List of Electronic Components and Modules products
- classification：Electronic Components and Modules
4231～4275 item / All 59438 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
https://cmcre.com/archives/140874/
- Technical and Reference Books
- Lithium-ion battery
- Secondary Cells/Batteries
5/14 Webinar on Performance Degradation and Lifetime Evaluation of General-purpose Lithium-ion Batteries
■Title: "Performance, Degradation, and Lifetime Evaluation of General-purpose Lithium-ion Batteries – Including Detailed Electrochemical Analysis of Each Electrode and Battery –" ――This practical content is useful for practitioners involved in research, design, quality evaluation, and reuse inspection, covering materials and characteristics of practical batteries, Li deposition evaluation methods, interface control, and safety measures. ■ Date and Time: May 14, 2026 (Thursday) 10:30 AM – 4:30 PM ■ Zoom Distribution (with materials) ■ Required Background Knowledge ・Basic knowledge of general chemistry, introduction to electrical and electronic engineering, thermodynamics, and kinetics ■ Knowledge Gained from the Seminar - Fundamental characteristics of battery reactions - Evaluation of charge and discharge characteristics - Various DC evaluation methods - AC impedance measurement methods - Characteristics of current general-purpose batteries - Performance degradation of batteries and its mechanisms - Evaluation methods for degradation level and lifetime prediction - Ensuring battery performance
The latest version summarizing changes in domestic and international laws, regulations, and standards from 2023 to 2025, divided into chapters!
- Lithium-ion battery
- Technical and Reference Books
- Secondary Cells/Batteries
5/14 Webinar on Performance Degradation and Lifetime Evaluation of General-purpose Lithium-ion Batteries
■Title: "Performance, Degradation, and Lifetime Evaluation of General-purpose Lithium-ion Batteries – Including Detailed Electrochemical Analysis of Each Electrode and Battery –" ――This practical content is useful for practitioners involved in research, design, quality evaluation, and reuse inspection, covering materials and characteristics of practical batteries, Li deposition evaluation methods, interface control, and safety measures. ■ Date and Time: May 14, 2026 (Thursday) 10:30 AM – 4:30 PM ■ Zoom Distribution (with materials) ■ Required Background Knowledge ・Basic knowledge of general chemistry, introduction to electrical and electronic engineering, thermodynamics, and kinetics ■ Knowledge Gained from the Seminar - Fundamental characteristics of battery reactions - Evaluation of charge and discharge characteristics - Various DC evaluation methods - AC impedance measurement methods - Characteristics of current general-purpose batteries - Performance degradation of batteries and its mechanisms - Evaluation methods for degradation level and lifetime prediction - Ensuring battery performance
For environmental monitoring in clean rooms. Simultaneous measurement of CO2, temperature, humidity, and differential pressure.
- Other electronic parts
Multifunctional sensor module supporting quality control in food processing.
- Other electronic parts
Optimize the data center environment! Contributing to energy savings and stable operation.
- Other electronic parts
A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!
- Technical and Reference Books
- Other semiconductors
5/15 Webinar "Changes in Joint Structures and Packaging Solutions Due to the Evolution of Semiconductors"
■ Title: "Changes in Joint Structures and Packaging Correspondence Due to the Evolution of Semiconductors - Response of Resin Sealing Technology to the Increase in the Number of Joint Locations and Narrow Spacing -" ――Organizing the core of joint design and sealing technology essential for the WLP and 3D assembly era. Covering failure mechanisms and countermeasures associated with high integration, providing insights directly related to development, evaluation, and mass production challenges. ■ Date and Time: May 15, 2026 (Friday) 13:00 - 16:30 ■ Zoom Streaming (with materials) 【Knowledge Gained from the Seminar】 - Development history and trends of semiconductor packaging - Changes in semiconductor joint structures and the current status of packaging technology - Evolution of semiconductor packaging and the development history, challenges, and countermeasures of resin sealing technology 【Target Audience for the Seminar】 - Stakeholders in the semiconductor-related fields (sales, technical positions, etc.) - Individuals interested in semiconductor manufacturing technology (front-end, back-end, etc.) - Those interested in the evolution of semiconductor packaging and the corresponding packaging technology - Individuals interested in semiconductor integration = bonding technology (Bumping Technology)
![[For Medical Institutions] CO2/Temp...](https://image.mono.ipros.com/public/product/image/149708/IPROS8039959363901089647.jpeg?w=280&h=280){kind=small}
Adoption of NDIR method! Monitoring air quality in medical settings.
- Other electronic parts
![[Agricultural] CO2/Temperature/Humi...](https://image.mono.ipros.com/public/product/image/149708/IPROS1378035773123380954.jpeg?w=280&h=280){kind=small}
Adopts NDIR method! Ideal CO2/temperature and humidity/differential pressure sensor for agricultural environmental control.
- Other electronic parts
![[Agricultural] CO2/Temperature/Humi...](https://image.mono.ipros.com/public/product/image/149708/IPROS2185045134294173163.jpeg?w=280&h=280){kind=small}
Adopts NDIR method! Ideal CO2/temperature and humidity/differential pressure sensor for agricultural environmental control.
- Other electronic parts
NDIR method adopted! Ideal digital sensor module for ventilation control and air conditioning management.
- Other electronic parts
Super low dielectric with a dielectric constant of 2.2! Using lower-cost materials compared to current low dielectric materials.
- Other films and sheets
- Other consumables
- Other cable related products
The adhesion strength of the copper foil is Max. > 20N/cm! Due to excellent workability, process costs can be reduced.
- Other films and sheets
- Other consumables
- Other cable related products
Can also be used as adhesives or substrates! Introduction to flat cable materials.
- Other films and sheets
- Other consumables
- Other cable related products
Supporting the transport of precision electronic components with Japan's manufacturing wisdom and China's abundant supply capabilities.
- Other semiconductors
- Conveyor
- Conveyor
Control of IO-Link master via RS485 communication.
- Converters and Transducers
- Other process controls
- Other FA equipment