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Analysis(si) - List of Manufacturers, Suppliers, Companies and Products

Last Updated: Aggregation Period:Oct 15, 2025~Nov 11, 2025
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Analysis Product List

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Apple Link Corporation's Contour Shape Error Analysis

This is different! Contour shape error analysis

Using Quick Vision's automatic tracing function, it is possible to capture the contour shape of the measurement work as point cloud data.

  • Processing Contract

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Fluid analysis for automotive oil lubrication, "Simerics MP+"

Fluid analysis software for positive displacement pumps such as gear pumps and vane pumps! A CFD software specialized for pumps that other CFD software struggles with!

PumpLinx is a fluid analysis software designed to calculate the transient characteristics of various volumetric pumps, compressors, and valves. It is developed based on the thermal fluid analysis software Simerics MP and utilizes all the features of Simerics MP. 【The following fluid analyses are possible】 ■ Free surface flow ■ Flow considering the compressibility of air contained in liquids ■ Pressure pulsation and water hammer effects ■ Coupling of pump flow with the rigid body motion of valves and cam rings ■ Flow in low to medium vacuum conditions ■ Compressible flow (subsonic) ■ Cavitation ■ Time variation of flow field (velocity vector, pressure), flow rate, fluid forces, and torque The biggest strength is the ability to automatically create meshes with clearances in the µm range, which is difficult for other general-purpose fluid analysis software!! Recently, there has been an increase in applications for automotive and construction machinery oil pumps, with examples such as vane pumps for power steering and CVTs, as well as trochoidal pumps for engine lubrication. *There is a lot of information that cannot be posted online. Especially, we encourage you to see the actual mesh creation and movement through a demo presentation!

  • Thermo-fluid analysis
  • Contract Analysis
  • simulator

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Structural analysis of Adesto RM24EP128KS CBRAM

Structural analysis of Adesto RM24EP128KS CBRAM

Adesto provides a technology that serves as an alternative to power-efficient, cost-effective flash memory, achieving long battery life for connected home devices such as home appliances, sensors, and monitors. CBRAM is seen as a promising successor to flash memory, offering cost and power savings. Adesto's CBRAM excels in energy efficiency, is CMOS compatible, and is designed for discrete and embedded memory applications. TechInsights' structural analysis report includes detailed layer-by-layer (LbL) analysis of the device structure, manufacturing processes, and compositions, as well as critical dimension measurements of general features, gate lengths and pitches, channel lengths, diffusion layer depths, well depths, field oxide thicknesses, and gate oxide thicknesses.

  • Other electronic parts

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Thermal Fluid Analysis CAE Contract Analysis Service

From electronic devices to architectural environment design! We provide analysis services tailored to your company's needs!

We offer paid airflow, thermal, and environmental analysis services using our software "FlowDesigner." We analyze invisible air flows, temperature distributions, and contamination distributions in spaces through computer simulations. ◆ Recommended for the following customers! ◆ - I want to eliminate temperature unevenness indoors and achieve energy savings! - I want to know the current ventilation situation! - I want to create proposal materials for new technical sales! - I was asked by a customer to submit analysis results, but... - I want to explain design proposals and improvement plans clearly to customers! - I don't have the resources to conduct thorough simulations in-house. ◆ Software Used ◆ FlowDesigner Our specialized staff will quickly resolve your concerns! Leave everything from model creation to output to us!

  • Other contract services

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Analysis of electronic circuits and components

Solving customer problems with advanced analysis and "analytical skills"! Introducing case studies of electronic circuit board analysis.

"Analysis of electronic substrates and components" offers surface analysis methods tailored to the customer's desired level of understanding. By utilizing various techniques, including FT-IR (reflective method and ATR method), XPS surface analysis, and AES depth analysis, we have resolved issues related to the copper surface of electronic substrate wiring patterns. 【Case Studies of Electronic Substrate Analysis (Wiring Patterns)】 ■ FT-IR (Reflective Method and ATR Method) ■ XPS Surface Analysis ■ AES Depth Analysis ■ TOF-SIMS Analysis ■ Thermal Decomposition GC/MS *For more details, please download the PDF or feel free to contact us.

  • Analytical Equipment and Devices
  • Contract Analysis

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Report: Detailed Structural Analysis of the MDM9235 Modem Logic

Detailed structural analysis of the 20 nm HKMG Qualcomm Gobi.

This report is a detailed structural analysis (LDSA) of the 20 nm node Qualcomm MDM9235 modem. The MDM9235 is the fourth generation Qualcomm Gobi 9x35 series modem and is the first modem from Qualcomm manufactured using a 20 nm CMOS process. The MDM9235 is paired with the Qualcomm Snapdragon 805 application processor to support 4G LTE-A Cat. 6 data rates (301.5 Mbps) and 4K video content. The MDM9235 is manufactured by TSMC using 10 layers of metallization (9-Cu, 1-Al), with 20 nm node high-k metal gate (HKMG) transistors fabricated on a bulk silicon substrate using a gate length process. It features a minimum contacted gate pitch of 90 nm. 【Features】 ○ Understanding of key design and manufacturing innovations ○ Informed technical resource investment decisions based on appropriate information For more details, please contact us or download the catalog.

  • Analysis Services

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[Analysis Case] Simulation of Impurity Diffusion in Silicon Crystals

It is possible to determine the diffusion pathways and barriers through simulation.

The electrical, optical, and magnetic properties of semiconductors are strongly influenced by defects and impurities present in the system. Therefore, to achieve the desired material properties, it is necessary to understand and control the behavior of defects and impurities. However, evaluating atomic-level microscopic behavior through experimental methods is challenging, making approaches using computational simulations effective. This document presents a case study using first-principles calculations with the NEB (Nudged Elastic Band) method to evaluate the diffusion pathways and barriers of metal impurities (Fe) in silicon crystals.

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  • Contract Analysis
  • Contract measurement

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Wafer surface analysis

Data collection can be done in a short time! No pre-treatment is required, and samples can be reused.

Our company offers wafer surface analysis using the KLA-Tencor "Candela CS-10V." The Candela can detect microscopic defects as image data. Both the defect occurrence map and the status of individual defects can be observed. The target materials are sapphire, SiC, GaN, and other compound semiconductors, with applicable sizes ranging from φ2 inches to φ6 inches wafers (thickness less than 1mm). 【Features】 ■ Measurement data can be collected in a short time ■ No pre-treatment is required, and samples can be reused ■ Detection of microscopic defects that cannot be confirmed with an electron microscope ■ Applicable sizes: φ2 inches to φ6 inches wafers (thickness less than 1mm) *For more details, please refer to the PDF document or feel free to contact us.

  • Contract Analysis
  • Other analyses

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CFD (Computational Fluid Dynamics) thermal fluid analysis

Visualize fluid flow and temperature distribution! We will conduct analysis using Ansys Icepak to assist in your design.

In modeling for cooling targets, when designers repeat the process of design → prototyping → measurement through experiments → redesign → prototyping based on their experience, it leads to wasted time and costs. In short, CFD analysis is necessary to eliminate that waste. In CFD, as long as the input parameters are provided, calculations are performed automatically, allowing for the visualization of fluid flow and temperature distribution. Our company conducts analysis using Ansys Icepak to assist in the design process. *For more details, please refer to the PDF materials or feel free to contact us.*

  • Thermo-fluid analysis

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[Analysis Case] Evaluation of Crystal Structure by Micro XRD Analysis

XRD measurements in micro areas are possible.

We will introduce a case where XRD measurements were conducted by narrowing the X-ray beam to Φ400μm, allowing us to obtain crystal information targeting a specific area rather than the entire surface. In the XRD measurement results of the printed circuit board sample, Cu and BaSO4 were detected at all measurement points (1) to (3), and a peak from Au was detected at the measurement point (1), which is the electrode. This aligns well with the results from XRF measurements. Thus, it is possible to identify crystal structures by targeting regions of several hundred micrometers with different compositions and crystallinities. Measurement methods: XRD, XRF Product fields: LSI, memory, electronic components Analysis purposes: Composition evaluation, identification, structural evaluation For more details, please download the materials or contact us.

  • Contract Analysis

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[Data] Optimization Methods in Nonlinear Domains

Implemented using three methods, including DOE optimization! An explanation of our optimization techniques in the nonlinear domain.

This document introduces the optimization of nonlinear areas, such as collisions, conducted by GRM Consulting. It explains the comparison of flows for each optimization method, model conversion, creation of load conditions, and verification through linear analysis. By utilizing optimization up to the nonlinear area, significant labor reduction effects can be achieved. 【Contents (partial)】 ■ Introduction ■ Benefit ■ Comparison of flows for each optimization method ■ Comparison of optimization flows (1) vs (2) ■ Summary of nonlinear optimization methods *For more details, please refer to the PDF document or feel free to contact us.

  • Other analyses

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SOLIDWORKS Flow Simulation Heat Conduction Analysis

White paper available!! "Heat conduction analysis that cannot be learned in engineering school"

The use of fluid dynamics (CFD) is no longer limited to experts. A new class of CFD analysis software called "concurrent CFD" has proven to be highly effective for thermal conduction analysis, enabling mechanical engineers to make key decisions quickly on their workstations without the need for CFD specialists. This intuitive process, integrated into a 3D CAD environment, allows designers to optimize products during the design phase, reducing manufacturing costs across a wide range of mechanical design and systems. *For more details, please refer to the materials. Feel free to contact us as well. ▼ The white paper can be downloaded from the link below ▼

  • 3D CAD
  • Other CAD
  • Other CAD related software

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Construction management support app 'eYACHO for Business'

Improve business efficiency by utilizing electronic approval functions! A construction management support app developed based on on-site operations.

"eYACHO for Business" is a system originally developed with the aim of digitizing "field notebooks" used in construction and civil engineering sites. Currently, it allows for the import of PDF files of safety reports, improvement instructions, construction plans, drawings, and more that are in use on-site. By defining and embedding input fields on each PDF, easy digitization is possible. Additionally, videos can be attached to notes, enabling quick sharing of on-site conditions in a secure environment via MetaMoJi Cloud, and it also supports still image extraction. [Features] ■ Allows for direct digitization of currently used paper forms ■ Records images, videos, and audio recordings in each form or free note ■ Enables real-time sharing of note content regardless of location ■ Various business templates are available ■ Links captured images by pinning them to drawings *For more details, please download the PDF or feel free to contact us.

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  • Process Control System

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