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Additives Product List and Ranking from 185 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 25, 2026～Mar 24, 2026
This ranking is based on the number of page views on our site.

Additives Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 25, 2026～Mar 24, 2026
This ranking is based on the number of page views on our site.

  1. エフシ・ワーク Hiroshima//others
  2. サプライズサプライズ Hiroshima//others
  3. 長岡石油 Niigata//Petroleum and coal products
  4. 4 ビックケミー・ジャパン Tokyo//Chemical
  5. 5 null/null
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Additives Product ranking

Last Updated： Aggregation Period:Feb 25, 2026～Mar 24, 2026
This ranking is based on the number of page views on our site.

  1. Reduce maintenance man-hours! Additive "Fujitsubo Tsukimafune" エフシ・ワーク
  2. 工作機械用　洗浄添加剤『リンガーフラッシュ』 長岡石油
  3. Additive "Diesel on Hyper" for using kerosene as diesel fuel サプライズサプライズ
  4. 4 BYK's barrier clay technology [natural clay and newly developed synthetic clay] ビックケミー・ジャパン
  5. 5 Multi-layer fullerene structure engine oil additive 'T-BOOST' ミカド商事

Additives Product List

241～270 item / All 589 items

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Technical Data: Consideration of Additives for Acrylic Adhesives

Technical Data: Consideration of Additives for Acrylic Adhesives

Contributes to improved adhesion with steel plates and plastics! Includes effects of additives to acrylic-based adhesives.

This document introduces the "Consideration of Additives for Acrylic Adhesives," highlighting the expected effects of plasticizers/diluents, adhesion promoters, and leveling agents. It includes information on hue, acid value, hydroxyl value, viscosity, and more. We encourage you to read it. [Contents] ■ About Nikanol ■ Effects of Additives on Acrylic Adhesives *For more details, please refer to the PDF document or feel free to contact us.

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Suspension additive "CHALLENGE 543-HT"

Suspension additive "CHALLENGE 543-HT"

Possible to reduce the usage of abrasive by 50%! A polishing lubricant with dispersion effect and viscosity!

"CHALLENGE 543-HT" is a lubricant for wrapping/polishing designed to enhance the dispersion of various abrasive particles such as alumina, cerium, zirconia, SiC, B4C, synthetic/natural diamonds, and garnet. Due to its dispersion effect and viscosity, the amount of abrasive particles used can be reduced by 50%. It is more effective when used with a small amount of slurry supplied through a small-diameter tube. 【Features】 ■ Flatness after lap and polish ■ Reduced wafer damage ■ High lap rate ■ No scratches *For more details, please refer to the PDF document or feel free to contact us.

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Oil additive Protect XL-17

Oil additive Protect XL-17

Response to urgent measures for lubrication troubles, as well as proactive use for break-in operations and preventive maintenance.

A high-performance extreme pressure additive with over 25 years of proven results since its introduction to the market. It supports a wide range of applications, from emergency measures for lubrication troubles to proactive use for break-in and preventive maintenance.

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High film thickness uniformity copper sulfate plating additive for via filling

High film thickness uniformity copper sulfate plating additive for via filling

Evolving stacked via technology to improve wiring flexibility! Newly developed additives for copper plating specialized in film thickness uniformity for fine circuit formation for high-speed transmission.

The COVID-19 pandemic has significantly changed our lifestyle, making remote work and online business the norm. The demand for information and communication devices in fields such as 5G smartphones, computers, data centers, and car electronics is further increasing, and there is a growing need for higher performance and higher density in the semiconductor package substrates used in these devices. Build-up methods are common for printed circuit boards used in smartphones and modules, and our electroplating additives for copper have a strong track record of adoption in this sector. Okuno Pharmaceutical Industry has evolved its stacked via technology to improve the wiring flexibility of circuits and has newly developed electroplating additives for copper that are specialized for uniform film thickness, intended for fine circuit formation used in high-speed transmission.

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High filling copper sulfate plating additive for horizontal conveying plating equipment.

High filling copper sulfate plating additive for horizontal conveying plating equipment.

A new copper sulfate plating additive has been developed specifically for horizontal conveyor roll-to-roll plating equipment, enabling via filling plating on flexible circuit boards.

In conventional horizontal transport Roll to Roll plating equipment, there was a problem where copper oxidized during the transfer of substrates, leading to a decrease in via filling performance. Our company has successfully developed an additive that incorporates components to control the weak current flowing during inter-cell movement, achieving both good filling properties and throwing power (patent obtained). The high-filling copper sulfate plating additive, Topruchina SVP, enables further densification and multilayering of flexible circuits, making it ideal for improving the efficiency of flexible circuit board manufacturing.

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Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SP

Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SP

TORYZA LCN SP, the optimal electroplating solution for forming copper pillars on semiconductor wafers and package substrates.

Solder balls have been widely used in semiconductor packaging. However, due to the increase in pin count (the number of terminals on the substrate), the increase in the number of chips being packaged, and the reduction in bonding area, solder bumps with a diameter of about 100µm are becoming insufficient for high-density packaging. As an alternative, attention is being drawn to a method that involves forming a redistribution layer (RDL) on the semiconductor and using copper pillars for bonding. Our company has developed the optimal additive for copper pillars, TORYZA LCN SP. TORYZA LCN SP can also be used to form ultra-fine electrodes on the build-up layer of the package substrate.

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Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SD

Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SD

Copper sulfate plating additive for semiconductor wafers, high heat dissipation and high current applications - TORYZA LCN SD.

Smartphones are widely used not only for calls but also for content viewing such as music and videos, online shopping, and in industries like automobiles, smart home appliances, and robotics. Mobile communication devices like cell phones and tablets have undergone significant evolution approximately every 10 years, with their maximum communication speeds increasing by about 1,000,000 times over the past 30 years. Additionally, semiconductors used in servers and high-performance computers are required to achieve even higher performance and multifunctionality. Our company has recently developed a new copper sulfate plating additive, TORYZA LCN SD, which is optimal for low aspect ratio via filling. TORYZA LCN SD can be widely applied to microbumps that join semiconductor chips and build-up wiring boards, as well as thermal vias used for heat dissipation in trench wiring on wafers and power semiconductors.

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Copper sulfate plating additive optimal for semiconductor package substrate implementation.

Copper sulfate plating additive optimal for semiconductor package substrate implementation.

Topluchina FRV, a copper sulfate plating additive that achieves both high filling capability and in-plane uniformity, is optimal for the implementation of semiconductor package substrates.

In the implementation of semiconductor package substrates, attention is being drawn to Fan-Out Wafer Level Packaging (FOWLP) technology. In the case of FOWLP, wiring (redistribution layer) is formed in the internal area of the semiconductor package substrate. In traditional bump connections, it was necessary to electrically connect the semiconductor chip and the terminals of the package substrate. Additionally, in wire bonding using fine wires of gold or aluminum, there was a problem where increasing the number of terminals made it difficult to achieve reliable electrical connections. Therefore, the practical application of fan-out packaging technology, which allows multiple chips to be mounted side by side (multi-chip) without limitations based on chip size, is rapidly advancing. Our company has newly developed a copper sulfate plating solution that enables high filling and in-plane uniformity for the formation of redistribution layers on semiconductor wafers.

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Copper plating additive for high aspect ratio substrates "Topluchina HLS"

Copper plating additive for high aspect ratio substrates "Topluchina HLS"

Copper sulfate plating additive for high aspect ratio substrates for package substrates "Topluchina HLS"

This is the latest plating technology for semiconductor package substrates (IC substrates). Currently, electronic devices such as smartphones, computers, and servers are becoming more high-performance, leading to a reduction in the diameter of through-holes that electrically connect the layers of printed circuit boards, as well as a decrease in pitch. As a result, there is an advancement in the high aspect ratio and high density of through-holes. We have newly developed a copper sulfate plating additive for high aspect ratio substrates that can accommodate both soluble and insoluble anodes, aimed at improving the productivity and quality stability of printed circuit board production. This product excels in depositability within through-holes and vias, achieving high throwing power across a wide range of current densities.

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Copper sulfate plating additive for semiconductor wafers - TORYZA LCN FRV

Copper sulfate plating additive for semiconductor wafers - TORYZA LCN FRV

FOWLP, FOPLP, and next-generation semiconductor package substrates, as well as ultra-fine wiring copper sulfate plating additives - TORYZA LCN FRV.

In recent years, semiconductor packaging technology has gained attention with FOWLP and FOPLP, which allow for an increase in the number of terminals relative to chip area by forming a redistribution layer on the wafer and expanding the terminals to the outside of the chip (Fan Out), in contrast to the conventional FC-BGA that is disadvantageous for thinness and cost reduction. Our company has developed a new copper sulfate plating additive for the formation of the redistribution layer in FOWLP and FOPLP. This product excels in film thickness uniformity and rectangularity of pattern shape, and it also accommodates filling of small-diameter vias. Additionally, to support the increase in the number of terminals on the chip side, the formation of ultra-fine wiring layers on the build-up layer of conventional FC-BGA is also being considered. This product is optimal for the formation of ultra-fine wiring in next-generation semiconductor package substrates.

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Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SV

Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SV

Supports high aspect ratio filling, copper sulfate plating additive for silicon interposers - TORYZA LCN SV.

With the advancement of semiconductor performance and functionality, packaging technologies related to chiplets that implement multiple chips with different functions on a single substrate and three-dimensional integration are gaining attention. Among these, silicon interposers with wiring formed on silicon are attracting interest because they can miniaturize the length and width of the wiring, thereby enhancing the transmission capability of high-frequency signals. Our company has developed TORYZA LCN SV as an additive for silicon interposers that supports high aspect ratio filling. TORYZA LCN SV excels in embedability into TSVs, achieving void-free and low film thickness high aspect ratio filling.

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Exhibiting with the theme of OKUNO's surface treatment technology contributing to the development of the semiconductor field.

Exhibiting with the theme of OKUNO's surface treatment technology contributing to the development of the semiconductor field.

Okuno Pharmaceutical Industry, a top-class company in surface treatment and plating chemicals, offers surface treatment chemicals and process technologies for wafers and package substrates!

■Exhibiting at SEMICON JAPAN 2023■ Okuno Pharmaceutical Industry will be exhibiting at SEMICON JAPAN 2023, which will be held at Tokyo Big Sight from December 13 (Wednesday) to December 15 (Friday), 2023. We will showcase a variety of new products, including plating technologies for wafers and semiconductor package substrates, as well as plating processes for power modules that contribute to device connection reliability. Please visit our booth at Tokyo Big Sight, East Hall 1, [1131]. Latest information about the exhibition and more can be found on our company website. Please check the related links. All of our employees look forward to your visit. *For more details, please download the PDF or contact us directly.

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Copper sulfate plating additive for wafers - TORYZA LCN series

Copper sulfate plating additive for wafers - TORYZA LCN series

Newly developed copper sulfate plating chemicals for wiring of semiconductor wafers.

As the functionality, performance, and miniaturization of semiconductors continue to evolve, new technologies related to three-dimensional integration of semiconductors are being developed one after another. Consequently, addressing the miniaturization of wiring (narrow pitch) and heat dissipation measures has become increasingly important. To meet various demands, our company has newly developed sulfuric acid copper plating chemicals, the TORYZA LCN series, for semiconductor wafer wiring.

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Aluminum hard anodizing additive "Top Hardener AL"

Aluminum hard anodizing additive "Top Hardener AL"

An environmentally friendly additive for hard anodizing aluminum that achieves a hard anodic oxide film with a hardness of Hv400 or higher and good heat crack resistance even at a bath temperature of 20°C.

Typically, aluminum anodizing treatment achieves a hard coating by lowering the temperature of the electrolyte, and it is utilized in applications where not only corrosion resistance but also wear resistance and strength are required, such as in automotive and aerospace components. On the other hand, obtaining a hard anodized coating requires high voltage, and the heat generated during the electrolysis must be continuously cooled. Therefore, there has been a challenge of needing a considerable amount of electrical energy compared to standard anodizing treatment. In response, our company has newly developed an environmentally friendly aluminum hard anodizing additive, "Top Hardener AL," which can achieve a hard anodized coating with a hardness of Hv400 or more and good heat crack resistance even at a bath temperature of 20°C. The treated coating has a low moisture content, and the reduction in coating shrinkage due to heat treatment results in high heat crack resistance above 200°C.

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P-Life Microbial Decomposition Plastic Additive

P-Life Microbial Decomposition Plastic Additive

An additive that promotes the microbial degradation of polyolefin resins, which are difficult to decompose by microorganisms!

"P-Life" is a highly safe microbial degradation plastic additive developed based on years of testing and verification in various countries around the world. The basic addition amount is 1.5% or more (masterbatch), enabling the production of microbial degradation resin products at a low cost. The components are registered in the national positive list based on the revised Food Sanitation Act (updated April 2022). It also complies with the Ministry of Health, Labour and Welfare Notification No. 370 of the Food Sanitation Act. 【Features】 ■ An additive based on fatty acids refined from plant oils (biomass) ■ Microbial degradation resins include polyethylene (PE) and polypropylene (PP) ■ The physical properties of the added resin products are equivalent to those of standard resin products ■ The microbial degradability of the added plastic products has been verified according to JIS K6955 (ISO 17556) *For more details, please refer to the PDF materials or feel free to contact us.

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About P-Life microbial degradation plastic additives and their market development.

About P-Life microbial degradation plastic additives and their market development.

Highly safe microbial degradation plastic additives! Includes results of microbial degradation tests in soil environments.

This document provides an explanation of P-Life biodegradable plastic additives and their market development. It includes information on P-Life biodegradable plastic technology, product lineup, functions, and microbial decomposition mechanisms. Since 2003, sales of P-Life have started primarily in the Asia-Pacific region, and currently, the sales area has expanded to all regions of the world. 【Contents】 ■ Company Overview ■ P-Life Biodegradable Plastic Technology ■ P-Life Product Lineup ■ Functions and Microbial Decomposition Mechanisms of P-Life (Additives) ■ Results of Microbial Decomposition Tests in Soil Environment Part 1 *For more details, please refer to the PDF document or feel free to contact us.

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P-LIFE GREEN 20 Masterbatch Physical Property Information

P-LIFE GREEN 20 Masterbatch Physical Property Information

Biodegradable resin includes polyethylene and polypropylene! Microbial degradation plastic additive 'P-Life'.

We would like to introduce the physical property information of the "P-Life GREEN 20" masterbatch that we handle. The biodegradable resin consists of polyethylene and polypropylene, with a melting point of 110°C. It is applicable to all processing methods of polyethylene and polypropylene, including inflation, extrusion, injection molding, foaming, and lamination. 【Features】 ■ Composition: 20% active ingredient of P-Life + 80% polyethylene ■ Appearance: Pellet form ■ MI: 8.1 (as base resin) ■ Color: Beige ■ Odor: None *For more details, please refer to the PDF document or feel free to contact us.

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P-LIFE PP 10 Masterbatch Physical Property Information

P-LIFE PP 10 Masterbatch Physical Property Information

The appearance is pellet form, with a melting point of 165°C! Microbial degradation plastic additive 'P-Life'.

We would like to introduce the physical property information of our "P-Life" PP 10 masterbatch. It is composed of 10% active ingredient from P-Life and 90% polypropylene, with a recommended processing temperature of 165°C to 300°C. It is applicable for general processing of polypropylene, including extrusion, inflation, and injection molding. 【Features】 ■ Composition: 10% active ingredient from P-Life + 90% polypropylene ■ Appearance: Pellet form ■ MI: 30 (as base resin) ■ Color: Beige ■ Odor: None *For more details, please refer to the PDF document or feel free to contact us.

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P-Life has successfully obtained polypropylene-decomposing bacteria!

P-Life has successfully obtained polypropylene-decomposing bacteria!

To all companies working on plastic pollution measures: The possibilities for environmentally friendly plastic products expand with P-Life technology.

Our research team, in collaboration with Keio University, Ito En, Inc., SI Resin Industry Co., Ltd., and the Keio University Advanced Molecular Research Center, has successfully obtained a degradation bacterium for polypropylene (PP) that incorporates the biodegradable additive "P-Life." This research achievement represents an important step towards the microbial degradation treatment of non-degradable polyolefin-based plastics. Furthermore, the degradation bacteria attracted by the addition of P-Life are expected to effectively decompose and remove microplastics generated from polyolefin-based plastics, helping to alleviate their accumulation in the global environment. 【Features】 - Multiple degradation bacteria discovered that are compatible with P-Life added plastics - Capable of degrading a wide range of materials, including polypropylene and polyethylene - Safety of the products generated after plastic degradation being metabolized by microorganisms - Effectiveness of P-Life in promoting microbial degradation has been demonstrated *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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Powerful adhesive "Kanestic"

Powerful adhesive "Kanestic"

Loved for 60 years and still the same ease of use.

The powerful adhesive "Kanestic" is a school adhesive widely used in educational materials. It is characterized by excellent initial adhesion, quick-drying properties, and strong bonding strength. Properties: Excellent initial adhesion, quick-drying, and strong bonding strength. Uses: Sculpting, furniture and toy repair, model making, doll making, etc. Adhesive materials: Paper, wood, fabric, leather, foam, glass, acrylic sheets, ceramics, metal, various synthetic resins, fiberglass, and more. *For more details, please contact us or download the PDF.

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Polyurea "NUKOTE" Comprehensive Catalog

Polyurea "NUKOTE" Comprehensive Catalog

NUKOTE Comprehensive Catalog

Polyurea is a resin compound based on urea bonds generated by the chemical reaction between isocyanates and polyamines. It is a lining material that dramatically enhances the strength of objects for various applications, exhibiting extremely high capabilities in waterproofing, chemical resistance, abrasion resistance, heat resistance, and corrosion resistance. Its fast-drying properties, which cure in seconds to minutes, allow for use in all situations and expand the range of applications. Additionally, certain grades boast an elongation rate of over 400%, and the strength provided by its flexibility is even used for blast protection in military facilities. Being solvent-free, it is also environmentally friendly, making it an overwhelmingly "tough yet easy" next-generation lining material—this is "Polyurea." 〇 Excellent flexibility 〇 Fast curing and short construction time 〇 Superior chemical resistance and corrosion resistance 〇 Solvent-free 【Purpose and Applications】 ■ Chemical corrosion resistance - chemical tanks, quarantine embankments, drainage tanks, various chemical plant equipment ■ Blast and impact resistance - chemical tanks, quarantine embankments, drainage tanks, various chemical plant equipment ■ Waterproofing - underground pits, concrete waterways, waterproofing for building rooftops ■ Weather resistance - outdoor facilities, equipment, factory roofs, outdoor flooring ■ Abrasion resistance - factory flooring, dams, livestock facilities, mining equipment *For more details, please download the PDF or contact us.

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Polyurea "POLYUREA GROBAL" Comprehensive Catalog

Polyurea "POLYUREA GROBAL" Comprehensive Catalog

"POLYUREA GLOBAL" Comprehensive Catalog

Polyurea is a resin compound based on urea bonds produced by the chemical reaction between isocyanates and polyamines. It exhibits extremely high capabilities in waterproofing, chemical resistance, abrasion resistance, heat resistance, and corrosion resistance, dramatically enhancing the strength of objects for various applications. Its fast-drying properties allow it to cure in seconds to minutes, making it usable in all situations and expanding the scope of construction. Additionally, certain grades boast an elongation rate of over 400%, and the strength provided by its flexibility is even used for blast protection in military facilities. Being free of solvents and other harmful substances, it is also environmentally friendly, making it an overwhelmingly "tough yet easy" next-generation lining material—this is "Polyurea." 【Features】 ■ Chemical corrosion resistance ■ Blast and impact resistance ■ Waterproofing ■ Weather resistance ■ Abrasion resistance *For more details, please download the PDF or contact us.

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Hand-applied polyurethane "NUKOTE BG"

Hand-applied polyurethane "NUKOTE BG"

Polyurea for manual use that can be applied with a brush or roller.

NUKOTE Polyurea BG is a grade that is applied manually using tools such as brushes, making it convenient for small-scale projects or touch-ups on surfaces where other polyureas have already been applied. The purpose of the application, like other products, includes rust prevention and waterproofing in various locations. NUKOTE Polyurea BG is a two-component polyurea resin that is less prone to defects such as pinholes and blisters caused by moisture, which are commonly seen in typical polyurethane resins and modified polyurethane resins. - No pressure spray equipment required - High elasticity and flexibility - Excellent corrosion resistance - Seamless coating - Low permeability - Applicable temperature range: above -5°C and below 35°C

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Hand-applied polyurethane "NNUKOTE JF-HM"

Hand-applied polyurethane "NNUKOTE JF-HM"

Ideal repair polyurethane for touch-ups.

NUKOTE Polyurea JF HM is a touch-up material used for applications such as concrete floor surface repair, crack repair, and joint filling. It has low viscosity, excellent self-leveling properties, and adapts to crack follow-up due to its high elongation rate. NUKOTE Polyurea JF HM is a two-component modified aliphatic polyurea resin with properties that make it resistant to degradation. - 100% solids, contains no volatile substances - High elasticity and flexibility - Flexibility at low temperatures - Odorless - Complies with USDA (United States Department of Agriculture) standards - Complies with California air quality standards - Applicable temperature range: above 0°C and below 35°C

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Heat-applied spray type polyurea (abrasion-resistant) 'NUKOTE HAR'

Heat-applied spray type polyurea (abrasion-resistant) 'NUKOTE HAR'

High cost-performance polyurea resin paint

"NUKOTE HAR" is a high-performance polyurea that has been modified for industrial applications to withstand intense wear, water pressure, tear resistance, and severe impacts. NUKOTE Polyurea HAR is a two-component type with 100% solids, significantly surpassing the performance of conventional polyurea elastomers commonly used in mining and industrial applications. It is suitable for applications in factories where very intense wear occurs in dry or wet conditions, such as coatings, conveyors, vehicles, screens, and processing tanks, and it possesses excellent chemical resistance, heat resistance, and UV resistance. This product has outperformed 27% chrome steel in slurry wear tests and is highly regarded for use in transporting ores and raw materials. - 100% solids, 0 VOC emissions - Excellent elongation and tear resistance - Seamless, elastic, flexible, and highly durable - Excellent corrosion resistance - Very high impact resistance and wear resistance

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Thick film anti-corrosion lining material 'RSJ#100'

Thick film anti-corrosion lining material 'RSJ#100'

High corrosion-resistant epoxy resin glass flake lining with excellent wear resistance and acid resistance.

"RSJ#100" is a special anti-corrosion coating that not only prevents the intrusion of chemical liquids but also excels in abrasion resistance. It features a high mixing ratio of inorganic materials made from hollow glass flakes within a two-component epoxy resin. This coating method enables it to adapt to a wide variety of situations in fieldwork, possessing excellent performance not found in conventional epoxy resins. [Features] - Solvent-free type containing no volatile components - Can cure in environments as low as -5°C - Resistant to salt, acids, and alkalis - Compatible with both inorganic and organic acids - Compliant with Japan Water Works Association JWWA K-143 standards *For more details, please refer to the PDF document or feel free to contact us.

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Heat-activated spray polyurea (UV-resistant type) 'NUKOTE AL'

Heat-activated spray polyurea (UV-resistant type) 'NUKOTE AL'

Weather-resistant and color-retaining polyurea resin paint.

NUKOTE Polyurea AL is a aliphatic polyurea coating material from NUKOTE that can be used for various architectural applications requiring aesthetic qualities. It is suitable for providing corrosion resistance and waterproofing to metals, concrete, and other building materials. NUKOTE Polyurea AL is a two-component system made of 100% solid pure polyurea resin, which minimizes issues such as pinholes and blisters caused by moisture, commonly seen in typical polyurethane resins and modified polyurethane resins. Surface finishes such as anti-slip treatments can be applied according to the application. Additionally, characteristics of aliphatic polyurea include color stability and UV resistance, allowing it to maintain its color over the long term. - 100% solids, zero VOC emissions - High elasticity and flexibility - High acid and corrosion resistance - Seamless coating - Abrasion resistance - Low permeability - Long-term color stability - Applicable temperature range: -30°C to 60°C - Usable temperature range: -30°C to 60°C

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Reinforcement material for concrete anti-corrosion "Glass Cloth"

Reinforcement material for concrete anti-corrosion "Glass Cloth"

Outstanding dimensional stability! A proven product that fully considers adhesion and workability.

We would like to introduce our concrete corrosion protection reinforcement material, "Glass Cloth." This product is used for preventing the deterioration of concrete structures and for corrosion and waterproofing, and it is a proven material that takes into account adhesion and workability, made from epoxy resin, unsaturated polyester, vinyl ester resin, urethane, and other reinforcements. Please feel free to contact us if you have any requests. 【Features】 ■ Excellent adhesion to resin ■ Outstanding dimensional stability ■ Moderate stiffness, making it easy to handle ■ High specific strength ■ Corrosion-resistant *For more details, please download the PDF or feel free to contact us.

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[Construction Case] Tokyo Polyurea Slate Roof Renovation Work

[Construction Case] Tokyo Polyurea Slate Roof Renovation Work

Case of a certain automobile factory in Hamura City, Tokyo! The construction area is 7,830 m².

We would like to introduce a case study of the "Rigid Foam Polyurethane + Polyurea Spray Coating" work we conducted. The construction site is a slate roof, with the objectives of waterproofing, renovation, and functional enhancement. Please feel free to contact us when you need our services. 【Case Overview】 ■ Construction Site: A certain automobile factory ■ Construction Area: Slate roof ■ Construction Substrate: Slate ■ Construction Objectives: Waterproofing, renovation, functional enhancement ■ Construction Area: 7,830m2 *For more details, please download the PDF or feel free to contact us.

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Fuel Additive "FCR58"

Fuel Additive "FCR58"

Maintenance frequency and cost reduction! Prevent deterioration of exhaust efficiency due to soot generation.

"FCR58" is a fuel additive based on nanoparticle cerium oxide. It improves combustion efficiency through cerium oxide and prevents the deterioration of exhaust efficiency caused by soot generation. Additionally, it reduces DPF regeneration time, maintenance frequency, costs, and downtime. 【Features】 ■ Improves fuel economy ■ Continuously removes soot ■ Prevents and removes DPF clogging ■ Reduces CO2 *For more details, please download the PDF or feel free to contact us.

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