List of Semiconductor Manufacturing Equipment products

  • classification:Semiconductor Manufacturing Equipment

2656~2700 item / All 4987 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

  • PRエリア.png
  • Other conveying machines

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A belt grinding machine that has been in use for about 50 years since 1973. In addition to trust and proven results, the lineup is also extensive.

  • Other machine tools

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Belt grinding machine "Veda Machine" has high durability and a wide range of service parts.

The "Bader Machine" is our belt grinder that boasts excellent polishing performance for each individual unit. By selecting models and types according to the shape and size of the workpiece, and by equipping it with a polishing belt suitable for the task, it can flexibly accommodate a wide variety of items across various fields. Please make extensive use of it for high-efficiency polishing and grinding, reduction of work time, labor-saving, and standardization of tasks. 【Lineup】 ■ Portable type BP-K (air motor type) ■ Made-to-order machine PC-1 (wheel centerless), BC (standard dust cover) ■ Installed type BM (basic type), SBA-1, BH-2 ■ Wheel type SBD-4S, SBD-7, BWd *For more details, please download the PDF or contact us.

UV condensing lighting that solves the issues of insufficient uniformity and brightness when inspecting UV adhesives with UV lighting such as rings or bars.

  • Lighting for image processing
  • Semiconductor inspection/test equipment
  • Other optical parts

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We offer sizes ranging from 3.0x3.0mm to 10.0x10.0mm!

  • CVD Equipment
  • others

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We offer a lineup of sizes ranging from 3.0x3.0mm to 10.0x10.0mm!

  • CVD Equipment
  • others

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Mirror surface cutting processing, mirror finishing without wrapping, micro machining, special shapes, arch type, aluminum precision parts for industrial robots.

  • Other semiconductor manufacturing equipment

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An automatic chip regrinding machine with improved safety and workability for shutter opening and closing!

  • Wafer processing/polishing equipment

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A physical surface treatment device for uniformly processing the surfaces of thin materials such as printed circuit boards and films with a matte finish.

  • Other semiconductor manufacturing equipment

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Supports φ10 to φ80 and up to 350L! This is the process performed after lathe machining to improve the outer diameter dimensions and surface roughness.

  • Processing Contract
  • others
  • Wafer processing/polishing equipment

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Introducing customizable press devices for various applications such as lamination, bonding, and impregnation!

  • Other semiconductor manufacturing equipment
  • Vacuum Equipment
  • Other mounting machines

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Material A7075 (a7075) ultra-fine machining technology fine groove cutting processing industrial robot aluminum precision parts

  • Other semiconductor manufacturing equipment

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Leave the highly precise metal parts related to optics to us!

  • lens
  • Semiconductor inspection/test equipment
  • Spectroscopic Analysis Equipment

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Polycrystalline silicon is used as a raw material for the semiconductor industry and the solar cell industry (PV). Material: Nickel alloy Process: Filter

  • Sputtering Equipment

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- A wide range of standard-sized products - Easy installation - Precision sintering diffusion bonding (simultaneous sintering) - High flow rate

  • CVD Equipment

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■Advantages ・Custom-made to meet your requirements ・Uniform gas diffusion ・Standard connector elements

  • Sputtering Equipment

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I want to polish like this. Please feel free to consult us about outer diameter polishing, inner diameter polishing, end face polishing, and more.

  • Wafer processing/polishing equipment
  • Surface treatment contract service
  • Processing Contract

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Introducing examples of processing rubber rolls made from general-purpose rubber as an alternative to whetstone grinding!

  • Wafer processing/polishing equipment
  • Surface treatment contract service
  • Processing Contract

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Introducing a case where processing time has been reduced to less than 1/4 as a substitute for whetstone grinding!

  • Wafer processing/polishing equipment
  • Surface treatment contract service
  • Processing Contract

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Introducing a case study of a machined tool holder for SCM415 as an alternative to whetstone grinding!

  • Wafer processing/polishing equipment
  • Surface treatment contract service
  • Processing Contract

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Introducing a processing example using a super finisher that achieved a measurement result of Ra0.035μm, replacing whetstone grinding!

  • Wafer processing/polishing equipment
  • Surface treatment contract service
  • Processing Contract

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Single-item aluminum processing, prototyping, A5052 [Leave cost reduction to Philir Co., Ltd.]

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment
  • Resist Device

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[TIG welding] The blue paint is beautiful, part of an assembled product [t1.6]

  • Other semiconductor manufacturing equipment
  • Other machine elements
  • Other machine tools

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Consistent production system from grinding to assembly! We also accommodate small lots.

  • lens
  • Semiconductor inspection/test equipment
  • Optical microscope

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Ultra-fine diameter hole machining technology, fine hole machining technology, small hole machining technology, deep hole machining technology, laser marking.

  • Other semiconductor manufacturing equipment

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Dimension tolerance ±0.05, small diameter hole processing, material A5052 (a5052), aluminum precision parts related to semiconductor manufacturing equipment.

  • Other semiconductor manufacturing equipment

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Flexible multi-stage, diverse, high-efficiency polishing of cylindrical shapes! Film cylindrical super finishing machine with lift and carry transport device included.

  • Wafer processing/polishing equipment

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The world of ultra-fine polishing of the difficult inner surfaces and end faces of cylinders has expanded thanks to the internal unit!

  • Wafer processing/polishing equipment

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Achieving ultra-fine finishing grinding of the outer diameter in recessed areas of the workpiece using a 3D motion W-cross guide method!

  • Wafer processing/polishing equipment

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Film polishing always uses a method of continuously feeding in new film! It flexibly accommodates a variety of roll materials!

  • Wafer processing/polishing equipment

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Powerful performance when mounted on compact general-purpose machines! Unit-type super finisher.

  • Wafer processing/polishing equipment

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Introduction of a film super finishing device with backup roller diameter and width of φ58×50mm!

  • Grinding Machine
  • Wafer processing/polishing equipment

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Introduction of a film super finishing device with backup roller diameter and width of φ58×100mm!

  • Grinding Machine
  • Wafer processing/polishing equipment

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Prevents the generation and contamination of dust due to film peeling with crackless hard anodizing that can withstand temperatures up to 350℃!

  • Other semiconductor manufacturing equipment
  • Other inspection equipment and devices
  • aluminum

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Improved workability with cost reduction and increased design flexibility! Crackless anodizing that achieves high voltage resistance.

  • Other semiconductor manufacturing equipment
  • Other inspection equipment and devices
  • aluminum

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A 2-way machine for the final polishing process with excellent cost performance.

  • Wafer processing/polishing equipment

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No nests, achieving uniform organization and hardness, can be produced from 3B to 32B!

  • Wafer processing/polishing equipment

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Aluminum Ferris Wheel - Carved Aluminum Ferris Wheel - Creative Processing Technology

  • Other semiconductor manufacturing equipment

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Scan speed increased! Conventional alignment speed improved by over 3 seconds! Furthermore, low prices achieved for Si wafers only! [Free demo available now]

  • Wafer processing/polishing equipment

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Stable support for the vibration unit! The replacement of the buff can be easily carried out by one person.

  • Wafer processing/polishing equipment

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Remove Mylar film using Pin and Air! No additional thickness adjustment is needed for each product.

  • Other semiconductor manufacturing equipment

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Custom-made specifications tailored to your device! We provide testing equipment that matches your device.

  • Tester

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A composition distribution with several hundred conditions is formed on a single substrate. The effective film formation area is an equilateral triangle with a side length of 25 mm.

  • Sputtering Equipment

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Effective area of a 25mm side triangle! It forms a composition distribution of hundreds of conditions on a single substrate.

  • Sputtering Equipment

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Please leave all threading processing for quartz glass to Takashima Manufacturing.

  • Semiconductor inspection/test equipment

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There is a technique to make a pin stand at a specified angle.

  • Semiconductor inspection/test equipment

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These are parts used in robots that transport silicon wafers. Since they are used in a clean environment, even a single hairline scratch is not allowed.

  • Other machine elements
  • Transport and handling robots
  • Other semiconductor manufacturing equipment

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