Peripheral Blade Cutting Device "SBC-150S"
Possible to manage preservation and improve quality! Compound semiconductor grinding machine that shapes core ingots.
The "SBC-150S" is a peripheral blade cutting device that cuts and shapes the ends of ingots and cores made of semiconductor compounds. The setup and alignment of the ingot (workpiece) are done manually, and the ends of the ingot are cut with a peripheral blade (diamond blade). By adding various sensors linked to an IoT system and performing data sensing, maintenance management and quality improvement are possible. 【Features】 ■ Cuts and shapes the ends of ingots and cores made of semiconductor compounds ■ Manual setup and alignment of the ingot (workpiece) ■ Cuts the ends of the ingot with a peripheral blade (diamond blade) ■ The cutting fluid is circulated from the coolant tank for cooling and cleaning *For detailed information and product catalogs, please access the related links.
- Company:イーアールエス
- Price:Other