List of Measurement and Analysis products
- classification：Measurement and Analysis
6166～6210 item / All 52910 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
If you do not perform a proof test, it can also be used as a regular winding machine!
- Tester
- Testing Equipment and Devices
Evaluation of the spatial resolution of the display! Quantifying the clarity level of images perceived by humans.
- Optical Measuring Instruments
Here we are, Introduction Seminar for MTF Measurement Devices for Next-Generation Displays
What is the latest display MTF measurement device (DT-8031) that can measure everything from the selection of decorative films to the resolution of aerial images? Recently, a method called line-based measurement has been proposed and put into practical use by Dr. Masaoka from the NHK Foundation as a means to measure display resolution (MTF). It has been found that this method demonstrates the highest performance in both measurement accuracy and measurement time at this point in time. It is currently under discussion as an MTF measurement method by the international organization IEC62977-3-6 and is steadily progressing towards standardization. In this seminar, we will introduce variations of accurate MTF measurement, incorporating measurement examples of decorative film evaluation and aerial image measurement using the DT-8031 equipped with the line-based method, focusing on subjects that have been difficult to measure until now.
AI monitors and diagnoses the motor 24 hours a day. It is a solution that eliminates the need for threshold management and reduces false alarms.
- Other safety equipment
- Analytical Equipment and Devices
- Other motors
Evaluation software available for loan. The three-dimensional color space is sliced at brightness intervals, stretched onto a plane, and arranged in a linked manner! *Visualizing the three-dimensional...
- Optical Measuring Instruments
We are currently offering a comprehensive catalog featuring a variety of explosion-proof and cleanroom static electricity removal devices! Detailed explanations of industrial static electricity manage...
- EMC/Static electricity measuring equipment
- power supply
- Other clean room equipment and facilities
We are offering a comprehensive catalog of static electricity removal devices! This is a complete series of static electricity removal devices for industrial and cleanroom environments!
- EMC/Static electricity measuring equipment
- power supply
- Other clean room equipment and facilities
It describes the measurement methods for the wettability (dynamic values) of all types of surfaces.
- Analytical Equipment and Devices
Fully automatic measurement device for water contact angle. It measures surface energy (wettability) as a replacement for the dyne value.
- Analytical Equipment and Devices
- Other inspection equipment and devices
It features a water-based formulation that takes into account the safety of the human body and the environment. Surface energy testing has become safer and easier than ever before.
- Other measurement, recording and measuring instruments
High-speed, easy, accurate, non-destructive surface contact angle analysis device. It measures surface energy (wetting properties) as a substitute for the dyne value.
- Analytical Equipment and Devices
- Other measurement, recording and measuring instruments
Inline non-contact type
- Other electronic measuring instruments
Free demo unit available for loan: MSJ5000 dedicated monitoring device for alignment marks.
The position misalignment of transparent varnish used in label printing can be monitored with this dedicated registration mark monitoring device for transparent varnish, allowing for precise monitoring of the varnish printing position. By simply adopting this special camera that can detect the registration marks of transparent varnish, monitoring of the varnish registration becomes possible! In today's globalized market, maintaining printing competitiveness requires powerful equipment that aids in achieving the highest printing speeds, minimizing waste, reducing time, and improving print quality. The Video Web MSJ5000 is the system for that purpose. This sophisticated yet affordable transparent varnish registration monitoring device is compatible with label printing machines and narrow or wide webs.
Techmach is a globally renowned manufacturer in the processing industry.
- Distance measuring device
Adoption of a small sensor probe! The inspection targets can also include low carbon steel plates and high tensile steel plates.
- Other inspection equipment and devices
- probe
- Defect Inspection Equipment
It is a waterproof temperature logger from the "M831TB-85G series." The surrounding area is coated with food-grade silicone.
- Data Logger
Evaluation of communication performance and efficiency improvement in quality control during mass production inspection! Overwhelming speed and accuracy!
- Other inspection equipment and devices
Easily check the phase sequence and missing phase at a glance! No battery required as it is powered from the measurement target.
- Other inspection equipment and devices
Easily and clearly confirm the cables needed for network construction!
- Other cable related products
- Other measurement, recording and measuring instruments
For full circumference inspection of bottle printing! Compatible with screen printing! Supports transparent and colored bottles.
- Visual Inspection Equipment
Achieved finishing processing of irregularly shaped materials that are difficult to fix with a flatness accuracy of 0.05!
- 3D measuring device
- Processing Contract
This is a list of devices used for analysis, evaluation, and testing services at AITES.
- Contract Analysis
Reverse bias test of power devices (up to 2000V)
At Aites Co., Ltd., high-temperature reverse bias testing (HTRB) for evaluating the oxide film and junction of power devices can be applied up to a maximum of 2000V. By monitoring the leakage current during the test, the degradation status of the device can be grasped in real-time. Since the power supply is independent, if one device fails during the test, it will not affect the other devices. Additionally, it is possible to set a failure criterion (current value) and to cut off the power supply to the device deemed faulty at the time of failure judgment. 【Specifications and Service Details】 ■ Test Voltage: Up to a maximum of DC 2000V ■ Applied Current: Up to a maximum of 14mA ■ Number of Test Devices: Up to a maximum of 8 (independent power supply) ■ Compatible Modules: TO-247, TO-220, etc. (other packages require consultation regarding connection methods) ■ Measurement Content: Monitoring of leakage current ■ Temperature Range: Up to a maximum of 200°C (85°C/85% in high temperature and high humidity conditions)
TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and...
- Contract Analysis
- Other semiconductors
- Other contract services
Announcement of the introduction of Talos F200E
Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which accumulates multiple frames while correcting for drift.
We provide latch-up testing services to evaluate the resistance of CMOS ICs and semiconductor products containing them to latch-up destruction.
- Contract Inspection
- Other contract services
- Other inspection equipment and devices
Some overseas manufactured parts and products may have quality issues. We provide quality evaluation services for reliability testing and assessment for these.
- Contract Inspection
- Testing Equipment and Devices
- Other inspection equipment and devices
Cryogenic ion milling cross-section processing example (rubber products)
We will introduce a case where cross-sections were created and observed by method regarding the adhesive parts of the tires of pull-back cars. When conducting SEM observations of the created cross-sections, fillers present inside the rubber were confirmed. It was found that the dispersion state of the fillers and the condition of the adhesive interface were not clear with fracture by liquid nitrogen or mechanical polishing. In contrast, the cross-sections created by cryo ion milling allow for clear observation of the dispersion state of the fillers contained within the rubber and the condition of the adhesive interface with the plastic substrate.
By conducting two analyses, it is possible to obtain more detailed and accurate results!
- Vibration Testing
Introduction to Micro FT-IR
At Aites Co., Ltd., we have newly introduced "Microscopic FT-IR" this fiscal year. The "Microscopic FT-IR," which combines FT-IR and optical microscopy, allows for the measurement of tiny substances on the order of several tens of micrometers, which are difficult to measure with conventional FT-IR, using an aperture (field of view diaphragm). There are three main measurement methods for Microscopic FT-IR: "transmission method," "reflection method," and "ATR method." While the transmission method is the basic measurement method in Microscopic FT-IR measurements, the reflection method or ATR method may be more suitable depending on the shape of the sample and the feasibility of sampling.
It is possible to investigate components that cannot be identified by spectroscopy alone, as well as trace additives that cannot be detected!
- Analytical Equipment and Devices
- Spectroscopic Analysis Equipment
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
Important analysis items for performance evaluation and quality control of functional materials! Evaluation of pore size and pore distribution of non-woven sheets and membrane materials.
- Analytical Equipment and Devices
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
Observing the conductive particles from the planar direction and the cross-sectional direction! A case study confirming the degree of deformation.
- Analytical Equipment and Devices
Observation of Conductive Particle Shape in COG Implementation
We will introduce the observation of the shape of conductive particles in COG implementation. ICs and liquid crystal panels are implemented using the COG method with ACF (anisotropic conductive film). A resin ball is used as the core, and a metal layer (such as nickel or gold) for conductivity is deposited on its surface. During connection, the particles deform appropriately to electrically connect the IC and the panel. To confirm the degree of particle deformation and connection status, cross-sectional observations were conducted, revealing that the particle deformation was at a "medium" level, indicating an appropriate degree of deformation. By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. Please feel free to contact us for any inquiries regarding panel-related defects.
Sample 1, including comparison with Ref! Summarize and conduct candidate analytical methods.
- Contract Analysis
Analysis of organic-inorganic composite materials using FT-IR and EDX.
We will introduce an example of analyzing organic-inorganic composite materials using FT-IR and SEM-EDX. FT-IR measurements were conducted on the glossy and non-glossy areas of a PET bottle label, and the IR spectra differed between the glossy and non-glossy areas. Since the non-glossy area resembles the spectrum of acrylic resin, it is considered that the main component is acrylic resin. Additionally, SEM-EDX measurements were performed on both the glossy and non-glossy areas, and EDX spectra and backscattered electron images were obtained, revealing that the non-glossy area contained sulfur (S) and barium (Ba), which were not detected in the glossy area.
Observations before and after reliability testing and cross-sectional observations! Here are examples of observations of various implemented components.
- Analytical Equipment and Devices
Evaluation of various implementation substrates
At Aites Co., Ltd., we provide a wide range of technical services for evaluation tests of printed circuit boards (mounted boards) equipped with electronic components. We conduct reliability tests, solder joint observations, whisker observations, and cross-sectional observations. We have IPC-A-610 certified IPC specialists on staff who can assist with observations in accordance with international standards, consultations, and various observation-related concerns. Additionally, we offer services such as X-ray observations, appearance inspections, and shape measurements, so please feel free to consult with us when needed.
This year, we are introducing new additions! We will introduce the features of the three basic measurement methods.
- Other microscopes
Analysis of organic-inorganic composite materials using FT-IR and EDX.
We will introduce an example of analyzing organic-inorganic composite materials using FT-IR and SEM-EDX. FT-IR measurements were conducted on the glossy and non-glossy areas of a PET bottle label, and the IR spectra differed between the glossy and non-glossy areas. Since the non-glossy area resembles the spectrum of acrylic resin, it is considered that the main component is acrylic resin. Additionally, SEM-EDX measurements were performed on both the glossy and non-glossy areas, and EDX spectra and backscattered electron images were obtained, revealing that the non-glossy area contained sulfur (S) and barium (Ba), which were not detected in the glossy area.
It is possible to process with approximately twice the width! This significantly expands the previously localized observation range.
- Processing Contract
- Other measurement, recording and measuring instruments
Cryogenic ion milling cross-section processing example (rubber products)
We will introduce a case where cross-sections were created and observed by method regarding the adhesive parts of the tires of pull-back cars. When conducting SEM observations of the created cross-sections, fillers present inside the rubber were confirmed. It was found that the dispersion state of the fillers and the condition of the adhesive interface were not clear with fracture by liquid nitrogen or mechanical polishing. In contrast, the cross-sections created by cryo ion milling allow for clear observation of the dispersion state of the fillers contained within the rubber and the condition of the adhesive interface with the plastic substrate.
It is possible to visualize the distribution of substances within the specified plane! Suitable for evaluating the diffusion state of substances, etc.
- Other measurement, recording and measuring instruments
Micro FT-IR imaging measurement
We would like to introduce the "Microscopic FT-IR Imaging Measurement" that we conduct. It allows for the visualization of the distribution of substances as a two-dimensional image within a specified plane. It becomes possible to evaluate changes in the distribution of substances that are difficult to assess with regular point measurements through visual images.
We investigated the behavior of strain during moisture absorption and drying using a strain gauge!
- Contract measurement
Strain measurement of power module package resin.
We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, both in the mounted state on a circuit board and in the unmounted state. In the mounted module, a slight delay in temperature change was observed, and correspondingly, the change in strain also appeared to be delayed. This is believed to be due to the slower transfer of heat to the module when it is mounted. At Aites, we conduct temperature cycle tests and temperature-humidity cycle tests, during which we can simultaneously measure the strain occurring in the mounted components. Please feel free to consult with us.
We are equipped with a variety of devices to meet your needs, including dimension measurement of various parts and surface roughness measurement!
- Visual Inspection Equipment
- Other measurement, recording and measuring instruments
- Other contract services
Observation of thermal deformation using a 3D shape measuring machine (VR-6200)
This is a measuring device that can non-contact measure surface shapes such as concavities, undulations, and surface roughness. We will introduce "heating deformation observation" using a 3D shape measuring machine. First, we acquire a 3D texture image at room temperature, and then we acquire a 3D texture image in the heated state. By overlaying the texture images before and after heating and checking the differential texture image and cross-sectional profile, it can be seen that the substrate in the heated state has higher ends and a lower center compared to the room temperature state.
To accurately measure strain in a tensile test, measurement using a strain gauge is necessary!
- Testing Equipment and Devices
- Other Testing Contract
Poisson's ratio measurement
At Aites Co., Ltd., we conduct "Poisson's ratio measurement." Poisson's ratio is the ratio of longitudinal to lateral strain that occurs when a load is applied to an object, and it is necessary for strength calculations of materials. In the downloadable materials, we introduce the results of attaching strain gauges to test specimens, applying tensile loads using a universal testing machine, and examining the longitudinal and lateral strains obtained from the strain gauges. Please feel free to download and take a look.
By combining the VR-6200 with the heater stage, it becomes possible to visualize changes during heating.
- Contract Inspection
Observation of thermal deformation using a 3D shape measuring machine (VR-6200)
This is a measuring device that can non-contact measure surface shapes such as concavities, undulations, and surface roughness. We will introduce "heating deformation observation" using a 3D shape measuring machine. First, we acquire a 3D texture image at room temperature, and then we acquire a 3D texture image in the heated state. By overlaying the texture images before and after heating and checking the differential texture image and cross-sectional profile, it can be seen that the substrate in the heated state has higher ends and a lower center compared to the room temperature state.
We provide quick and accurate solutions based on technology and experience for quality initiatives that consider performance, reliability, disposal, and recycling from the product planning stage.
- Contract Analysis
- Contract Inspection
- Analytical Equipment and Devices
Evaluation of various implementation substrates
At Aites Co., Ltd., we provide a wide range of technical services for evaluation tests of printed circuit boards (mounted boards) equipped with electronic components. We conduct reliability tests, solder joint observations, whisker observations, and cross-sectional observations. We have IPC-A-610 certified IPC specialists on staff who can assist with observations in accordance with international standards, consultations, and various observation-related concerns. Additionally, we offer services such as X-ray observations, appearance inspections, and shape measurements, so please feel free to consult with us when needed.
In-Situ Continuous Measurement Reliability Evaluation Testing Service
- Contract Inspection
- Testing Equipment and Devices
- Other inspection equipment and devices
Observation of substrate deformation using a 3D shape measuring device (VR-6200)
I would like to introduce "Observation of Substrate Deformation Using a 3D Shape Measuring Machine." By applying pressure to the PCB substrate, referencing bending tests of plastics and PCB substrates, the change in state is measured using a 3D shape measuring machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure.
We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.
- Contract Analysis
- Transistor
- Analytical Equipment and Devices
Announcement of the introduction of Talos F200E
Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which accumulates multiple frames while correcting for drift.
By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.
- Contract Analysis
- Other contract services
- Contract measurement
Cryogenic ion milling cross-section processing example (rubber products)
We will introduce a case where cross-sections were created and observed by method regarding the adhesive parts of the tires of pull-back cars. When conducting SEM observations of the created cross-sections, fillers present inside the rubber were confirmed. It was found that the dispersion state of the fillers and the condition of the adhesive interface were not clear with fracture by liquid nitrogen or mechanical polishing. In contrast, the cross-sections created by cryo ion milling allow for clear observation of the dispersion state of the fillers contained within the rubber and the condition of the adhesive interface with the plastic substrate.
It is possible to observe cross-sections while observing FIB processing in real time.
- Contract Analysis
- Other contract services
- Electron microscope
Power device failure location / Slice & View three-dimensional reconstruction
I will introduce the three-dimensional reconstruction of failure locations using the Slice & View function of FIB-SEM. Continuous SEM images of the structure are obtained, and the resulting images are corrected for positional misalignment between the SEM images and visualized in three dimensions using 3D construction software (Avizo). By combining the position identification technique for cross-sectioning the failure location with the Slice & View function, it is possible to obtain continuous SEM images that retain the defective state and include information before and after the abnormal area.
We conduct reliability evaluation tests for various electronics products, components, and materials in accordance with standard specifications such as JIS, JEDEC, and MIL.
- Contract Inspection
- Testing Equipment and Devices
- Other inspection equipment and devices
Observation of substrate deformation using a 3D shape measuring device (VR-6200)
I would like to introduce "Observation of Substrate Deformation Using a 3D Shape Measuring Machine." By applying pressure to the PCB substrate, referencing bending tests of plastics and PCB substrates, the change in state is measured using a 3D shape measuring machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure.
We provide testing services to evaluate the resistance to ESD (electrostatic discharge), which is important for the reliability of semiconductor products and electronic components that include them.
- Contract Inspection
- Other contract services
- Other inspection equipment and devices