Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.
61～80 item / All 80 items
Achieved stable bonding through high-rigidity horn clamp technology (rigid clamp)!
Adwells contributes to the advancement of technology development aimed at energy saving, electrification, and weight reduction in electronics products, automobiles, and industrial equipment through ultrasonic joining devices that enable room temperature, short time, and dissimilar metal joining.
Silicon wafer bonding via polysilazane
Recently, silicon wafers are required to be bonded to each other in the fields of semiconductors and MEMS devices. However, since the conventional wafer bonding technology requires bonding at a high temperature, thermal stress and warpage in the wafer makes the circuit failure. This is the simple wafer bonding technology which can be bonded to each other simply by overlapping and pressurizing the other silicon wafer via plasma treated polysilazane coating. This technology doesn't require the high-temperature bonding process, which is expected to increase the yield of semiconductor and MEMS devices.
This is a mass production ultrasonic metal joining device suitable for inverter production!
The "TB1000MS" is a mass production ultrasonic metal joining device suitable for inverter production. ■ It is suitable for electrode connections in high-temperature inverters and other applications. 【Features】 - Flexible production ⇒ Covers joining conditions suitable for various terminals with a single device - Strong against terminal float ⇒ Starts joining by pressing down on the float with an air servo - Color image processing ⇒ Stable alignment of terminals and horns through color image recognition *For more details, please download the PDF or feel free to contact us.
Compatible with a wide range of applications! A multifunctional ultrasonic welding system integrated in a compact design.
The "UP-Lite1500" is a metal joining device suitable for transitioning from power device development to mass production. This machine is designed as a standalone unit with the premise of being integrated into a mass production system. Development recipes can be directly transitioned to mass production. By adopting a unique rigid clamp method for holding the horn, it achieves high rigidity while maintaining a highly flexible cantilever structure. 【Features】 ■ Suitable for standalone and device integration ■ High rigidity with a highly flexible cantilever structure ■ Integrated joining system with monitoring capabilities ■ Compatible with a wide range of applications *For more details, please refer to the PDF materials or feel free to contact us.
Compact and easy to deploy in production and development sites! Equipped with comprehensive process monitoring features.
The standalone ultrasonic metal joining device 'UB050/300/500SA' is a compact standalone ultrasonic metal joining device that is easy to place in production and development sites. With a built-in linear encoder and rigid clamp in the joining head, it accurately controls the position of the joint using a high-rigidity ultrasonic horn unit. Additionally, it achieves a wide dynamic range through a low-friction pressurization mechanism, providing high responsiveness to deformation during joining, and improves joinability by increasing the load with linear pressurization as the joining progresses. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision position control ■ High-functionality load control ■ Comprehensive process monitoring capabilities *For more details, please refer to the PDF materials or feel free to contact us.
From R&D for power devices to mass production. Providing ultrasonic bonding equipment!
Ultrasonic bonding devices used in various fields, such as power module terminal bonding and dissimilar metal bonding. At Adwells, we offer a lineup of "ultrasonic bonding devices" for a wide range of applications from R&D to mass production. Each device is compatible with terminal bonding, heat sink formation, DMB bonding, and more. We also conduct evaluation tests with demo units, so if you are interested, please contact us using the form below. 【Features of the device】 Terminal Bonding - Covers optimal bonding conditions for various terminals with a single device - Starts bonding by pressing down on the float with grounding load Heat Sink Formation - Directly forms fins (pins/ribbons) on the back surface of the substrate - High thermal conductivity (37 times that of TIM) due to direct bonding DMB Bonding - Can bond materials that can only handle low load and low output - No surface damage to materials during bonding: patternless horn - High thermal conductivity: about 7 times that of solder - Large area bonding *For more details, please refer to the PDF document or feel free to contact us.
Fully automatic, high-speed operation! Adjustable powder filling depth and molded product thickness during operation.
In the "3-Mode Press," it is possible to mold shapes on both sides, such as ball shapes, and three types of molding methods can be selected. Molding using double action is also possible. Additionally, automatic transport of molded products via vacuum is available. Please feel free to contact us when you need assistance. 【Features】 ■ Easy offline assembly, replacement, and adjustment of molds ■ Easy selection and switching of 3 modes ■ High yield rate ■ Minimal variation in molded products (Weight: within 1%, Thickness: within 25μm) ■ High production through high-speed multiple part handling ■ Sharp edges of molded products are ensured (no post-processing required) *For more details, please refer to the PDF document or feel free to contact us.
Comprehensive service solution center for all industrial equipment and more.
At the Asahi Kogyo Group, we have established a Solution Center as a distribution center for technology and skills, gathering our many years of experience and accumulated know-how to earn your continued support. Equipped with various advanced facilities, we provide high-quality manufacturing through a network of specialized factories with unique characteristics. [Factory List] ■ Kanto Solution Center ■ Kansai Solution Center ■ Vacuum Equipment Factory ■ Precision Sheet Metal Factory ■ Scientific Instruments Factory ■ Processing Center *For more details, please refer to the PDF document or feel free to contact us.
Join wafers and bulk without applying heat!
This product is a mass production machine-based device that activates the bonding surface with an Ar beam under ultra-high vacuum (10^-6 Pa) and joins wafers and bulk materials at room temperature and without pressure. Since it joins materials without heating, it contributes to shortening and streamlining the production process. We have infused our long-cultivated ultra-high vacuum technology to achieve high operability and maintainability. 【Features】 ■ Can bond materials with different thermal expansion rates due to non-heating ■ Bonding time per set is approximately 5 to 10 minutes ■ Device returns to operation about 12 hours after maintenance ■ Numerous bonding achievements with various materials ■ Many delivery records in production sites *For more details, please download the PDF or feel free to contact us.
Reliable and fast ultrasonic wire bonding machine!
We handle the "Ultrasonic Metal Welding Machine." The ultrasonic metal welding machine "GMX-W1" is the culmination of Branson's extensive experience. It features advanced functions that enable reliable and high-speed wire bonding. 【Features】 ■ Ultrasonic Metal Welding Machine "GMX-W1" - Color LED indicators provide a quick overview of bonding quality and equipment - Enables rapid setup and easy bonding operations *For more details, please refer to the PDF document or feel free to contact us.
Small-type ultrasonic welding machine - Achieves delicate bonding while minimizing damage to the workpiece.
The 40MA is a compact ultrasonic metal spot welding machine. It is equipped with a "nodal support mechanism" that maintains the parallelism of the anvil during welding by supporting the node of the horn with a dedicated vibration block, ensuring stability in the welding process. It can also be used as a standalone actuator for integration into automated systems. 【Product Features】 • Nodal Support Mechanism - The nodal support mechanism supports the node of the horn with a dedicated vibration block, reducing bending of the welded parts by maintaining the parallelism of the anvil. • Polar Mounting Method - By adopting the polar mounting method, high amplitude welding is achieved, enabling more efficient metal joining. • Two-Way Work Path Line - By securing a work path line in two directions, integration into automated systems becomes easier. • Versatile Welding Modes - Various welding control options including time, energy, and peak power. • Digital Amplitude Control - Amplitude settings can be finely adjusted in a range from 10% to 100%. • Amplitude Stepping - Amplitude can be changed during welding according to various conditions such as time. • Alarm Message - Alarm notifications are triggered if the set results are not achieved.
![[Information] Ultrasonic Metal Joining Technology Evolving with the EV Industry](https://image.mono.ipros.com/public/product/image/8c2/2000882485/IPROS71958193323301131305.png?w=280&h=280)
From "Joining of metal foil and tabs" to "Joining of thick wires and terminals." Here are examples of the application of ultrasonic metal joining.
This document explains the ultrasonic metal joining technology that evolves alongside the EV industry. It introduces various methods such as "joining metal foils and tabs," "joining busbars," and "joining thick wires and terminals," and provides detailed information including the ultrasonic metal joining process. Please feel free to download and read it. 【Contents】 ■ Joining foils and tabs in rectangular, cylindrical, and pouch types ■ Busbar joining ■ Joining thick wires and terminals ■ The process of ultrasonic metal joining ■ Introduction of the new "Direct Press" machine *For more details, please refer to the PDF document or feel free to contact us.
No need for tilt angle! Utilized in various fields from the EV automotive industry to aerospace.
We have developed the 'SSW', which demonstrates high performance simply by being mounted on the ATC of existing cutting machines, eliminating the need for dedicated FSW machines or FSW hybrid machines. It does not require a tilt angle and enables overwhelming "high-speed joining, high-strength joining, and low-temperature joining." It is utilized in various fields, from the EV automotive industry to aerospace. 【Features】 ■ Wide joining range, making it easy to establish appropriate conditions for joining ■ Low defect occurrence rate at the joint ■ Capable of obtaining advantageous setting condition ranges *For more details, please refer to the PDF document or feel free to contact us.
[Catalog and Comparison Materials Available] To all customers who do not want to give up on FSW! Achieving low-temperature joining with synchronized stirring joining technology.
We have developed a Synchronized Stir Welding Tool Holder that far exceeds the general characteristics of FSW, which can be simply attached to the ATC of existing cutting machines without the need for dedicated FSW machines or FSW hybrid machines. It does not require a tilt angle and enables overwhelming "high-speed joining, high-strength joining, and low-temperature joining" compared to conventional FSW. It is utilized in various fields, from the EV automotive industry to aerospace. Additionally, our R&D center is equipped with a machining center fitted with the SSW Tool Holder, allowing us to model joining tools and propose joining parameters tailored to customer needs. 【Features】 ■ Synchronizes with the desired "direction and speed" of stirring, actively stirring the material ■ Joining speed is in the high-speed range ■ Joining with a small shoulder diameter is possible ■ Joining in a low heat input range is possible ■ A wide parameter range is available without the need for a forward angle (tilt angle) *For more details, please refer to the PDF document or feel free to contact us.
Perform a joint at a depth of 4mm using tools and conditions of the same shape, and compare the loads in the vertical direction and the travel direction!
We will introduce a comparison of the joining load between FSW and SSW. It is possible to reduce the vertical load applied during joining by more than 50%, and the required pressing pressure can be reduced to about half. Additionally, the joining load on the drive shaft side is approximately 3KN for FSW, while it is less than 1KN for SSW, meaning that SSW reduces the load to less than one-third compared to FSW. [Overview] ■ It is possible to reduce the vertical load applied during joining by more than 50% ■ The required pressing pressure can be reduced to about half ■ The joining load on the drive shaft side is reduced to less than one-third *For more details, please refer to the PDF document or feel free to contact us.
Wafer surface modification and precision bonding equipment
A device for precision bonding of wafer-level silicon, metals, quartz, glass, etc., after surface modification treatment in a vacuum to any atmosphere. ■□■Features■□■ ■Compatible with various 4 to 6-inch wafer-level bonding ■Pre-treatment function through surface modification suitable for any material ■Bonding system equipped with uniform heating and pressurization functions ■Heating and cooling system to reduce residual stress ■Compatible with ultra-high vacuum to pressurized atmosphere ■Arbitrary position pressurization and voltage application control mechanism For custom-made semiconductor manufacturing equipment, scientific instruments, and accessories, please leave it to us. For more details, please contact us.
![[Research Material] Global Market for Friction Stir Welding Equipment](https://image.mono.ipros.com/public/product/image/e29/2000846126/IPROS83108606220092829914.jpeg?w=280&h=280)
Global Market for Friction Stir Welding Devices: Desktop Equipment, Gantry Equipment, Others, Aerospace, Automotive, Shipbuilding, Railways, Others
This research report (Global Friction Stir Welding Equipment Market) investigates and analyzes the current state and outlook for the global market of friction stir welding equipment over the next five years. It includes information on the overview of the global friction stir welding equipment market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the friction stir welding equipment market include desktop equipment, gantry equipment, and others, while the segments by application cover aerospace, automotive, shipbuilding, railways, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of friction stir welding equipment. The report also includes the market share of major companies in the friction stir welding equipment sector, product and business overviews, and sales performance.
Improving the battery performance of electric bicycles, achieving high-speed and high-quality bonding.
In the electric bicycle industry, there is a demand for high-performance batteries, and the quality of electrode bonding is crucial. In particular, the reliability of the joints is essential for achieving long life and high output. Poor bonding can lead to decreased battery performance and failures. Our ultrasonic metal bonding machine enables stable bonding of battery stack foils and TAB bus bar electrodes, contributing to improved efficiency in secondary battery power extraction. 【Application Scenarios】 - Manufacturing batteries for electric bicycles - Production of high-output, long-life batteries - High-quality bonding in mass production systems 【Benefits of Implementation】 - Improved battery performance - Increased efficiency in the manufacturing process - Enhanced product reliability
