowing for bonding without melting the materials, thus expanding the range of possible manufacturing methods and functions. With the solid-state diffusion bonding method, it is possible to create fluid devices with microchannel structures and complex fine three-dimensional structures. 【Features】 ■ Lamination bonding of thin plates is possible ■ Bonding strength comparable to the base material can be achieved ■ Complex hollow components can be manufactured ■ Precise bonding with minimal deformation is possible ■ Bonding of dissimilar materials is possible *For more details, please refer to the PDF document or feel free to contact us.