List of Other electronic parts products
- classification：Other electronic parts
121～135 item / All 8605 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Explaining the basic knowledge of photoresist essential for microstructure processing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Fundamental knowledge of photoresists essential for high-precision component manufacturing in the aerospace field.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
An explanation of the basic knowledge of photoresist, which is essential for semiconductor manufacturing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
I will explain the basic knowledge of the printing process in an easy-to-understand manner.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Basic knowledge of photoresist essential for electrode formation in solar cells.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
An explanation of the basic knowledge of photoresist, which is essential for semiconductor manufacturing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
An explanation of the basic knowledge of photoresist, which is essential for the manufacturing of liquid crystal displays.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
"Certified for technical standards compliance" Wireless communication with selectable frequency bands reduces installation work and communication troubles on-site!
- Other network tools
- Other electronic parts
- Wireless LAN
A sheet socket that enables stable inspection in semiconductor back-end process inspection! What is "PCR" that allows for high-speed and high-density measurements? Technical materials on operating pri...
- Other electronic parts
- socket
- Semiconductor inspection/test equipment
Supports various testing processes! Sheet socket "PCR" enables high-speed and high-density measurements.
- Other electronic parts
This is a sleeve for vibration motors for mobile phones.
- Other electronic parts
We will manufacture multi-layer flexible printed circuit boards (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)
- Other electronic parts
- Printed Circuit Board
- Circuit board design and manufacturing
Experience Taiyo Technorex's FPC at Flex's social study tour, Nepcon Japan 2025!
◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of FPC in four zones: lightweight, flexible, fine, and special. 1. Comparison of weight between rigid boards and FPC 2. FPC that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPC with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. It's not just about FPC! We have live demonstrations of 'FA Automation' and the latest appearance inspection system using AI technology! ◎FA Automation: By achieving teaching-less automation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed operation. We have prepared a demonstration for the transport of rigid boards. ◎The latest final appearance inspection system, the AI system 'TY-VISION XAIS,' is now in Chapter 2! In addition to improving efficiency by reducing false positives in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with minimal brightness differences that are difficult to detect with inspection devices, even though they can be identified visually.
Supports over 50% elongation! There are various applications such as wearable electronic devices and robots.
- Other electronic parts
【TTL】Invisible wiring with transparent FPC! Compatible with reflow mounting, ideal for display devices such as digital signage. 【Flexible Printed Circuit Board】
Transparent flexible printed circuit boards contribute to improved design with excellent transparency! Fine patterns make the wiring less noticeable. 〇 Made with polyimide that excels in heat resistance and flame retardancy. ⇒ Compatible with reflow mounting. ★ Suitable for display devices such as digital signage, as well as medical devices and transparent film antennas! ★ We also accommodate small quantities and a variety of prototypes.
A bump with a minimum diameter of Φ20µm is formed at the terminal section of the FPC. The bump is used as a contact point and is applied in high-precision circuit testing, etc. (Flexible substrate)
- Other electronic parts
[Press Release from Taiyo TechnoRex] Regarding the Improvement of High-Density Wiring Formation Technology Using the Patterned Beer Fill Method
Our company has further improved the technology for forming high-density wiring in our core business of electronic substrates, specifically in flexible printed circuit boards (FPCs). In recent years, electronic devices such as medical equipment and industrial machinery have been advancing in miniaturization and lightweight design. To incorporate many functions into limited space, there is a demand for increased wiring density on the substrate. Therefore, we have been working on establishing filled via technology and improving the M-SAP method. The filled via structure involves filling vias (holes) made by laser in the insulating layer with copper plating, ensuring electrical connections on both sides of the substrate while reducing the recesses of the vias, which allows for component mounting on the vias and leads to high-density mounting. On the other hand, the M-SAP method significantly improves line width management by laminating copper to form circuits, enabling high-density wiring. This time, based on the pattern via fill method that leverages these characteristics, we successfully formed wiring with a pitch of 30μm on a double-sided substrate with a filled via structure. We will continue to aim for further improvements in high-density wiring formation technology through ongoing development, prototyping, and verification.