List of Other semiconductors products
- classification:Other semiconductors
346~360 item / All 2653 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Custom formulations for important applications
- Other semiconductors
- Other medical supplies and cosmetic manufacturing materials
FFKM solutions designed for harsh operating conditions.
- Other semiconductors
For heat dissipation of surface mount packages such as DPAK, D2PAK, and SO-8. Our compact design reliably solves thermal issues in power converters and power supply boards.
- Other semiconductors
We conducted a cleaning evaluation using samples created under conditions that are likely to leave residues intentionally!
- Other semiconductors
A page on "Cleaning evaluation of organic residue remaining after sintering" has been added.
In the field of power semiconductors for automotive and industrial applications, the adoption of "sintering bonding" as a joining technology that achieves high resistance and high reliability against thermal stress is expanding, replacing solder bonding. Similar to no-clean solder bonding technology, sintering bonding is fundamentally designed to be "no-clean." However, the currently mainstream sintering bonding methods are conducted under high temperature and high pressure conditions, which can lead to the generation and adhesion of residues during the bonding process, potentially affecting subsequent processes and long-term reliability. Cleaning is one proposed solution to this issue. Although there is a "no-pressure" method for sintering bonding, its applications tend to be limited from the perspective of strength and reproducibility. Additionally, while it is residue-free, it is not "zero residue," so cleaning can also be a viable solution for achieving reliability. Detailed content of the technical column can be viewed through the related link.
Designed for a wavelength range of 760 to 2900 nm with an accuracy of ±10 nm.
- Other semiconductors
QCL optimal for high-precision gas detection using TDLAS.
- Other semiconductors
High-output DFB laser with a maximum of 40mW
- Other semiconductors
Development of technologies for adhesion, control, and monitoring! Comprehensive support from design to manufacturing.
- Other semiconductors
- Wafer
- Other conveying machines
We will handle everything from frame arrangement to resin processing and piping based on the drawings provided by the customer!
- tank
- Other semiconductors
- Other cleaning machines
If you are looking for an authorized distributor of 3PEAK products, please contact Eitoku International. Short delivery times and high-quality assurance. Feel free to inquire.
- Amplifier
- Dedicated IC
- Other semiconductors
Publication of CRA requirements and mapping of Renesas MCU/MPU solutions! A document that clarifies security compliance.
- Other semiconductors
Introducing ultra-hard alloy pins and shafts (centerless and cylindrical processed products, small-diameter pins) born from grinding technology with micron to sub-micron precision!
- Other Auto Parts
- Other semiconductors
- Processing Jig
[SMD Thermal Management] Heat Sink for Surface Mount ICs | Compact and Lightweight for Space-Saving on Circuit Boards (Manufactured by Fischer Elektronik)
- Other semiconductors
Supporting manufacturing from the procurement of multiple materials to the processing of materials through multiple stages!
- Other semiconductors
- Processing Contract