List of Electronic Components and Modules products

Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

• Other conveying machines

By combining parts, it is possible to produce large pallets of 2m x 4m size. Even if damaged, partial replacement is possible, making it economical. *Available from a single piece.

• palette

Supporting high-bandwidth communication and contributing to the evolution of medical devices.

• Board to Board Connectors
• connector
• connector

Supports stable transmission of robotics control signals!

• Board to Board Connectors
• connector
• connector

High-speed, high-density internal wiring solutions that support real-time data processing.

• Board to Board Connectors
• connector
• connector

Achieving low latency and supporting AI and machine learning applications.

• Board to Board Connectors
• connector
• connector

A high-speed data transfer connector that supports AI/ML computation acceleration.

• Board to Board Connectors
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• connector

Connectors for internal wiring that support high-speed signal transmission.

• Board to Board Connectors
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• connector

AI/ML-compatible connectors that support high-speed connections in data centers.

• Board to Board Connectors
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• connector

Contributing to the improvement of medical device performance through high-precision signal transmission.

• Board to Board Connectors
• connector
• connector

A board-to-board connector that achieves highly reliable high-speed transmission.

• Board to Board Connectors
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• connector

Next-generation connector solutions that accelerate the efficiency of smart cities.

• Board to Board Connectors
• connector
• connector

Achieve immersive AR/VR experiences with high-speed transmission.

• Board to Board Connectors
• connector
• connector

High-speed transmission solution directly connected to the chip to enhance responsiveness.

• Board to Board Connectors
• connector
• connector

Next-generation connector that achieves bandwidth expansion without a PCB.

• Board to Board Connectors
• connector
• connector

Output high-speed signals directly without going through the PCB!

• Board to Board Connectors
• connector
• connector

High-speed data transmission solutions that support real-time processing.

• Board to Board Connectors
• connector
• connector

Outputs high-speed signals without PCB. Supports the decentralization of edge computing.

• Board to Board Connectors
• connector
• connector

Connector directly connected to the circuit board that supports high-speed processing of AI/ML.

• Board to Board Connectors
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• connector

A direct two-chip solution that enables low-latency communication.

• Board to Board Connectors
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• connector

Achieving high density! Outputting high-speed signals without a PCB.

• Board to Board Connectors
• connector
• connector

High-density, slim PCIe connection solution that enhances SI performance.

• Board to Board Connectors
• connector
• connector

High-density, thin SI performance connections that support immersive experiences.

• Board to Board Connectors
• connector
• connector

High-density, slim connection solutions that support game graphics performance.

• Board to Board Connectors
• connector
• connector

A high-density, thin-profile connection solution that supports monitoring systems in manufacturing sites.

• Board to Board Connectors
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• connector

High-density, thin SI solutions that support the acceleration of financial transactions.

• Board to Board Connectors
• connector
• connector

Connection solutions that support the acceleration and high density of medical image processing.

• Board to Board Connectors
• connector
• connector

High-density, thin SI performance connections that support real-time processing.

• Board to Board Connectors
• connector
• connector

Achieving the required SI performance for distributed processing in a compact and thin design.

• Board to Board Connectors
• connector
• connector

High-density, thin solutions that achieve low latency in the communications field.

• Board to Board Connectors
• connector
• connector

High-density, thin SI performance connections that support parallel processing in HPC.

• Board to Board Connectors
• connector
• connector

High-density solutions for AI/ML computations that interconnect with SI performance.

• Board to Board Connectors
• connector
• connector

High-density, thin-profile SI performance solutions that support the acceleration of data centers.

• Board to Board Connectors
• connector
• connector

We offer free samples! Self-adhesive type allows for wiring protection even after installation! Reduces construction time!

• Other cable related products
• tube

Second source product of Toshiba's 1SS344.

• Transistor

A conductive gasket that can be easily mounted to the housing with a fixed part in a pointed arrow shape.

• Other electronic parts

1SS400 substitute | Stable supply of SOD-523 small switching diodes

• Transistor

Gate processing is not required.

• Other electronic parts

1SS355 substitute｜Stable supply of SOD-323 switching diodes

• Transistor

Copper SMT heat sink optimal for heat dissipation measures of small power semiconductors.

• Other semiconductors

Supports a wide range of PTFE and non-PTFE materials. Achieves cost optimization with a hybrid structure with FR-4.

• Circuit board design and manufacturing

Recovering circuit boards from physical samples even in case of manufacturing data loss. We also support the creation of schematics/BOM for multilayer boards and assembled boards.

• Circuit board design and manufacturing

Designers who are well-versed in the manufacturing process are in charge. They also handle SI/PI/EMI simulations and CAM data conversion.

• Circuit board design and manufacturing

Supports up to 10 layers for the rigid part and 6 layers for the flexible part. For wearable camera modules.

• Circuit board design and manufacturing

Alumina (Al2O3) and aluminum nitride (AlN) compatible. High thermal conductivity substrate for IGBT and power devices.

• Circuit board design and manufacturing

Outer layer maximum 762μm, inner layer 381μm. Compatible with copper inlay and copper core. For EV chargers and power semiconductors.

• Circuit board design and manufacturing