List of Other semiconductors products

  • classification:Other semiconductors

346~360 item / All 2603 items

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Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

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  • air conditioning

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Heat sink for surface mount devices measuring W8mm x H6mm x L8mm.

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  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Chemical reactions caused by dilute gases can also be considered!

  • CVD Equipment
  • Wafer
  • Other semiconductors

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Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!

  • Technical and Reference Books
  • Other semiconductors

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20260515半導体の進化による接合構造の変化とパッケージング対応.png

5/15 Webinar "Changes in Joint Structures and Packaging Solutions Due to the Evolution of Semiconductors"

■ Title: "Changes in Joint Structures and Packaging Correspondence Due to the Evolution of Semiconductors - Response of Resin Sealing Technology to the Increase in the Number of Joint Locations and Narrow Spacing -" ――Organizing the core of joint design and sealing technology essential for the WLP and 3D assembly era. Covering failure mechanisms and countermeasures associated with high integration, providing insights directly related to development, evaluation, and mass production challenges. ■ Date and Time: May 15, 2026 (Friday) 13:00 - 16:30 ■ Zoom Streaming (with materials) 【Knowledge Gained from the Seminar】 - Development history and trends of semiconductor packaging - Changes in semiconductor joint structures and the current status of packaging technology - Evolution of semiconductor packaging and the development history, challenges, and countermeasures of resin sealing technology 【Target Audience for the Seminar】 - Stakeholders in the semiconductor-related fields (sales, technical positions, etc.) - Individuals interested in semiconductor manufacturing technology (front-end, back-end, etc.) - Those interested in the evolution of semiconductor packaging and the corresponding packaging technology - Individuals interested in semiconductor integration = bonding technology (Bumping Technology)

Aluminum heat sink for board mounting that can secure a transistor without screws (W15 mm x H45 mm)

  • sk703-アルミ押出ヒートシンク-トランジスタ固定スプリング用 (1).jpg
  • sk70350sa.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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1/1000 micron dimension management! Providing appropriate processing tailored to customer needs.

  • Other metal materials
  • Other semiconductors

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Supports a wide range of materials! Achieving dimension management at 1/1000 microns and short delivery times.

  • Other semiconductors
  • stainless

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In the semiconductor industry! We aim for low cost and high quality to meet our customers' needs.

  • Other semiconductors
  • aluminum

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Manufacturing in Katsushika Ward! We offer products with dimension management of 1/1000 microns in a short delivery time.

  • Other semiconductors
  • Other metal materials

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You can arrange and secure four transistors to the heat sink.

  • thfm.eps.jpg
  • IPROS2175634052087143217.jpeg
  • Other semiconductors

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BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

  • JBHAE1401-2D.jpg
  • logo JARO Thermal.png
  • Other semiconductors

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BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

  • JBHAE1501-2D.jpg
  • logo JARO Thermal.png
  • Other semiconductors

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BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

  • JBHAE1701-2D.jpg
  • logo JARO Thermal.png
  • Other semiconductors

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BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

  • JBHAE1801-2D.jpg
  • logo JARO Thermal.png
  • Other semiconductors

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