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Dispenser×Shinwa Co., Ltd. - メーカー・企業と製品の一覧

Dispenserの製品一覧

1～11 件を表示 ／ 全 11 件

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Precision Dispenser Device Quspa-MsB [Solder Jet Compatible]

Precision Dispenser Device Quspa-MsB [Solder Jet Compatible]

【Top-Class Capability in the Coating Industry】 Achieved cream solder φ150μm! X-Y axis repeatability ±10μm Supports high-density mounting!

☆☆☆ Shinwa Ultra-Precision Dispenser MsB ☆☆☆ - LED Post-Processing / Semiconductor Post-Processing → Achieves high precision and high-speed processing! (X-Y Repetition Accuracy: ±10μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Increased stability of application amount through room temperature discharge! → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ Flip-chip Underfill / BGA Underfill ◆ General LED Phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream Solder (MIN: φ150μm) ◆ Ag Paste (MIN: φ120μm) ◆ UV Curing Resin, etc.

  • Assembly Machine

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Screw dispenser [LED post-process / board mounting]

Screw dispenser [LED post-process / board mounting]

Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!

【Dispensing Industry Achieves Capability No.1】 Shinwa Screw Dispenser - LED Post-Processing / PCB Assembly Process ▶ Adjustment of dispensing amount based on screw rotation (Compatible with high-viscosity materials) ▶ Reduction in the number of equipment investments through high-speed dispensing (Compared to air dispensers: 2 to 5 times processing capacity) ▶ Increased stability of dispensing amount through room temperature discharge ▶ Significant reduction in yield loss, increased production efficiency! 【Applications】 ■ Secondary Underfill ■ LED Phosphors (General) (SMD/Side View/Dam & Fill, etc.) ■ Cream Solder (φ250~φ300μm) * The dispensing diameter may vary depending on the solder particles used. ■ Ag Paste ■ UV Curing Resin, among others.

  • Bonding Equipment

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Hot melt dispenser

Hot melt dispenser

A dispenser compatible with all hot melt materials has finally arrived!

Dot dispensing, free line dispensing, and circular dispensing compatible 【Features】 ■ Achieves dispensing of φ0.20 mm or less ■ Realizes high-speed dispensing with piezoelectric drive system ■ Achieves low running costs 【Introduction of some contents of free sample test】 ■ Dispensing weight accuracy / Dispensing shape / Cycle time, etc. *For more details, please refer to the PDF document or contact us directly.

  • Circuit board processing machine

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Video Release: Dispensing of Lens Molds for LEDs

Video Release: Dispensing of Lens Molds for LEDs

Application of LED lens mold using a dispenser. Developed a new method! Successful cost reduction due to mold-less production!

- LED post-process / substrate mounting process → Adjustment of application amount based on screw rotation (Compatible with high-viscosity materials) → Reduction in the number of equipment investments through high-speed dispensing (Compared to air dispensers: 3 to 8 times processing capacity) → Increased stability of application amount through room temperature discharge! → Significant reduction in yield loss, increased production efficiency!

  • Assembly Machine

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Ultra High Viscosity Compatible Jet Dispenser 【3300A】

Ultra High Viscosity Compatible Jet Dispenser 【3300A】

Leave high-viscosity materials to us! A dispenser that expands dispensing possibilities.

Introducing the jet dispenser (QJC3300A) capable of handling a wide range of applications across various industries (semiconductors/LED post-processing/smartphone component assembly). It precisely applies high-viscosity materials that tend to become unstable. Additionally, it is equipped with micro-dispensing and speed capabilities, enhancing productivity. 【Features】 ◆ Dispensing capability of less than 0.001mg ◆ Achieves room temperature dispensing of high-viscosity materials using piezo technology 　→ Reduces liquid splatter onto flip chips and substrates ◆ Realizes high-speed dispensing ◆ Achieves low running costs ◆ Simple software programming 【Applications】 ◆ Flip chip underfill / BGA underfill ◆ LED phosphors in general (SMD/side view/flip chip LEDs, etc.) ◆ Cream solder ◆ Ag paste ◆ Moisture-proof materials (conformal dispensing) ◆ UV-curable resins, etc. We offer free sample testing for those considering a purchase. For more details, please request documentation or refer to the catalog.

  • Special Pump

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[Video Release: Encapsulant/Thermal Material] Screw Dispenser

[Video Release: Encapsulant/Thermal Material] Screw Dispenser

High-viscosity material high-speed drawing and dispensing Air dispenser comparison 3 to 8 times tact UP!

The screw dispenser precisely manages the amount of material applied by the rotation of the screw, allowing for stable application even with materials that are prone to changes over time, such as high-viscosity materials. (Example) Heat dissipation materials / Substrate mounting process ■ Air Dispenser ■ × Slow cycle time for discharging high-viscosity materials ■ Shinwa Screw Dispenser ■ ◎ Reduction in the number of equipment investments due to high-speed dispensing (Compared to air dispensers: 3 to 8 times processing capacity) ◎ Increased stability of application amount due to room temperature discharge ◎ Significant reduction in yield loss and increased production efficiency

  • Assembly Machine

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What is the difference between jet dispensing and printing methods? Let me explain it clearly!

What is the difference between jet dispensing and printing methods? Let me explain it clearly!

Attention smartphone component manufacturers and PCB assembly manufacturers! We are offering a free technical document featuring examples of improvements using the jet dispense method.

This document provides detailed foundational knowledge and mechanisms for solving dispensing position issues, accommodating uneven substrates, and improving yield by switching from the "screen printing method" to the "solder jet dispense method." It serves as a textbook-like resource that can address various problems faced by production sites. 【Target Audience】 Printed circuit board manufacturers, various module manufacturers, implementation in three-dimensional structures, FPC manufacturers, etc. 【Contents】 ■ Advantages / Disadvantages of the screen printing method ■ List of technologies made possible by jet dispensers ■ List of applied products (target applications) *For more details, please refer to the PDF document or contact us directly.

  • Circuit board processing machine

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Precision Dispenser Device GP2 [Board Mounting/LED Post-Processing]

Precision Dispenser Device GP2 [Board Mounting/LED Post-Processing]

The definitive low-cost dispenser that maintains high precision! Significant increase in production efficiency with high-speed dispensing! Ideal for solving coating issues in manufacturing sites!

☆☆☆Shinwa Precision Dispenser GP2☆☆☆ - Circuit Board Assembly Process & Post-LED Process → Achieves high precision and high-speed processing! (X-Y repeat accuracy: ±30μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Improved stability of application amount due to room temperature discharge! → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ General LED phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream solder ◆ Ag paste ◆ UV curing resin　　　　　　　　　　　　　　Others

  • Bonding Equipment

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Jet dispenser for cream solder application

Jet dispenser for cream solder application

Achieving improved production efficiency with high-speed ejection compatible with φ150μm and φ110μm dots.

The JET Dispenser 'SPJ-22A' from Shinwa boasts top-class performance in the dispensing industry. Even with continuous operation, the application shape remains stable, enabling production that maintains high quality and high precision. It achieves industry-leading micro-dispensing with dot sizes of φ150μm and φ110μm. It is adaptable to various materials, but particularly excels with cream solder, having a wealth of proven results. Being non-contact, it is suitable for a wide range of applications. We also conduct free sample tests regularly, so please feel free to contact us. 【Application Products】 ■ Flexible substrates (difficult-to-print bases such as warping and expansion) ■ Component mounting inside connectors (three-dimensional structures) ■ 0402/0201 chip component mounting ■ Various modules / LED modules, etc. 【Main Contents of Free Sample Tests】 ■ Dispensing weight accuracy / Dispensing shape / Cycle time, etc. *For more details, please refer to the PDF materials or contact us directly.

  • Circuit board processing machine

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Achieving significant reduction in takt time and fine dispensing! Ultra-precision dispenser.

Achieving significant reduction in takt time and fine dispensing! Ultra-precision dispenser.

Significantly reduce tact time with continuous dispensing! The ultra-precision dispenser device 'Quspa-LX' enables high-precision fine dispensing.

A new model of our ultra-precision dispenser device series 'Quspa', widely adopted in substrate mounting and underfill processes in semiconductors, has been released. It demonstrates excellent positional accuracy even during high-speed continuous dispensing, reducing the tact time by up to approximately 50% compared to conventional stop-and-go application (theoretical value). This contributes to improved productivity. *Compared to our conventional models. It also achieves high-precision solder jet application within a diameter of ±20μm. It is compatible with various dispensing materials, including epoxy thermosetting resins, cream solder, and silicone-based thermosetting resins. [Features] ■ Achieves astonishing miniaturization: Cream solder at 110μm, epoxy thermosetting resin at 80μm, UV adhesive at 100μm, etc. ■ Improved dynamic positional accuracy: Application position accuracy within 3σ10μm (during non-stop jet application). ■ High-speed network: Network processing speed improved by 16 times (theoretical value). ■ Tact time reduction: Significant reduction in tact time due to improved processing speed. ■ GUI iconization: Intuitive screen operation possible. ■ Supports more workpieces: Standard equipped with coaxial displacement sensors. *For more details, please download the materials or contact us.

  • Other semiconductor manufacturing equipment

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High-speed, micro dispensing at random application positions! Precision dispenser.

High-speed, micro dispensing at random application positions! Precision dispenser.

We propose a custom-made dispenser that fulfills your ideals.

A new model of our ultra-precision dispenser device, the 'Quspa' series, widely adopted in various manufacturing processes in semiconductors, has been launched. In addition to improvements in speed, precision, and miniaturization, our proprietary features and basic specifications can be customized as needed, providing overwhelming flexibility. 【Features】 ■ Custom-Made We propose specifications and functions tailored to your needs, such as Clean 100 and wafer transport compatibility. Dedicated designs are also available. ■ Achieving Incredible Miniaturization Maximizing the performance of the jet dispenser to achieve cream solder at 110μm, epoxy thermosetting resin at 80μm, UV adhesive at 100μm, and more. ■ Leave Complex Teaching to Us Smartly creating teaching for random application positions. Furthermore, the accuracy of non-stop application has dramatically improved. ■ Open Network Affordable and capable of connecting to various industrial networks. Enables integration of a wide range of products.

  • Other semiconductor manufacturing equipment

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