Multi-functional with a touch panel! One unit can handle various reflows such as air, nitrogen, vacuum, formic acid, and hydrogen!
The "RSS-3X210-S" is a solder reflow device that supports both formic gas and hydrogen gas reduction, with enhanced safety features.
It can process up to 12 wafers with a diameter of 100mm at once, and is also suitable for reflowing elongated objects such as printer heads and LED lighting.
Equipped with 18 high-speed infrared (IR) heaters under the hot plate, it maintains a uniform temperature even in a wide effective heating area, achieving stable heating that is less affected by the heat capacity of the objects.
【Features】
■ Effective heating area: 630mm x 210mm
■ Equipped with high-speed infrared (IR) heaters
■ Standard 7-inch touch panel
■ Active water cooling system
■ Capable of setting various reflow environments, including vacuum, formic acid, and hydrogen
*For more details, please refer to the PDF document or feel free to contact us.