We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Joining Equipment.
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Joining Equipment Product List and Ranking from 33 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

Joining Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. ユーシー・ジャパン Kanagawa//Testing, Analysis and Measurement
  2. 精電舎電子工業 本社、柏工場、営業所（仙台、北関東、東京、湘南、名古屋、大阪、広島、福岡）、室蘭事務所 Tokyo//Industrial Machinery
  3. 京浜ラムテック Kanagawa//Manufacturing and processing contract
  4. 4 アドウェルズ Fukuoka//Manufacturing and processing contract
  5. 5 日本エマソン株式会社　ブランソン事業本部 Kanagawa//Industrial Machinery
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Joining Equipment Product ranking

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. Ultrasonic metal joining machine suitable for battery laminated foil and TAB busbar electrode bonding. ユーシー・ジャパン
  2. Ultrasonic Metal Joining [*Technical Data Gift*] 精電舎電子工業 本社、柏工場、営業所（仙台、北関東、東京、湘南、名古屋、大阪、広島、福岡）、室蘭事務所
  3. First, give it a try!! Ultrasonic metal joining test [Now accepting applications] 精電舎電子工業 本社、柏工場、営業所（仙台、北関東、東京、湘南、名古屋、大阪、広島、福岡）、室蘭事務所
  4. For the welding industry: New joining machine "SSW Tool Holder" 京浜ラムテック
  5. 4 Ultrasonic Metal Joining Machine "Large Diameter Wire Harness Joining Machine" 精電舎電子工業 本社、柏工場、営業所（仙台、北関東、東京、湘南、名古屋、大阪、広島、福岡）、室蘭事務所

Joining Equipment Product List

31～60 item / All 80 items

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Direct bonding of substrates using ultrasonic waves.

Direct bonding of substrates using ultrasonic waves.

Introducing an application that uses ultrasonic bonding to connect flexible substrates with low resistance!

We would like to introduce our "Ultrasonic Direct Bonding Technology for Substrates." In comparison with our TEG substrates, the connection resistance achieved through ultrasonic bonding is 14mΩ, which is a 70% reduction compared to ACF connections at 52mΩ. This contributes to the high performance of electronic devices, such as high-speed data transfer. Additionally, the bonding time with ultrasonic bonding is approximately 0.2 to 1 second, allowing for a significant reduction in time compared to ACF connections that require resin melting and curing. 【Features】 ■ Low resistance bonding: 70% reduction compared to ACF ■ Short bonding time: bonding in under 1 second ■ Room temperature bonding: no bonding misalignment due to thermal expansion of the substrate *For more details, please download the PDF or feel free to contact us.

  • Other processing machines
  • Joining Equipment

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Ultrasonic Process Optimization System 'UMOS'

Ultrasonic Process Optimization System 'UMOS'

For those struggling with setting joining and cutting conditions tailored to various materials!

We would like to introduce our ultrasonic process optimization system, 'UMOS.' With this system, even those with limited experience can easily optimize bonding and cutting conditions. By combining the output of bonding results and cutting results with input conditions, we can improve the accuracy of optimal conditions. For example, if a challenge arises in the bonding process where oxidation or deformation needs to be minimized, UMOS Navi will suggest adjustments to process conditions (load, amplitude, time) by selecting the direction of optimization towards the suppression of oxidation or deformation. [For these concerns] ■ Struggling to set bonding and cutting conditions tailored to various materials ■ Optimization methods change when the person in charge changes ■ Bonding and cutting conditions become personalized *For more details, please refer to the related links or feel free to contact us.

  • Other processing machines
  • Joining Equipment

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[Equipment Information] Large Press

[Equipment Information] Large Press

We have C-type presses, crank presses, automatic press lines, image positioning presses, and more!

At Yodogawa Sansei Co., Ltd., we own "large presses." We have various types of presses, including C-type presses and crank presses, with pressing capacities ranging from 45 tons to 110 tons. Additionally, we have a progressive line that utilizes parallel C-type presses for processes such as hole drilling, half-cutting, and outline cutting, allowing for specialized processing. 【Equipment Owned】 ■ C-type presses, crank presses ■ Automatic press line ■ Image positioning press ■ Roll press *For more details, please download the PDF or feel free to contact us.

  • Press Dies
  • Other contract services
  • Joining Equipment

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[Manufacturing Business] Lens Bonding <Monthly Production Capacity: 100,000 Pieces>

[Manufacturing Business] Lens Bonding <Monthly Production Capacity: 100,000 Pieces>

Hard rock, Norland, and UV adhesives and epoxies! Conducting adhesion, centering, and final inspection.

In our manufacturing business, we offer "lens bonding." We perform bonding, centering, and final inspection using UV adhesives such as Hard Rock and Norland, as well as epoxy. We produce high-quality products more quickly and accurately. Please trust us with strict cost requirements, different models, small lots, and prototypes. 【Overview】 ■ Monthly production: 100,000 pieces (including partner factories) ■ Circular sizes: φ2.4mm to φ150mm ■ Special flat glass ■ Special prisms *For more details, please refer to the related links or feel free to contact us.

  • lens
  • Joining Equipment

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Electric Heating Joining Device "R-2000"

Electric Heating Joining Device "R-2000"

It is an instant heating device used for bonding resin and metal!

The "R-2000" is a conductive heating joining device used for the bonding of molded resin and metal. It enables the joining of complex structures, such as three-dimensional (3D) shapes, which were previously impossible to achieve relatively easily. Additionally, it expands the freedom of product design and product engineering, allowing for simplification of shapes, reduction of assembly work, decrease in the number of screw fastening points, weight reduction, and differentiation from competitors, among various other benefits. 【Features】 ■ Achieves high-precision instant heating ■ Easy operation with a touch panel ■ Custom jig design tailored to the workpiece is possible ■ Capable of joining various resins and metals *For more details, please refer to the catalog or feel free to contact us.

  • Company：ECO-A
  • Price：Other
  • Welding Machine
  • Joining Equipment

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Friction Stir Welding Device "Robot FSW"

Friction Stir Welding Device "Robot FSW"

A diverse lineup from small robots for FSW processing of thin plates to large robots for thick plates.

The "Robot FSW" is a compact robotic system suitable for joining thin materials such as aluminum. It employs high-quality friction stir welding (FSW) technology. It also performs burr removal processing and cutting operations through automatic tool exchange. 【Features】 ■ Small installation area, achieving space-saving ■ Improved versatility in line construction ■ Expanded processing range possible by combining with robot travel axes ■ Increased process capacity by installing multiple robots within the process ■ Capable of performing tasks other than processing, such as workpiece loading and unloading *For more details, please download the PDF or contact us.

  • Other industrial robots
  • Joining Equipment

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GMX-20DP Ultrasonic Metal Welding Machine

GMX-20DP Ultrasonic Metal Welding Machine

Low power consumption and high power. The latest model of ultrasonic spot metal welding machine.

The GMX-20DP is a newly developed ultrasonic spot welder by Branson. With its unique mechanical design and excellent manufacturing technology, the GMX-20DP achieves high-quality bonding. Since ultrasonic metal bonding is a solid-state bonding process, it has the advantage of lower electrical resistance at the joint compared to other methods, as well as very low power consumption. With over 40 years of experience in the field of metal bonding, our company has provided numerous devices for the assembly processes of high-precision industrial products such as batteries, wire harnesses, and solar panels for many customers. For more details, please refer to the PDF document or feel free to contact us.

  • Welding Machine
  • Joining Equipment

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Solving various challenges of joining! 'TOX Joining'

Solving various challenges of joining! 'TOX Joining'

We have a track record of reducing running costs by approximately 30% ★ Introduction of case studies on solving issues such as improving yield and reducing post-processing steps.

TOX joining is a mechanical joining method that utilizes the plastic deformation of the base material. 【Customer Issues Resolved】 1. Aiming to reduce the cost of welding press parts (automobile manufacturer) → Reduced running costs per point by approximately 30% with TOX joining. 2. Wanting to use high corrosion-resistant plated steel sheets, but welding quality is unstable (automotive parts manufacturer) → Stabilized quality with TOX mechanical joining, improving yield rates. 3. Post-processing after welding plated steel sheets like ZAM is cumbersome (building materials manufacturer) → No peeling of plating with TOX mechanical joining, eliminating post-processing steps. 4. Looking to eliminate the riveting process and reduce running costs (home appliance manufacturer) → Replaced rivets costing about 10 yen each with TOX joining, reducing rivet costs. 5. Wanting to increase the cycle of the welding process (home appliance manufacturer) → Simultaneous multi-point pressing with TOX dedicated molds, reducing cycle time to less than half. 6. Wanting to join plate assemblies with thickness differences and unstable welding quality (automotive parts manufacturer) → Achieved joining of steel plates with thicknesses of t0.5 and t2.3 through TOX mechanical joining. If you are interested in these case studies, please contact us for more information.

  • Other machine elements
  • Joining Equipment

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Micro-diffusion bonding device

Micro-diffusion bonding device

Micro-diffusion bonding device

【Specifications】 Pressurization method: Weight method using weights and leverage Overheating dimensions: 40 diameter x 40 height Overheating method: High frequency, programmable temperature control Maximum overheating temperature: 1400℃ Vacuum level: x10-5 PA High frequency power supply: 20KW

  • Mixer/agitator
  • Granulating Equipment
  • Joining Equipment

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Anode bonding device

Anode bonding device

Anode bonding device

【Specifications】 - High voltage can be easily applied to heated silicon substrates and glass substrates for bonding. - Compact and economical type suitable for research and development. - The alignment section is a small tabletop design. - Standard sample size is 4 inches, with an option for up to 6 inches. Applications - Various sensors, micromachines, biomaterials, and various optical applications.

  • Hydraulic Equipment
  • Granulating Equipment
  • Other semiconductor manufacturing equipment
  • Joining Equipment

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Join without melting materials! Vacuum equipment "Diffusion Bonding Device"

Join without melting materials! Vacuum equipment "Diffusion Bonding Device"

It is possible to join different metal materials that are difficult to weld, as well as to join complex shapes and small materials.

The "Diffusion Bonding Device" is a product that uses our unique vacuum technology to bond metal materials at the atomic level, allowing for the bonding of different materials as well. It minimizes material deformation, which is a common issue in welding, and enables multi-layer stacking, making high-precision processing and bonding of small materials possible. 【Features】 ■ Fine temperature control through programming ■ Bonding without melting the materials ■ Available for lease options *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • Mixer/agitator
  • Granulating Equipment
  • Joining Equipment

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Vacuum diffusion bonding device

Vacuum diffusion bonding device

Diffusion bonding of various metals! Introducing micro-diffusion bonding devices and high-frequency heating diffusion bonding furnaces.

We would like to introduce the vacuum diffusion bonding equipment handled by Atotech. The "micro diffusion bonding device," which bonds metals at the atomic level, is designed and manufactured using our vacuum technology. It is capable of bonding the same materials as well as different materials. Additionally, the "high-frequency heating diffusion bonding furnace" can efficiently perform diffusion bonding in a short time and can be used for diffusion bonding of various metals up to φ30. 【Micro Diffusion Bonding Device Specifications】 ■ Pressurization method: Weighted method using weights and levers ■ Overheating dimensions: 40φ×40H ■ Overheating method: High frequency, programmable temperature control ■ Maximum overheating temperature: 1400℃ ■ Vacuum level: ×10-5PA ■ High-frequency power supply: 20KW *For more details, please refer to the related links or feel free to contact us.

  • Vacuum Equipment
  • Joining Equipment

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Ultrasonic Metal Joining Explanation Document: "Joint Quality Can Be Improved with Narl Patterns"

Ultrasonic Metal Joining Explanation Document: "Joint Quality Can Be Improved with Narl Patterns"

Explaining the importance of the tool horn in ultrasonic metal joining and how the joining quality varies with the nal pattern.

Our company has been engaged in the production of horns for ultrasonic welding for over 60 years. Currently, we are offering technical materials that explain the horns used in ultrasonic welding and the nal pattern, which greatly affects the quality of the weld. [Overview of the Materials] ■ What is ultrasonic metal welding? ■ The tool horn significantly influences the quality of the weld. ■ The quality can change with just one nal pattern. ■ To create better products. *The materials can be viewed via "PDF Download." *We will be exhibiting at "BATTERY JAPAN [Spring] 2024," showcasing ultrasonic metal welding machines that perform welding with metal foils and tab leads, as well as with wire harnesses and terminals, and busbars. We will propose welding machines with different thrusts suitable for both large and small diameter applications, introduce products that solve challenges in delicate welding, such as fine single wires, and provide suggestions on the shapes of tool horns that are important for quality. (For details about the exhibition, please refer to the basic information section below.)

  • Welding Machine
  • Joining Equipment

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Paper tube processing machine - paper tube cutting and joining machine

Paper tube processing machine - paper tube cutting and joining machine

80% of domestic recycled paper tube processing machines are manufactured by our company.

The ends of the paper tubes are shaped into male and female connections for joining. A long paper tube can be regenerated using 2 to 3 short paper tubes. Compared to traditional staple joining, there are no protrusions on the outer diameter, and the bending strength is increased by more than three times.

  • Paper Converting Machinery
  • Joining Equipment

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SPS Sintering Device SPS Joining Device

SPS Sintering Device SPS Joining Device

Magnetic materials, solid electrolytes, nanomaterials, and difficult-to-sinter materials can be sintered and diffusion-bonded in a short time.

Magnetic materials, solid electrolytes, nanomaterials, difficult-to-sinter materials, high-temperature sintering materials, and special composition materials that cannot be bulked by dissolution methods can be sintered in a short time. Diffusion bonding of dissimilar metals is also possible. As part of the lineup, there are Roll-to-Roo type bonding devices, press + SPS devices in a magnetic field, and SPS devices with a glove box.

  • Contract manufacturing
  • Heating device
  • Powder Molding Machine
  • Joining Equipment

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Equipped with the latest ultrasonic oscillator Pro! Ultrasonic metal joining machine catalog now available.

Equipped with the latest ultrasonic oscillator Pro! Ultrasonic metal joining machine catalog now available.

"Unlimited charm of ultrasonic oscillators × astonishing bonding reproduction power" What matters is controlled energy transfer! Proposing suitable metal bonding according to the application.

Equipped with a servo press that efficiently transmits ultrasonic energy to the workpiece and an oscillator from RINCO with excellent ultrasonic control functions. It suppresses deformation and slipping of the base material during joining, preventing cracks and disconnection troubles. Additionally, if you want to realize your company's ideals rather than standard products, consultations are welcome. We will support you while sharing know-how for each customer's application, so modifications and program adjustments are also accepted. 【Features】 ■ Settings can be adjusted according to material characteristics ■ Customization and program modifications are possible ■ Support available for overseas deliveries *For more details, please refer to the PDF materials or feel free to contact us.

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  • Other processing machines
  • Joining Equipment

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Ultrasonic metal joining machine suitable for battery laminated foil and TAB busbar electrode bonding.

Ultrasonic metal joining machine suitable for battery laminated foil and TAB busbar electrode bonding.

Achieves high-speed, stable, and high-quality bonding of TAB busbar electrodes for battery stacking foils (over 100 sheets). A high-spec ultrasonic bonding machine for the manufacturing of next-generation battery electrodes.

Ultrasonic bonding of battery laminated foils requires the application of a controlled amplitude under a stable pressure for a certain period of time. Our servo press achieves "pressure that follows the behavior changes between laminated foils," which is difficult to control with air press machines, enabling high-quality and stable bonding of multilayer battery foils. This device can bond 140 layers of laminated foil with Al terminals, further improving the efficiency of power extraction from secondary batteries. Additionally, the position information of the high-speed tracking motor and ultrasonic output information are acquired as part of an automated system via Ethernet/IP, significantly contributing to the big data needed for mass production quality standards. *We welcome inquiries for various metal bonding experiments and equipment demonstrations. Please feel free to consult us.

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  • Secondary Cells/Batteries
  • Joining Equipment

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Battery Lamination Foil and TAB Busbar Electrode Joining Machine for EVs

Battery Lamination Foil and TAB Busbar Electrode Joining Machine for EVs

A high-speed, high-quality ultrasonic metal joining machine that accelerates EV battery manufacturing.

In the EV industry, there is a demand for improved battery performance and manufacturing efficiency. In particular, high-quality and stable bonding in the electrode joints, which significantly affect battery performance, is essential. Poor bonding can lead to decreased battery performance and shortened lifespan. Our ultrasonic metal bonding machine achieves high-speed, stable, and high-quality bonding of battery stack foils (over 100 sheets) and TAB bus bar electrodes, addressing challenges in EV battery manufacturing. 【Application Scenarios】 - EV battery pack manufacturing - Secondary battery manufacturing - Bonding of electrodes for EVs 【Benefits of Implementation】 - Improved battery performance through high-quality bonding - Increased productivity through high-speed bonding - Streamlined quality control through data acquisition via Ethernet/IP

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  • Secondary Cells/Batteries
  • Joining Equipment

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Ultrasonic Handheld Welder 'SONIICS H500 Series'

Ultrasonic Handheld Welder 'SONIICS H500 Series'

Tool change costs can be reduced with a chip-type design! Equipped with a variety of features, including a soft start function.

The "SONIICS H500 Series" is a compact, lightweight, and easy-to-use ultrasonic handheld welder. Despite its compact size, it offers a robust 500W, making it ideal for riveting and spot welding. Cosmo System has established a testing room to provide various welding tests, technical comments, and data collection for different welding methods. Our specialized technicians will provide comments on welding shapes and methods tailored to your welding products, so please feel free to consult with us. 【Features (Excerpt)】 ■ Achieves responsive oscillation with a microprocessor ■ Digital timer control ■ Energy control (Type E only) ■ Digital amplitude control ■ Auto-tuning function ■ Soft start function * For more details, please refer to the PDF materials or feel free to contact us.

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  • Welding Machine
  • Joining Equipment

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Automatic optical axis alignment bonding device (bonding of lenses)

Automatic optical axis alignment bonding device (bonding of lenses)

Automatic lens and lens alignment joint. Lens attachment and detachment operations are also easy with PC control.

The automatic optical axis alignment and bonding device for eccentricity measurement is a system that automatically performs high-precision lens and lens alignment bonding in the balsam process (commonly known) in a short time. Lens attachment and detachment operations can also be easily performed via PC control. It conducts reflection eccentricity measurements for the curvature centers of the top surface, bonding surface, and bottom surface, determines the optical axes of Lens1 and Lens2, and automatically aligns the optical axes. Everything is done automatically up to UV curing with an alignment precision of 0.1 μm. It can also be upgraded for existing OC-MOT AB users. For more details, please contact us or refer to the catalog.

  • Optical Measuring Instruments
  • Other measurement, recording and measuring instruments
  • Joining Equipment

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Universal Wafer Bonding Device SB6/8 Gen2

Universal Wafer Bonding Device SB6/8 Gen2

Wafer bonding equipment suitable for various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components, from research and development to prototyping and small-scale production.

【Features】 - Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. - Accommodates wafers and substrates up to 200mm in diameter and stacking thicknesses up to 6mm. - Achieves high-precision post-bond alignment accuracy through the combination of a transport fixture with a clamping mechanism and the SUSS BA6/8 bond aligner. - Control of the bonding environment through vacuum or gas atmosphere control.

  • Other processing machines
  • Joining Equipment

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Wafer surface modification and precision bonding equipment

Wafer surface modification and precision bonding equipment

Ultra-high vacuum - compatible with pressurized atmospheres! A bonding system equipped with uniform heating and pressurization functions!

This product is a device for precision bonding of wafer-level silicon, metal, quartz, glass, etc., after surface modification treatment in a vacuum or any atmosphere. It supports various bonding for 4 to 6-inch wafer levels. We propose surface modification treatments and precision bonding models suitable for bonding materials such as anodic bonding, diffusion/eutectic bonding, direct bonding, and thermocompression bonding. 【Features】 ■ Supports various bonding for 4 to 6-inch wafer levels ■ Pre-treatment function with surface modification treatment suitable for any material ■ Bonding system equipped with uniform heating and pressurization functions ■ Heating and cooling system to reduce residual stress ■ Capable of operating in ultra-high vacuum to pressurized atmosphere ■ Control mechanism for arbitrary position pressurization and voltage application *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer
  • Other machine elements
  • Joining Equipment

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Friction welding machine

Friction welding machine

Achieving high product quality with the latest joining technology.

Friction welding of dissimilar materials with high precision, high strength, and in a short time. We propose an environmentally friendly joining method that utilizes heat generated by friction. 【Features】 ○ High dimensional accuracy and reproducibility ○ Strong joint strength ○ Joining of components that are difficult to weld ○ Capability to join dissimilar materials ○ Energy-saving and environmentally friendly ○ Cost reduction For more details, please contact us or download the catalog.

  • Special Processing Machinery
  • Other machine tools
  • Other processing machines
  • Joining Equipment

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Ultrasonic processing machine USP2000 model press

Ultrasonic processing machine USP2000 model press

Technical specifications

For over 30 years, we have been providing high-quality, high-rigidity ultrasonic processing machines (welding, cutting, riveting, etc.) and various application equipment using ultrasonic technology to meet our customers' needs. Moving forward, we will continue to offer equipment, systems, and continuous production lines for cutting, sealing, perforating, and joining plastics, resins, and non-woven fabrics, leveraging the characteristics of ultrasonic processing such as high speed, no fraying, no burning, and no liquid leakage.

  • Other FA equipment
  • Joining Equipment

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Ultrasonic Metal Welding Machine USW1521G6Y

Ultrasonic Metal Welding Machine USW1521G6Y

Multi-display of menu and graphs on a large color display.

Optimal for joining similar and dissimilar materials such as aluminum, copper, and nickel.

  • Ultrasonic Oscillator
  • Joining Equipment

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