Last Updated： Aggregation Period:Nov 26, 2025～Dec 23, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Nov 26, 2025～Dec 23, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Nov 26, 2025～Dec 23, 2025
This ranking is based on the number of page views on our site.
226～240 item / All 565 items
Kerosene lubricating additive
Mix with kerosene at a ratio of 200:1 and it can be used as diesel fuel. By using it with kerosene in vehicles and machinery that are not for public road use, you can reduce the diesel tax. Diesel On is the most affordable product in the Diesel On series.
Multi-purpose lubricating additive
ExcelubeW is a lubricant additive with high content of inorganic multilayered fullerene structure tungsten disulfide. It can be added not only to diesel and gasoline engine oils but also to gear oils, greases, chains lubes, etc. It can also be added to turbine oil, machine oil, and hydraulic oil used in machine tools. By simply adding it to commercially available oils, etc., it results in significantly high lubricity. Inorganic multilayered fullerene structure tungsten disulfide (IF-WS2) is a structure in which tungsten particles are spherical and multilayered. IF-WS2 There are approximately 5,000,000,000,000 particles in this product (inside the tube). Unlike plate-shaped particles, IF-WS2 particles have no edges, preventing them from scratching sliding surfaces. They also exhibit exceptional pressure resistance, impact resistance, elasticity, and heat resistance. Normally, the spherical structure particles penetrate between metals and lubricate like ball bearings. The spherical particles form multiple layers that are similar to an onion. Even under increased pressure, the hollowness and elasticity of the core of the sphere reduce friction between the metal parts on the sliding surfaces. If subjected to extreme pressure, the outer shell layer that forms the sphere gradually peels off, filling and repairing wear marks, and forming a coating layer. Effects: Extended engine life. Quieter engine noise (mechanical noise). Improved fuel efficiency. Less deterioration of engine oil. Slower oil temperature rise due to reduced frictional heat generation. Decreased sludge due to reduced metal friction. Adding it to gear oil also extends the life of the transmission and is likely to improve fuel efficiency. When added to hub bearing grease, it reduces rolling resistance, leading to improved fuel efficiency and extended lifespan. *Early bearing life *More efficiency of the turbine generator *Severe gear squeal *Shaft boots will be replaced soon *Heavy equipment with severe damage to the joints *For extending service life of old machine tools *Need more high lubricated grease. If you are in the above situation, please try ExcelubeW. For automobiles, heavy machinery, large trucks, ships, power turbines, power motors, aircraft, trains, machine tools, etc. Add to oil and grease for engines, rotating parts, joints, sliding parts, chains, etc. For international distributors: we can send this product to your country. Please contact us for more information.
Prevent rust on huge mega cast molds! DC Zone No. 16 prevents rust during long processing times on mega cast molds.
Antibacterial Rust Prevention Additive for Wire Electrical Discharge Machining DC Zor No. 16 DC Zor No. 16 is an antibacterial additive for the processing water in wire electrical discharge machining, which also exhibits rust prevention effects on molds. For large mega cast molds... if they rust: - A lot of manpower and cleaning agents are required for work. - Many cleaning agents are strongly acidic and difficult to handle. - Rinsing is essential, which also has a high environmental impact. Preventing rust is the correct approach! ◆◇If you would like a sample, please contact us through the [Contact Us] section below, clearly stating your 'intended use'◇◆ *Regarding samples, we apologize, but: - We do not distribute samples to individual customers. - The provision will be in small quantities.
Stainless steel specification
Coating... The main body is coated with a polyester-based thermosetting paint that has excellent rust resistance, forming a film on the surface of the aluminum die-cast.
Contributes to improved adhesion with steel plates and plastics! Includes effects of additives to acrylic-based adhesives.
This document introduces the "Consideration of Additives for Acrylic Adhesives," highlighting the expected effects of plasticizers/diluents, adhesion promoters, and leveling agents. It includes information on hue, acid value, hydroxyl value, viscosity, and more. We encourage you to read it. [Contents] ■ About Nikanol ■ Effects of Additives on Acrylic Adhesives *For more details, please refer to the PDF document or feel free to contact us.
Possible to reduce the usage of abrasive by 50%! A polishing lubricant with dispersion effect and viscosity!
"CHALLENGE 543-HT" is a lubricant for wrapping/polishing designed to enhance the dispersion of various abrasive particles such as alumina, cerium, zirconia, SiC, B4C, synthetic/natural diamonds, and garnet. Due to its dispersion effect and viscosity, the amount of abrasive particles used can be reduced by 50%. It is more effective when used with a small amount of slurry supplied through a small-diameter tube. 【Features】 ■ Flatness after lap and polish ■ Reduced wafer damage ■ High lap rate ■ No scratches *For more details, please refer to the PDF document or feel free to contact us.
Response to urgent measures for lubrication troubles, as well as proactive use for break-in operations and preventive maintenance.
A high-performance extreme pressure additive with over 25 years of proven results since its introduction to the market. It supports a wide range of applications, from emergency measures for lubrication troubles to proactive use for break-in and preventive maintenance.
Evolving stacked via technology to improve wiring flexibility! Newly developed additives for copper plating specialized in film thickness uniformity for fine circuit formation for high-speed transmission.
The COVID-19 pandemic has significantly changed our lifestyle, making remote work and online business the norm. The demand for information and communication devices in fields such as 5G smartphones, computers, data centers, and car electronics is further increasing, and there is a growing need for higher performance and higher density in the semiconductor package substrates used in these devices. Build-up methods are common for printed circuit boards used in smartphones and modules, and our electroplating additives for copper have a strong track record of adoption in this sector. Okuno Pharmaceutical Industry has evolved its stacked via technology to improve the wiring flexibility of circuits and has newly developed electroplating additives for copper that are specialized for uniform film thickness, intended for fine circuit formation used in high-speed transmission.
A new copper sulfate plating additive has been developed specifically for horizontal conveyor roll-to-roll plating equipment, enabling via filling plating on flexible circuit boards.
In conventional horizontal transport Roll to Roll plating equipment, there was a problem where copper oxidized during the transfer of substrates, leading to a decrease in via filling performance. Our company has successfully developed an additive that incorporates components to control the weak current flowing during inter-cell movement, achieving both good filling properties and throwing power (patent obtained). The high-filling copper sulfate plating additive, Topruchina SVP, enables further densification and multilayering of flexible circuits, making it ideal for improving the efficiency of flexible circuit board manufacturing.
TORYZA LCN SP, the optimal electroplating solution for forming copper pillars on semiconductor wafers and package substrates.
Solder balls have been widely used in semiconductor packaging. However, due to the increase in pin count (the number of terminals on the substrate), the increase in the number of chips being packaged, and the reduction in bonding area, solder bumps with a diameter of about 100µm are becoming insufficient for high-density packaging. As an alternative, attention is being drawn to a method that involves forming a redistribution layer (RDL) on the semiconductor and using copper pillars for bonding. Our company has developed the optimal additive for copper pillars, TORYZA LCN SP. TORYZA LCN SP can also be used to form ultra-fine electrodes on the build-up layer of the package substrate.
Copper sulfate plating additive for semiconductor wafers, high heat dissipation and high current applications - TORYZA LCN SD.
Smartphones are widely used not only for calls but also for content viewing such as music and videos, online shopping, and in industries like automobiles, smart home appliances, and robotics. Mobile communication devices like cell phones and tablets have undergone significant evolution approximately every 10 years, with their maximum communication speeds increasing by about 1,000,000 times over the past 30 years. Additionally, semiconductors used in servers and high-performance computers are required to achieve even higher performance and multifunctionality. Our company has recently developed a new copper sulfate plating additive, TORYZA LCN SD, which is optimal for low aspect ratio via filling. TORYZA LCN SD can be widely applied to microbumps that join semiconductor chips and build-up wiring boards, as well as thermal vias used for heat dissipation in trench wiring on wafers and power semiconductors.
Topluchina FRV, a copper sulfate plating additive that achieves both high filling capability and in-plane uniformity, is optimal for the implementation of semiconductor package substrates.
In the implementation of semiconductor package substrates, attention is being drawn to Fan-Out Wafer Level Packaging (FOWLP) technology. In the case of FOWLP, wiring (redistribution layer) is formed in the internal area of the semiconductor package substrate. In traditional bump connections, it was necessary to electrically connect the semiconductor chip and the terminals of the package substrate. Additionally, in wire bonding using fine wires of gold or aluminum, there was a problem where increasing the number of terminals made it difficult to achieve reliable electrical connections. Therefore, the practical application of fan-out packaging technology, which allows multiple chips to be mounted side by side (multi-chip) without limitations based on chip size, is rapidly advancing. Our company has newly developed a copper sulfate plating solution that enables high filling and in-plane uniformity for the formation of redistribution layers on semiconductor wafers.
Copper sulfate plating additive for high aspect ratio substrates for package substrates "Topluchina HLS"
This is the latest plating technology for semiconductor package substrates (IC substrates). Currently, electronic devices such as smartphones, computers, and servers are becoming more high-performance, leading to a reduction in the diameter of through-holes that electrically connect the layers of printed circuit boards, as well as a decrease in pitch. As a result, there is an advancement in the high aspect ratio and high density of through-holes. We have newly developed a copper sulfate plating additive for high aspect ratio substrates that can accommodate both soluble and insoluble anodes, aimed at improving the productivity and quality stability of printed circuit board production. This product excels in depositability within through-holes and vias, achieving high throwing power across a wide range of current densities.
FOWLP, FOPLP, and next-generation semiconductor package substrates, as well as ultra-fine wiring copper sulfate plating additives - TORYZA LCN FRV.
In recent years, semiconductor packaging technology has gained attention with FOWLP and FOPLP, which allow for an increase in the number of terminals relative to chip area by forming a redistribution layer on the wafer and expanding the terminals to the outside of the chip (Fan Out), in contrast to the conventional FC-BGA that is disadvantageous for thinness and cost reduction. Our company has developed a new copper sulfate plating additive for the formation of the redistribution layer in FOWLP and FOPLP. This product excels in film thickness uniformity and rectangularity of pattern shape, and it also accommodates filling of small-diameter vias. Additionally, to support the increase in the number of terminals on the chip side, the formation of ultra-fine wiring layers on the build-up layer of conventional FC-BGA is also being considered. This product is optimal for the formation of ultra-fine wiring in next-generation semiconductor package substrates.
Supports high aspect ratio filling, copper sulfate plating additive for silicon interposers - TORYZA LCN SV.
With the advancement of semiconductor performance and functionality, packaging technologies related to chiplets that implement multiple chips with different functions on a single substrate and three-dimensional integration are gaining attention. Among these, silicon interposers with wiring formed on silicon are attracting interest because they can miniaturize the length and width of the wiring, thereby enhancing the transmission capability of high-frequency signals. Our company has developed TORYZA LCN SV as an additive for silicon interposers that supports high aspect ratio filling. TORYZA LCN SV excels in embedability into TSVs, achieving void-free and low film thickness high aspect ratio filling.
