List of Chemicals products

  • classification:Chemicals

1261~1305 item / All 3720 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.

  • Satech - AdaptaGuard_Ipros_2023_JP_1.jpg
  • Satech - BlueGuard_Ipros_2023_JP_1.jpg
  • Satech - EasyGuard_Ipros_2023_JP_1.jpg
  • Satech - FastGuard_Ipros_2023_JP_2.jpg
  • Satech - ImpactGuard_Ipros_2023_JP_1.jpg
  • Satech - EasyGuard_Ipros_2023_JP_Media-gallery_1.jpg
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  • Satech - AdaptaGuard_Ipros_2023_JP_Media-gallery_1.jpg
  • Satech - BlueGuard_Ipros_2023_JP_Media-gallery_2.jpg
  • Other safety and hygiene products

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TORYZA LCN SP, the optimal electroplating solution for forming copper pillars on semiconductor wafers and package substrates.

  • Chemicals

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We will exhibit at the 1st [Kyushu] Semiconductor Industry Exhibition.

Our company will be exhibiting at the 1st [Kyushu] Semiconductor Industry Exhibition, which will be held at Marine Messe Fukuoka Hall B from September 25 (Wednesday) to 26 (Thursday), 2024. At our booth, we will showcase the latest surface treatment chemicals and process technologies for wafers and package substrates, so please stop by. For more details, please check the related link [We will be exhibiting at the 1st [Kyushu] Semiconductor Industry Exhibition].

Supports high aspect ratio filling, copper sulfate plating additive for silicon interposers - TORYZA LCN SV.

  • Chemicals

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We will exhibit at the 1st [Kyushu] Semiconductor Industry Exhibition.

Our company will be exhibiting at the 1st [Kyushu] Semiconductor Industry Exhibition, which will be held at Marine Messe Fukuoka Hall B from September 25 (Wednesday) to 26 (Thursday), 2024. At our booth, we will showcase the latest surface treatment chemicals and process technologies for wafers and package substrates, so please stop by. For more details, please check the related link [We will be exhibiting at the 1st [Kyushu] Semiconductor Industry Exhibition].

Copper sulfate plating additive for semiconductor wafers, high heat dissipation and high current applications - TORYZA LCN SD.

  • Chemicals

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無題 (6).png

We will exhibit at the 1st [Kyushu] Semiconductor Industry Exhibition.

Our company will be exhibiting at the 1st [Kyushu] Semiconductor Industry Exhibition, which will be held at Marine Messe Fukuoka Hall B from September 25 (Wednesday) to 26 (Thursday), 2024. At our booth, we will showcase the latest surface treatment chemicals and process technologies for wafers and package substrates, so please stop by. For more details, please check the related link [We will be exhibiting at the 1st [Kyushu] Semiconductor Industry Exhibition].

FOWLP, FOPLP, and next-generation semiconductor package substrates, as well as ultra-fine wiring copper sulfate plating additives - TORYZA LCN FRV.

  • Chemicals

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無題 (6).png

We will exhibit at the 1st [Kyushu] Semiconductor Industry Exhibition.

Our company will be exhibiting at the 1st [Kyushu] Semiconductor Industry Exhibition, which will be held at Marine Messe Fukuoka Hall B from September 25 (Wednesday) to 26 (Thursday), 2024. At our booth, we will showcase the latest surface treatment chemicals and process technologies for wafers and package substrates, so please stop by. For more details, please check the related link [We will be exhibiting at the 1st [Kyushu] Semiconductor Industry Exhibition].

It is the process of forming UBM. It can improve the connection reliability between the aluminum electrode and the package terminal.

  • Chemicals

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We will be exhibiting at the 53rd International Electronic Circuit Industry Exhibition, JPCA Show 2024.

Okuno Pharmaceutical Industry has newly developed surface treatment chemicals and process technologies that contribute to the high performance and multifunctionality of printed circuit boards and semiconductor package substrates. The new products will be introduced at the 53rd International Electronic Circuit Industry Exhibition, JPCA Show 2024, which will be held from June 12 (Wednesday) to June 14 (Friday) at Tokyo Big Sight. At the venue, we will showcase the latest surface treatment chemicals and process technologies for wafers, package substrates, printed wiring boards, FPCs, and power modules. Additionally, we will present new technologies such as high-reliability granular copper plating with excellent adhesion to encapsulation resins, lithium dendrite growth suppressants, and plating technologies using recycled materials, so please stop by. For more details, please check the related link [We will be exhibiting at the 53rd International Electronic Circuit Industry Exhibition, JPCA Show 2024].

We provide standard solutions and test samples! Introducing our product lineup.

  • Chemicals

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Improvement of analysis through biomolecule synthesis and purification solutions! Introducing our product lineup.

  • Chemicals
  • Other consumables

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Not only neutral salts of sulfate esters, but also surfactants containing raw oils and fatty acids! [Currently offering samples to 10 lucky winners through a lottery]

  • Chemicals
  • Cleaning agents
  • Other consumables

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[For the pharmaceutical and pesticide industry] A must-see for those struggling with handling strong acids. Generate acid with light! A non-contact, safe, and secure acid generation system.

  • Chemicals

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