List of all products
136~180 item / All 585168 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
<Column demonstration in progress> Analyzing aggregate and drug-antibody ratio (DAR) using SEC column and HIC column.
- Chromatographic resins and packing materials
We have launched a video distribution site for pharmaceutical companies.
We are distributing topics that are particularly noteworthy in the biopharmaceutical industry in an on-demand video format. We will regularly update the latest videos, so please take this opportunity to watch them. 【Register to view here】 *Please copy the URL and watch it in your browser. https://portal.stream.jp/eqk212ojxt
Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).
- Other semiconductor manufacturing equipment
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.
- Wafer processing/polishing equipment
It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.
- Bonding Equipment
Both upper and lower surfaces can be UV irradiated. Even with an affordable version that is easy to use, we thoroughly pursue cost-effectiveness (effectiveness) in curing.
- Other semiconductor manufacturing equipment
Notice of Participation in "Semicon Japan 2018"
We will be exhibiting at "SEMICON Japan 2018," which will be held at Tokyo Big Sight in December 2018! We will be participating in the "SEMICON Japan 2018 (Back-End & General Zone)." ▼ Exhibited Products - "Ultrasonic Cutting Device CSX-400 Series" - "Chip 6-Sided Appearance Inspection Device CI-4000" - "Ultra-Low Load Compatible Flip Chip Bonder CB-600" - "Tabletop LED Light Source UV Irradiation Device" We sincerely invite you to visit our booth during this opportunity. 【Date】 December 12 (Wednesday) - 14 (Friday), 2018 10:00 AM - 5:00 PM 【Venue】 Tokyo Big Sight, East Exhibition Hall, Conference Hall 【Booth Number】 2009
Remove stubborn foreign substances such as grease, ink, glue, adhesive debris, dust, and dirt that remain on the work surface! Customizable to fit your work size!!!
- Printed Circuit Board
- lens
- LCD display
Inspection device for verifying the sealing of bags using air cylinder pressurization, designed for the food and pharmaceutical industries!
- Printed Circuit Board
- lens
- LCD display
Elimination of visual inspection for automotive semiconductor ICs! High-precision defect inspection with 3D/2D dimensional inspection.
- Visual Inspection Equipment
- Other inspection equipment and devices
We have achieved high-speed measurements of a wide range on the order of several tens of mm with sub-micron level measurement accuracy.
- 3D measuring device
No resin embedding! Achieving efficiency in cross-section sample preparation without the need for skills. Contributing to the efficiency of SEM observation. 'Ultrasonic Cutting Device CSX-100Lab'
- Analytical Equipment and Devices
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
A compact LED curing device that can be used on a tabletop. It can emit light from both the top and bottom, and its affordable price is also attractive! *Demo units available for loan.
- Other semiconductor manufacturing equipment
300mm square compatible model. Can be linked with loaders and unloaders for mass production. Made by Unitec Japan.
- Soldering Equipment
- Reflow Equipment
Standard model that achieves high-reliability mounting such as fluxless, void-free, and lead-free. Made by Unitec Japan.
- Soldering Equipment
- Reflow Equipment
Standard model achieving high-reliability assembly such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.
- Soldering Equipment
- Reflow Equipment
This is an annealing furnace that can be applied to a wide range of applications requiring rapid and uniform heat treatment, including the crystal growth of GaN. Manufactured by Unitemp Japan.
- Soldering Equipment
- Heating device
For the efficiency of asset, process, and logistics management. We offer models that allow reading and data processing to be completed at your fingertips.
- PDAs and handheld terminals
- others
A high-performance product that combines large capacity. Ideal for adhesive applications on materials with high dielectric constants, such as cardboard, plastic, and glass.
- IC tag reader/writer
- IC tag
We have achieved high-quality cut surfaces without burrs, dust, cutting debris, or warping through our unique ultrasonic cutting technology, which significantly reduces cutting load.
- Capacitor
Introduction to Ultrasonic Application Devices / Welding, Joining, and Cutting Methods [Online Seminar]
【Overview】 Date and Time: September 25 (Friday) 10:00 AM - 11:00 AM (Registration starts at 9:30 AM) Theme: Introduction to Adwells' Ultrasonic Application Devices / Welding, Joining, and Cutting Techniques Content: - Welding: A new technology for continuously welding CFRTP using ultrasonic waves. We will introduce applicable applications including processing examples and existing methods. - Joining: We will present technologies that solve challenges in metal joining for product development. - Cutting: We propose ultrasonic cutting for high-precision cutting of high-performance materials. It can cut rubber, resin, green sheets, etc., with high precision and without dragging burrs. - Seminar Participation Registration URL: https://www.nissei.co.jp/machinery - Product Overview Introduction Pages Ultrasonic Joining Device: http://ma.imsys.jp/r/1272880?m=0000&c=00000000 Ultrasonic Welding Device: http://ma.imsys.jp/r/1272879?m=0000&c=00000000 Ultrasonic Cutter: http://ma.imsys.jp/r/1272881?m=0000&c=00000000
A cleaning machine compatible with GMP, FDA, and EHEG that can accommodate detailed requests (for pharmaceutical manufacturing equipment) *Demo available (Atec Japan)
- Other cleaning machines
An inlay with a compact and ideal shape, perfect for supply chains in apparel, electronics, retail, logistics, and more.
- IC tag reader/writer
A Comprehensive Explanation of the Benefits and Applications of Formic Acid Reduction (Manufactured by Unitec Japan)
- Annealing furnace
Ultrasonic assisted spindle equipped with a dual-end support mechanism that enables high-speed, high-precision cutting, improving productivity and quality - Ultrasonic dicing device!!
- Ultrasonic Oscillator
- Other cutting tools
- Other processing machines
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
Manual flip chip bonder suitable for small-scale production and various experiments.
- Bonding Equipment
Equipped with an option to record body temperature! Easily manage everything from clocking in and out to individual and task-specific work achievements.
- Other measurement, recording and measuring instruments
- Entrance and exit control system
- Other image-related equipment
It is a dust removal device suitable for both inline and outline applications. We offer a range from 2 to 5 units.
- Printed Circuit Board
Dust removal device compatible with thin plates. Equipped with a magnetic gear in the drive unit! This single unit can accommodate a wide range of substrate thicknesses.
- Printed Circuit Board
- LCD display
- Other semiconductor manufacturing equipment
Ideal for automating heating and drying processes! Reduces heat dissipation and temperature rise around the furnace body, contributing to energy savings! Provides a heating device with high uniformity...
- Heating device
Contributing to the automation of heating processes! This heating method has a short heating time and allows for profile creation.
- Heating device
- Drying Equipment
- others
A rich lineup is available! Demonstrations of inkjet coating equipment and a well-equipped coating test environment are provided.
- Painting Machine
- Other surface treatment equipment
Before considering or purchasing inkjet evaluation machines and mass production equipment, for those who wish to conduct a test once, and for customers who have been evaluated by other companies but w...
- Processing Contract
- Other contract services
Semi-auto FCB (Flip Chip Bonder) that meets a wide range of user needs.
- Assembly Machine
- Other semiconductor manufacturing equipment
The blue light blue laser is changing the world of soldering! The "BLES system" achieves soldering without flux, which has been difficult until now.
- Soldering Equipment
Business improvement solutions for promoting DX and IoT implementation: Inventory management system using RFID.
- IC tag
Sensor/IoT/AI Technology Exhibition 2024
Nippon Seiki Co., Ltd. will exhibit at the "Sensor/IoT/AI Technology Exhibition 2024" to be held on Friday, August 30, 2024. ≪Overview of the Sensor/IoT/AI Technology Exhibition 2024≫ Date: Friday, August 30, 2024 Time: 10:30 AM - 4:30 PM Venue: Osaka Industry Creation Center 1-4-5 Honmachi, Chuo-ku, Osaka 541-0053 Booth Number: 4th Floor, No. 17 Admission Fee: Free (Pre-registration required) ■Main Exhibits 【DX Support Tools】 ・Item management solution using RFID Contributes to "solving labor shortages" and "improving productivity" by reducing search and inventory times. Experience overwhelming work speed! ・Vibration diagnosis system using Smart Tag Remote monitoring of machinery and equipment using Smart Tag (vibration sensor). Immediate observation of equipment with color display based on thresholds, allowing for constant remote monitoring of whether machinery is operating stably! Both will be demonstrated live! We sincerely look forward to your visit.
[Business Improvement Solutions for Promoting DX and IoT] Tool and Equipment Management System Utilizing RFID
- IC tag
Sensor/IoT/AI Technology Exhibition 2024
Nippon Seiki Co., Ltd. will exhibit at the "Sensor/IoT/AI Technology Exhibition 2024" to be held on Friday, August 30, 2024. ≪Overview of the Sensor/IoT/AI Technology Exhibition 2024≫ Date: Friday, August 30, 2024 Time: 10:30 AM - 4:30 PM Venue: Osaka Industry Creation Center 1-4-5 Honmachi, Chuo-ku, Osaka 541-0053 Booth Number: 4th Floor, No. 17 Admission Fee: Free (Pre-registration required) ■Main Exhibits 【DX Support Tools】 ・Item management solution using RFID Contributes to "solving labor shortages" and "improving productivity" by reducing search and inventory times. Experience overwhelming work speed! ・Vibration diagnosis system using Smart Tag Remote monitoring of machinery and equipment using Smart Tag (vibration sensor). Immediate observation of equipment with color display based on thresholds, allowing for constant remote monitoring of whether machinery is operating stably! Both will be demonstrated live! We sincerely look forward to your visit.
Lasers can be selected from three types: CO2, YVO4, and UV, depending on the application! Equipped with a 3D laser marker that can mark large areas with high quality.
- Laser marker
The long-awaited UHF band RFID reader/writer has been released by Takaya Co., Ltd.
- IC tag reader/writer
This is a compact outdoor antenna compatible with 5G Sub6/local 5G.
- Other network tools
Compatible with installation on metal surfaces! Long types of 10m and 15m are also available.
- Other network tools
Temperature measurement and water leak detection available right now! With this set, you can verify immediately; it's a starter kit like that.
- Other temperature and humidity measuring instruments
From livelihood machinery to industrial equipment! Connecting and integrating the strengths of each business location across a wide range of fields through a network!
- EMS
An affordable and easily implementable simple package. Experience the convenience of RFID with ease and identify operational improvements.
- IC tag
By conducting a complete visual inspection of the chips before implementation, we can reduce losses in subsequent processes and improve yield! Ideal for acceptance inspection and screening in module a...
- Semiconductor inspection/test equipment
It's not just a fish box; its use is expanding not only for packaging and shipping purposes but also as a functional product.
- tray
- container
- Other packaging materials
Support from lens design, capable of producing from small lots of one piece to mass production of thousands of pieces.
- Glass
A compact LED curing device that can be used on a tabletop. It offers irradiation capabilities and is attractively priced! *Demo units available for loan.
- Other semiconductor manufacturing equipment