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Joining Equipment Product List and Ranking from 31 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Joining Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. アドウェルズ Fukuoka//Manufacturing and processing contract
  3. 精電舎電子工業 本社、柏工場、営業所（仙台、北関東、東京、湘南、名古屋、大阪、広島、福岡）、室蘭事務所 Tokyo//Industrial Machinery
  4. 4 日本エマソン株式会社　ブランソン事業本部 Kanagawa//Industrial Machinery
  5. 5 アトーテック　 Tokyo//Industrial Machinery
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Joining Equipment Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. "Ultrasonic Composite Vibration Joining Technology" <Technical Explanation Document Provided>
  2. DMB bonding application using ultrasonic bonding アドウェルズ
  3. First, give it a try!! Ultrasonic metal joining test [Now accepting applications] 精電舎電子工業 本社、柏工場、営業所（仙台、北関東、東京、湘南、名古屋、大阪、広島、福岡）、室蘭事務所
  4. Introduction to Heat Sink Formation Technology Using Ultrasonic Welding アドウェルズ
  5. 4 40MA Ultrasonic Metal Welding Machine 日本エマソン株式会社　ブランソン事業本部

Joining Equipment Product List

16～30 item / All 76 items

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Ultrasonic servo welder

Ultrasonic servo welder

Achieving intelligent welding control! Promising stable ultrasonic welding with high strength and high airtightness.

Our company has developed a fully digitalized servo press as an ultrasonic welder. Ultrasonic welding requires micron-level high responsiveness for pressure application, but our unique control circuit utilizing the servo press enables precise ultrasonic welding. The smooth operation of the ultrasonic welder servo press digitizes speed control during ultrasonic welding, allowing us to suppress the previously unavoidable clouding phenomenon and ensuring stable ultrasonic welding with high strength and high airtightness at accurate welding sizes. 【Product Lineup】 ■ 20KHz Ultrasonic Servo Welder ■ 40KHz Ultrasonic Servo Welder ■ Servo Press Ultrasonic Welder *For more details, please refer to the PDF materials or feel free to contact us.

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  • Welding Machine

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Ultrasonic welder dedicated kit for automatic machines

Ultrasonic welder dedicated kit for automatic machines

A compact and highly rigid pressurized actuator! Cost reduction is possible.

We would like to introduce our "Ultrasonic Welder Dedicated Kit" that we handle. You can choose specifications tailored to your automatic machine, allowing for cost reduction. Additionally, a single ultrasonic oscillator can switch between multiple horns in sequence, enabling further cost savings. Please feel free to contact us when you need assistance. 【Features】 ■ Stack that connects the converter, booster, and horn ■ Oscillator unit that can be integrated into the control panel *For more details, please refer to the PDF document or feel free to contact us.

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  • Welding Machine

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G Space Data Solution Center

G Space Data Solution Center

Capture various challenges related to the use of geospatial information and provide comprehensive support for problem-solving!

Aisan Technology has established the "G Space Data Solution Center." We will address various challenges related to the use of geospatial information and actively participate in research and development as well as demonstration experiments to comprehensively support problem-solving, aiming for high-precision and smooth data production. 【Features】 ■ Support for demonstration of quasi-zenith satellite utilization ■ Position alignment ■ Map quality evaluation ■ Geodetic considerations and publication *For more details, please refer to the PDF materials or feel free to contact us.

  • Other measurement, recording and measuring instruments
  • 3D measuring device

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Room Temperature Wafer Bonding Device BOND MEISTER【Semiconductor Manufacturing】

Room Temperature Wafer Bonding Device BOND MEISTER【Semiconductor Manufacturing】

A room temperature wafer bonding device that opens new horizons in the bonding process. Supporting device development with high reliability, bonding quality, and bonding support services!

Joining is performed by activating the surface of the joining materials with an ion beam in a vacuum. ■Application in MEMS wafer-level packaging - Packaging can be done at the wafer level before dicing, simplifying subsequent processes. - Since no heating is involved, thermal distortion is eliminated even for fine structures. - Increased productivity as there is no need for heating and cooling time. - Ideal for the development of stacked high-integration MEMS. ■Application to other high-functionality devices - Capable of joining a wide range of materials such as metals, quartz, sapphire, and oxide single crystals. - High yield is achievable due to the absence of thermal distortion. - Dissimilar materials can also be joined at room temperature, enabling previously impossible joints and enhancing design flexibility for devices. A lineup of equipment that maximizes the benefits of the room temperature joining process (all-in-one setup including alignment equipment, wafer transport robots, and bonding mechanisms). For more details, please contact us or download the 'catalog' for confirmation.

  • others

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Metal Joining Machine Ultrasonic Fully Automatic Metal Bonder REBO-Metal-S2

Metal Joining Machine Ultrasonic Fully Automatic Metal Bonder REBO-Metal-S2

With the experimental equipment available, ideal metal bonding can be achieved through solid-phase joining using ultrasonic vibrations, resulting in a clean and low-loss process.

The fully automatic ultrasonic metal bonder "REBO-Metal-S2" achieves optimal bonding conditions for various workpieces (such as power module terminal sections, bus bars, and metal foils) through a variety of oscillation triggers. It is equipped with X, Y, Z, and θ axes, allowing for automatic recognition and bonding at any desired point. 【Features】 ○ Achieves clearance for bonding power module terminal sections by adopting a tool-type horn. ○ Bonding tools can be easily replaced with a single screw. ○ Capable of saving and evaluating waveform data for all bonding points. ○ Bonding conditions can be set for each bonding point. ○ Equipped with X, Y, Z, and θ axes, allowing for automatic recognition and bonding at any desired point.

  • Bonding Equipment

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Mini Metal Bonder Metal-80

Mini Metal Bonder Metal-80

Ideal for precision joining experiments such as micro work and thin material bonding. The waveform during joining is output via a BNC terminal, allowing monitoring by connecting external devices.

Equipped with the vibration system of the REBO series wire bonder, it supports spot welding. Monitoring of four types of waveforms during welding is possible. Note: Measurement devices such as oscilloscopes are required for monitoring. It achieves a lower pressure setting compared to air press type metal joining machines (compared to our company). The joining horn uses interchangeable tools, allowing access to deep workpieces (approximately 58 mm from the horn to the tool tip). The Z-axis lifting stroke is approximately 20 mm. External control via PLC enables integration into automated systems and repurposing for mass production machines.

  • Lithium-ion battery

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Ultrasonic Seam Welding Machine SB200/400CE

Ultrasonic Seam Welding Machine SB200/400CE

Ultrasonic seam welding machine that transforms manufacturing with rotary ultrasonic welding.

The ultrasonic seam welding machine 'SB200/400CE' is ideal for the lamination of power device materials and the butt connection of materials. By rotating the joint point, it enables large area welding and allows for continuous welding of roll-shaped materials and other continuous materials. 【Features】 - Achieves large area welding - Enables continuous welding - Equipped with joint quality management functions For more details, please contact us or download the catalog.

  • Other processing machines

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Standalone Ultrasonic Welding Machine UB2000/3000/5000SA

Standalone Ultrasonic Welding Machine UB2000/3000/5000SA

In addition to joining the same type of metal, welding enables the joining of different types of metals that is difficult to achieve!

The "UB2000/3000/5000SA" is an ultrasonic welding machine suitable for secondary batteries and power-related devices. Equipped with comprehensive process monitoring functions, it allows for detailed understanding of process operations through various sensor information built into the device, making it effective for process startup and mass production management. Additionally, the built-in linear encoder and rigid clamp in the welding head accurately control the position of the weld joint with a high-rigidity ultrasonic horn unit. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision position control ■ High-performance load control ■ Comprehensive process monitoring functions *For more details, please refer to the PDF materials or feel free to contact us.

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  • Welding Machine

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Ultrasonic Metal Joining Device UB2000/3000/5000LS

Ultrasonic Metal Joining Device UB2000/3000/5000LS

Ideal for power devices! The ultrasonic head is highly rigid and compact!

The ultrasonic metal joining device 'UB2000/3000/5000LS' is an ultrasonic metal joining device suitable for power devices. The ultrasonic horn is directly clamped by a rigid clamp. This results in the ultrasonic head being highly rigid and compact. Additionally, it achieves a wide dynamic range through a low-friction pressurization mechanism, providing high responsiveness to deformation during joining. The joining capability is enhanced by linear pressurization that increases the load as the joining progresses. 【Features】 ■ High rigidity horn clamp mechanism ■ High precision position control ■ High functionality load control ■ Comprehensive process monitoring capabilities *For more details, please refer to the PDF materials or feel free to contact us.

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  • Welding Machine

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Introducing the latest applications of next-generation secondary batteries!

Introducing the latest applications of next-generation secondary batteries!

From research and development of next-generation secondary batteries to mass production. Providing ultrasonic joining devices/ultrasonic cutters!

In the manufacturing of "next-generation secondary batteries," including all-solid-state batteries, various forms of joining and material cutting are required to meet high quality standards. Additionally, when performing joining or cutting processes, measures must be taken in the manufacturing equipment to prevent the generation of hydrogen sulfide due to reactions with moisture in the air. Our company offers "ultrasonic bonding devices and ultrasonic cutters" designed for next-generation secondary battery specifications, aimed at the joining/cutting of electrode foils, joining between battery terminals, and cutting of green sheets. Each device utilizes our unique technology based on ultrasonic waves, enabling high-quality direct bonding at room temperature and cutting without dragging the material. We also provide a dry environment where the evaluation conditions and equipment specifications can be verified with actual machines, allowing for consideration of implementation. 【Features of the Equipment】 <Joining> ■ Ultrasonic bonding device capable of wide-ranging foil bonding and compatible with dry environments <Cutting> ■ Ultrasonic cutter capable of straight/shape cutting and suitable for dry environments ■ Can cut negative electrode foils, positive electrode foils, Li foils, etc. <Fusing> ■ Can continuously and freely fuse separator materials through programming For more details about the products, please refer to the materials. Feel free to contact us with any inquiries.

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  • Plastic processing machines (cutting and rolling)

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Introduction to Heat Sink Formation Technology Using Ultrasonic Welding

Introduction to Heat Sink Formation Technology Using Ultrasonic Welding

Directly forming heat dissipation fins (pin fins/ribbon fins) on the back of the substrate achieves a high thermal conductivity (approximately 34 times that of TIM and about 7 times that of solder).

The Adwells ultrasonic pin bonding device PB2000MS and ribbon bonder RB0300SS can directly form heat dissipation pins and substrate mounting pins on ceramic substrates and organic substrates. With ultrasonic bonding, it is possible to form heat sinks without using TIM or solder, achieving a thermal conductivity approximately 34 times that of TIM and about 7 times that of solder. (Figure 1) The formation of heat sinks through ultrasonic bonding comes in two types: pin bonding and ribbon bonding. In pin bonding, simultaneous bonding of up to 4 pins can be achieved at once, allowing for programmable heat sink formation. (Photo 1) In ribbon bonding, Cu ribbons or Al ribbons are continuously bonded to form heat sinks. The device is equipped with a multi-feeder, allowing for automatic switching of ribbon materials and thicknesses. (Photo 2) ~ For more details, please download the PDF document and check it out ~ *) We also accept evaluation tests using demo machines, so if you are interested, please contact us using the form below.

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  • Welding Machine

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Ultrasonic Pin Joining Device PB2000MS

Ultrasonic Pin Joining Device PB2000MS

In the data settings, the pin connection position can be freely changed! It is possible to create heat sinks with a high degree of freedom.

The "PB2000MS" is an ultrasonic bonding machine for forming heat sinks compatible with Cu pins, Al pins, and hollow pins. With a dedicated horn for pin bonding, it allows for simultaneous bonding of up to 4 pins. It forms heat sinks at a rate of 4800 UPH. It efficiently bonds metal pins onto the substrate while picking up metal pins from a tray that holds the pins. 【Features】 ■ Simultaneous bonding of multiple pins ■ Programmable pin formation ■ Tray pin supply ■ Parts feeder pin supply (optional) *For more details, please download the PDF or feel free to contact us.

  • Other assembly machines

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DMB bonding application using ultrasonic bonding

DMB bonding application using ultrasonic bonding

Welding is possible under low joining conditions! It is possible to join materials with a large area and thickness.

We would like to introduce our technology, "DMB Joining Application using Ultrasonic Welding." With Adwells' ultrasonic welding devices "UB2000/3000/5000LS," we achieve the joining of DMB sheets made from copper (Cu) and aluminum (Al) for power devices and areas requiring low thermal conductivity. The fine protrusions on the DMB sheets serve as the joining points, making it easier for materials to bond together and allowing for adaptation to various applications. 【Features】 ■ Can join materials that can only withstand low loads and low power ■ Does not scratch the surface of materials ■ Can join materials with a large surface area ■ Can join thicker materials ■ Can join devices that are molded *For more details, please download the PDF or feel free to contact us.

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  • Other processing machines

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Direct bonding of substrates using ultrasonic waves.

Direct bonding of substrates using ultrasonic waves.

Introducing an application that uses ultrasonic bonding to connect flexible substrates with low resistance!

We would like to introduce our "Ultrasonic Direct Bonding Technology for Substrates." In comparison with our TEG substrates, the connection resistance achieved through ultrasonic bonding is 14mΩ, which is a 70% reduction compared to ACF connections at 52mΩ. This contributes to the high performance of electronic devices, such as high-speed data transfer. Additionally, the bonding time with ultrasonic bonding is approximately 0.2 to 1 second, allowing for a significant reduction in time compared to ACF connections that require resin melting and curing. 【Features】 ■ Low resistance bonding: 70% reduction compared to ACF ■ Short bonding time: bonding in under 1 second ■ Room temperature bonding: no bonding misalignment due to thermal expansion of the substrate *For more details, please download the PDF or feel free to contact us.

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  • Other processing machines

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