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We provide comprehensive support from design to manufacturing and maintenance!

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  • Contract manufacturing

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It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...

  • Sensors

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Acrylic room key holder inspired by a retro hotel room key.

  • Contract manufacturing

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Cute mini-sized acrylic room keychain! Available in 10 colors with customizable color combinations!

  • Contract manufacturing

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For robot motion control, excellent lifting power and long-lasting gas springs.

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  • Other machine elements

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It is an aluminum sheet that cuts 97% of radiant heat. It covers control panels and equipment outdoors to prevent failures and damage caused by heat.

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  • Other safety and hygiene products

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A gas spring that provides high load per cylinder diameter and contributes to weight reduction.

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  • Other molds

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Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniq...

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  • Printed Circuit Board
  • Circuit board design and manufacturing

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【TTL_Exhibition Participation Information】JPCAShow2025 'Newly Developed Topics.'

◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots

We have published a case where high-performance heat-insulating sheets were installed from the inside on the underside of the roof and the west wall, resulting in a temperature drop of about 22°C on t...

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  • Other safety and hygiene products

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High-load, compact gas spring for positioning medical devices.

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  • Other molds

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Introduction to high-difficulty FPCs, specific issues, and TAIYO's one-stop service, covering the basics of flexible substrates (glossary)!

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  • Printed Circuit Board
  • Other cable related products
  • Other electronic parts

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Press Release from Taiyo Techno Rex: Regarding the Conclusion of a Business Outsourcing Contract for Space Environment Testing

~Starting the demonstration of high-reliability FPC through space environment testing~ Taiyo Techno Rex Co., Ltd. has recently signed a business outsourcing contract with Jinsei Co., Ltd. regarding the space environment testing of our space-use FPC (Flexible Printed Circuit) cables. Our FPC will be mounted on the engineering model of the small satellite "Cubesat" developed by Jinsei, and various tests simulating the space environment will be conducted. This testing is an important initiative aimed at confirming and demonstrating functionality in future orbital operations. In outer space, resistance to extremely harsh conditions such as extreme temperature changes, radiation, and intense vibrations is required. We view this initiative not only as limited to space applications but also as an opportunity to demonstrate FPC technology that exhibits high reliability even under extreme conditions. Moving forward, we will continue to develop and provide high-reliability FPCs with an eye toward expanding into a wide range of fields, including aerospace, industrial equipment, automotive devices, and various inspection equipment, where high quality and reliability are essential.

A systematic explanation of the manufacturing process of semiconductor ICs, from the front-end and back-end processes to assembly, including the roles and necessity of the materials used in each stage...

  • Other semiconductors
  • Other semiconductor manufacturing equipment
  • Technical Seminar

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Consistent support from development design to parts procurement, manufacturing, implementation, and assembly with short delivery times. Capable of small lot and diverse prototype and mass production.

  • Contract manufacturing

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宇宙環境試験に係る業務委託契約締結について.jpg

Press Release from Taiyo Techno Rex: Regarding the Conclusion of a Business Outsourcing Contract for Space Environment Testing

~Starting the demonstration of high-reliability FPC through space environment testing~ Taiyo Techno Rex Co., Ltd. has recently signed a business outsourcing contract with Jinsei Co., Ltd. regarding the space environment testing of our space-use FPC (Flexible Printed Circuit) cables. Our FPC will be mounted on the engineering model of the small satellite "Cubesat" developed by Jinsei, and various tests simulating the space environment will be conducted. This testing is an important initiative aimed at confirming and demonstrating functionality in future orbital operations. In outer space, resistance to extremely harsh conditions such as extreme temperature changes, radiation, and intense vibrations is required. We view this initiative not only as limited to space applications but also as an opportunity to demonstrate FPC technology that exhibits high reliability even under extreme conditions. Moving forward, we will continue to develop and provide high-reliability FPCs with an eye toward expanding into a wide range of fields, including aerospace, industrial equipment, automotive devices, and various inspection equipment, where high quality and reliability are essential.

We have compiled terms used in meetings related to FPC manufacturing. Please use it as an introductory mini-dictionary and an offline search tool.

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  • Printed Circuit Board

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宇宙環境試験に係る業務委託契約締結について.jpg

Press Release from Taiyo Techno Rex: Regarding the Conclusion of a Business Outsourcing Contract for Space Environment Testing

~Starting the demonstration of high-reliability FPC through space environment testing~ Taiyo Techno Rex Co., Ltd. has recently signed a business outsourcing contract with Jinsei Co., Ltd. regarding the space environment testing of our space-use FPC (Flexible Printed Circuit) cables. Our FPC will be mounted on the engineering model of the small satellite "Cubesat" developed by Jinsei, and various tests simulating the space environment will be conducted. This testing is an important initiative aimed at confirming and demonstrating functionality in future orbital operations. In outer space, resistance to extremely harsh conditions such as extreme temperature changes, radiation, and intense vibrations is required. We view this initiative not only as limited to space applications but also as an opportunity to demonstrate FPC technology that exhibits high reliability even under extreme conditions. Moving forward, we will continue to develop and provide high-reliability FPCs with an eye toward expanding into a wide range of fields, including aerospace, industrial equipment, automotive devices, and various inspection equipment, where high quality and reliability are essential.

We welcome inquiries and consultations regarding flexible procurement challenges! We respond to various requests, including halogen-free types. We cater to everything from digital cameras to the aeros...

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other electronic parts

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出展案内_JPCAshow2025.png

【TTL_Exhibition Participation Information】JPCAShow2025 'Newly Developed Topics.'

◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots

Contributes to accident analysis! No image degradation, clear night vision, ultra-long distance wiring possible.

  • Surveillance Cameras
  • Surveillance Camera System
  • High Speed Camera

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From high-frequency applications to the design, manufacturing, evaluation testing, and analysis reports of flexible printed circuit boards with various characteristics!

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  • Printed Circuit Board

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出展案内_JPCAshow2025.png

【TTL_Exhibition Participation Information】JPCAShow2025 'Newly Developed Topics.'

◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots

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