List of Wafer processing/polishing equipment products
- classification:Wafer processing/polishing equipment
91~135 item / All 1022 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Work can be done in narrow spaces, and with commercially available spanners and monkey wrenches! A highly convenient screw joint that minimizes tightening scratches.
- Pipe Fittings
- Piping Materials
- valve
~Me, Polishing, and IMT~
- Wafer processing/polishing equipment
~Me, Kenma, and IMT~
- Wafer processing/polishing equipment
Realization of low Ra using high-quality grinding tape.
- Wafer processing/polishing equipment
[Made in Japan] Precision Grinding Tape Used
- Wafer processing/polishing equipment
Ideal for high-precision sample preparation! We also propose optimal polishing conditions! Reliable domestic machines with comprehensive after-sales support!
- Wafer processing/polishing equipment
We will make proposals centered around polishing machines, polishing devices, and sample polishing machines, utilizing the know-how of all precision polishing technologies.
- Wafer processing/polishing equipment
Production of holders that meet your requests! We can create holders that respond to customer needs based on in-house design, and we are also capable of producing special shapes such as porous types a...
- Wafer processing/polishing equipment
Contributing to the simplification of inspection tasks with air-free semi-automatic polishing.
- Wafer processing/polishing equipment
~Me, Kenma, and IMT~
- Wafer processing/polishing equipment
~Me, Kenma, and IMT~
- Wafer processing/polishing equipment
The adoption of a unique blade tip positioner and an adjustable collet holder allows for quick and accurate visual drill setup!
- Wafer processing/polishing equipment
High-Spec Dedicated Load Grinding Device
- Wafer processing/polishing equipment
A final polishing compound that enables the achievement of the highest level of polished surface when used in conjunction with the polishing cloth "Silica Final"!
- Wafer processing/polishing equipment
- Other abrasives
Particle size 0.045μm! A polishing agent that is difficult to agglomerate and settle, and can be dispersed in various organic solvents such as alcohol!
- Wafer processing/polishing equipment
- Other abrasives
Both overall and individual load polishing is possible! We offer a variety of interchangeable polishing discs tailored to your needs.
- Wafer processing/polishing equipment
- Other abrasives
We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.
- Wafer processing/polishing equipment
Efficiently enhance polishing power with low vibration design! We offer three models of sanders with speed control.
- Wafer processing/polishing equipment
A model that combines a membrane attachment method compatible with TAIKO(R) wafers and a heating function.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
TAIKO(R) wafer and thin wafer compatible models
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
A model suitable for processes where temperature conditions affect adhesion quality and for applications where process variation needs to be minimized.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
A versatile model capable of supporting a wide range of processes from research and development applications to pre-mass production stages.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
Easy tool re-sharpening! Anyone can achieve a uniform finish! Ready to use with a household power supply.
- Other surface treatment equipment
- Wafer processing/polishing equipment
We will monitor the grinding process in real-time with the Marpos measurement head!
- Wafer processing/polishing equipment
- Production Management System
- Other measurement, recording and measuring instruments
[Product demo available] Achieving high efficiency, durability, and flat grinding capability! A new mechanism has been adopted in the pad support section.
- Wafer processing/polishing equipment
- Other machine elements
【Product demo available】Paper size is φ150mm! It is compact and lightweight at 730g, has a long lifespan, and is easy to maintain.
- Wafer processing/polishing equipment
- Other machine elements
【Product demo available】Low failure rate and long lifespan, plus easy maintenance! Easy to operate and does not cause fatigue even with long hours of use.
- Wafer processing/polishing equipment
- Other machine elements
Polishing equipment that maximizes the characteristics of polishing film.
- Wafer processing/polishing equipment
Processing technology that can polish shafts with complex shapes!
- Wafer processing/polishing equipment
For home appliance parts! Achieving work improvement, labor saving, and uniform product quality through automation.
- Wafer processing/polishing equipment
- Articulated Robot
Precision polishing technology that contributes to the improvement of gear quality!
- Wafer processing/polishing equipment
Innovative processing technology that enables the grinding of complex-shaped main shafts!
- Wafer processing/polishing equipment
Processing technology that realizes precision grinding of robot joints!
- Wafer processing/polishing equipment
Precision grinding of complex-shaped gears!
- Wafer processing/polishing equipment
Precision shaft grinding that affects motor performance.
- Wafer processing/polishing equipment
It is possible to perform grinding on corner R surfaces and tapered sections. It also supports inner diameter grinding through attachment replacement.
- Wafer processing/polishing equipment
For grinding complex-shaped shafts such as camshafts!
- Wafer processing/polishing equipment
Innovation in turbine shaft polishing in the aerospace field.
- Wafer processing/polishing equipment
Precision shaft grinding technology to improve generator performance!
- Wafer processing/polishing equipment
Supports everything from MEMS devices to mass production. Assists in the miniaturization process.
- Wafer processing/polishing equipment
Supports the creation of natto by smoothing the surface of soybeans and ensuring a uniform texture.
- Other food machinery
- Wafer processing/polishing equipment
Polishing technology that creates gloss. It is possible to prevent nutrient leaching by processing raw materials without washing with water.
- Other food machinery
- Wafer processing/polishing equipment
Achieve beautiful prints with a glossy finish!
- Grinding Machine
- Wafer processing/polishing equipment
Introducing how to minimize mistakes and press the edit button without hesitation.
- Wafer processing/polishing equipment
In grinding, precision management of the pad is important, but are you using a modified carrier that takes into account the type of PAD? Customizing it will also make precision management easier.
- Wafer processing/polishing equipment
- mirror
- Photomask