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Box Product List and Ranking from 714 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

Box Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. TAKACHI ELECTRONICS ENCLOSURE CO., LTD. Saitama//Machine elements and parts
  2. タイムワールド Tokyo//others
  3. null/null
  4. 4 テイエスエスジャパン Tokyo//Industrial Electrical Equipment
  5. 5 シム・システム 管理本部 Aichi//Building materials, supplies and fixtures
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Box Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. Oxygen Box O2 Box T2-R (for 1-2 people) タイムワールド
  2. List of CAD Data for Sanparts
  3. Naiwa Electric Co., Ltd. Meter Box シム・システム 管理本部
  4. 4 Smart Key Box KEYes
  5. 5 2025-2027 TAKACHI ELECTRONICS ENCLOSURE ALL PRODUCT CATALOG TAKACHI ELECTRONICS ENCLOSURE CO., LTD.

Box Product List

1036～1050 item / All 2033 items

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Simple experimental sputtering device

Simple experimental sputtering device

Two models: manual batch type and simple load lock type. The simple load lock type enables the mass production process of compound semiconductors. Currently accommodating sample tests and equipment tours.

This product is a simple and cost-effective sputtering device that covers everything from basic research to advanced process development. We offer two models: a fully manual, low-cost batch type and a simplified load lock type equipped with a manual transport mechanism. Both models achieve significant cost reductions while maintaining the process performance of higher-end models. We provide consistent and careful support from sample testing and specification compliance to post-delivery follow-up. 【Features】 ■ Reasonable cost and high process performance ■ High reliability capable of handling small-scale production ■ A wide range of options and flexible hardware support backed by extensive track records ■ Supports process development in advanced thin film development with load lock mechanisms and pre-deposition testing ■ A demo unit is permanently available for sample testing *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment
  • Plasma surface treatment equipment

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Testing for the sheet-type plasma reflow device (fluxless reflow) is now open.

Testing for the sheet-type plasma reflow device (fluxless reflow) is now open.

Fluxless wafer bump reflow device. Achieves fine bump reflow without wet processes. Sample demo available. Reflow video posted.

Fluxless reflow in a strong reducing H2 radical atmosphere of damage-free downflow-type surface wave plasma, reducing flux application and cleaning processes, as well as application and cleaning equipment. A completely dry CtoC system. Achieving a short tact reflow process for fine pitch bumps.

  • Other semiconductor manufacturing equipment

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Horizontal vapor deposition device

Horizontal vapor deposition device

Double-sided film formation, edge film formation, compact, large batch processing. The substrate's self-rotation mechanism enables control of the deposition surface. Providing unique processes for quartz oscillators and thin-film resistors.

Equipped with a unique substrate mechanism ideal for double-sided film deposition on small substrates and small-diameter wafers, edge film deposition on ceramic substrates, and mask film deposition. A standard horizontal deposition device with a large processing capacity in a compact chamber. Various options for evaporation sources, heating temperatures, and exhaust systems are available. Capable of handling a wide range of applications from resin decoration to mass production of electrode formation for electronic components with a proven unique mechanism.

  • Evaporation Equipment

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Ultra-High Vacuum Sputtering Equipment (Model STM2323)

Ultra-High Vacuum Sputtering Equipment (Model STM2323)

Ideal for research and development of advanced thin film devices. A customizable single-sheet ultra-high vacuum inline system. Responding to demands with a wealth of options and flexible support.

A super high vacuum sputtering device with exhaust performance of 10⁻⁷ Pa. It is equipped with a cassette chamber, transfer chamber, etching chamber, and multiple sputtering chambers in a standard configuration. It achieves efficiency in research and development work through fully automated operation using a fully automatic CtC method. You can also choose deposition mechanisms such as high-efficiency ferromagnetic cathodes and wide erosion cathodes, and we can accommodate individual requirements based on substrates and purposes. It can also support a simple device configuration, achieving reasonable cost solutions. As an advanced specification, a cluster-type transfer chamber can be equipped, and it is an evolved sputtering device capable of incorporating different process chambers such as annealing and deposition.

  • Sputtering Equipment
  • Plasma surface treatment equipment

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Simple experimental sputtering device (SRV3100 type)

Simple experimental sputtering device (SRV3100 type)

Compact-type sputtering device exclusively for small substrate, achieving low cost with fully manual operation. Standard type for research and experiments.

Commonization of high-reliability upper models with vacuum chambers and exhaust systems. Cost reduction achieved through manual operation methods. Various components (cathodes, substrate holders, etc.) can be selected according to the type of film and purpose. The efficiency and quality of research and development work can be improved with the well-established mechanisms and stable film deposition performance.

  • Other physicochemical equipment
  • Sputtering Equipment

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Mass production vacuum soldering device (formic acid compatible type)

Mass production vacuum soldering device (formic acid compatible type)

Standard device for voidless soldering. Proven and reliable hardware and software supporting automotive power device modules.

Expanding a batch-type vacuum soldering device with a rich track record for full-scale mass production. In addition to the conventional H2 atmosphere process, support for formic acid has been added. Achieving voidless soldering with higher reliability on the mass production line. A standard device for soldering automotive power device modules. Responding to requirements with process support from in-house demo units and flexible hardware solutions.

  • Reflow Equipment
  • Annealing furnace

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Compound semiconductor deposition device (AAMF-C1650SPB type)

Compound semiconductor deposition device (AAMF-C1650SPB type)

A dedicated deposition device optimal for advanced optical devices. Achieves a smooth film surface with low-temperature, low-damage film formation. High-quality electrode films realized by hardware compatible with ultra-high vacuum.

A large-diameter cryopump has been adopted in a more compact chamber than conventional types, and ultra-high vacuum compatibility has been implemented in each mechanism of the chamber, enabling a clean high-vacuum environment. The evaporation source uses an electron gun with a water-cooled reflective electron trap, achieving low-damage film formation that prevents electron bombardment on the substrate. The well-established six-gun electron gun is compatible with the formation of multilayer film electrodes that include high-melting-point metals. It features stable deposition, eliminating substrate damage from micro-arcs and abnormalities on the film surface caused by droplets. It can also accommodate lift-off deposition according to the process and production volume. During lift-off deposition, a water-cooling mechanism from the back of the substrate compatible with thick-film electrodes allows for the formation of precious metal thick-film electrodes.

  • Evaporation Equipment

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Hydrogen atmosphere conveyor furnace (reduction atmosphere continuous heat treatment device)

Hydrogen atmosphere conveyor furnace (reduction atmosphere continuous heat treatment device)

A bestselling type with a wealth of achievements, supporting high-temperature soldering, paste sintering, and metal particle sintering processes with reliable software and highly dependable hardware.

Replacement of the atmosphere in the furnace with hydrogen reduction. Achieving low oxygen concentration and reduction atmosphere treatment that cannot be realized with an inert atmosphere using N2 through continuous processing in a conveyor furnace. Utilizing the reduction effect of the hydrogen atmosphere, it supports high-temperature soldering and continuous reduction atmosphere heat treatment that require high reliability, which cannot be addressed by conventional reflow. There is also a wealth of experience in firing various pastes. The system covers the reflow process for wafer bumps of system LSI with a CtC type compatible with 300 mm wafers. In addition to conventional soldering, brazing, and paste firing processes, it also has a proven track record in sintering bonding for next-generation bonding materials (metal nano-paste). A demonstration machine is permanently available to reliably support initial tests for various applications through to mass production.

  • Reflow Equipment
  • Annealing furnace
  • Electric furnace

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R&D Multi-Chamber Sputtering Device

R&D Multi-Chamber Sputtering Device

Specialized for responding to R&D and niche processes, a new type of multi-chamber sputtering device for small-scale production and prototyping/research and development, which is difficult with mass production equipment.

A low-cost multi-chamber sputtering system dedicated to the development of advanced thin film processes and small-scale production. It accommodates a wide range of fields with a high-efficiency cathode that excels in film thickness control and a variety of optional mechanisms. Proven in various processes, not only for Si semiconductor electrodes and wiring films but also for magnetic films, insulating films, and protective films for micro-magnetic devices and MEMS. It features the ability to equip different process chambers such as evaporation, annealing, and CVD, allowing for full custom-made production that freely connects each process chamber to a proven mainframe (transport system).

  • Sputtering Equipment
  • Plasma surface treatment equipment

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Multi-purpose sputtering device for surface treatment, model STV6301.

Multi-purpose sputtering device for surface treatment, model STV6301.

A multipurpose sputtering device specialized for surface treatment of three-dimensional shaped parts, the entire outer surface, both sides of flat substrates, and film formation on three-dimensional shapes. It is also suitable for film formation on the inner surface of tumblers.

This is a dry surface treatment device that efficiently performs various coatings on three-dimensional shaped parts and molded products made of resin, glass, metal, etc. It can form thin films of various materials such as metals and ceramics over the entire surface. Features: ◎ Full surface film formation on three-dimensional shaped parts ◎ Coating of the inner surfaces of cups and tumblers using a special mechanism ◎ Naturally derived dry hydrophilic coating (plasma lava coating) ◎ Compatible with a wide range of applications from electronic substrates to resin decorations

  • Sputtering Equipment
  • Glass
  • fiber

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[Production Example] Large Shield Box - For Communication Inspection of Vehicle-mounted Radio Components

[Production Example] Large Shield Box - For Communication Inspection of Vehicle-mounted Radio Components

Communication inspection for automotive wireless components! Case study of a large shield box production.

This is an introduction to the production case of Protech's shield boxes and radio wave dark boxes. It is a large shield box for communication testing of vehicle-mounted wireless components. The dimensions are approximately W1200 × D2500 × H1400. This is a production case of a shield box made for millimeter-wave radar. For more details, please refer to the catalog or contact us.

  • EMC Testing

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[Production Example] Integrated Shield Box with Hand Press Handle

[Production Example] Integrated Shield Box with Hand Press Handle

Compact with handle addition and built-in jig! Shield box production case study.

This is an introduction to the production case of Protech's shield box and radio wave dark box. It is a shield box with an integrated hand press handle. This is a production case of a shield box made for RF characteristic testing and circuit board function testing. Since the inspection jig is built into the interior of the box and a lever for hand pressing is added to the exterior, it allows for a compact overall design. For more details, please refer to the catalog or contact us.

  • EMC Testing

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[Production Example] Window Type Shield Box

[Production Example] Window Type Shield Box

You can visually check the inspection status from the window! Example of shield box production.

This is an introduction to the production case of Protech's shield box and radio wave dark box. It is a production case of a window-type shield box for inspecting circuit boards of wireless communication devices. Inside, there is a fixture built in for inspecting the circuit boards of communication device terminals. The visible window allows for visual confirmation of the inspection status. For more details, please refer to the catalog or contact us.

  • EMC Testing

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Conveyor-type transport bar far-infrared conveyor furnace

Conveyor-type transport bar far-infrared conveyor furnace

Place the workpiece on the bar that is laid horizontally and transport it while irradiating with far infrared rays.

This is the optimal method when you want to minimize the contact area between the workpiece and the transport device.

  • Drying Equipment
  • Electric furnace

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