We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Joining Equipment.
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Joining Equipment Product List and Ranking from 33 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

Joining Equipment Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. アドウェルズ Fukuoka//Manufacturing and processing contract
  2. 日本エマソン株式会社 ブランソン事業本部 Kanagawa//Industrial Machinery
  3. 京浜ラムテック Kanagawa//Manufacturing and processing contract
  4. アユミ工業 Hyogo//Electronic Components and Semiconductors
  5. 5 精電舎電子工業 本社、柏工場、営業所(仙台、北関東、東京、湘南、名古屋、大阪、広島、福岡)、室蘭事務所 Tokyo//Industrial Machinery

Joining Equipment Product ranking

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. Direct bonding of substrates using ultrasonic waves. アドウェルズ
  2. For the welding industry: New joining machine "SSW Tool Holder" 京浜ラムテック
  3. Automatic optical axis alignment bonding device (bonding of lenses) トライオプティクス・ジャパン
  4. 4 GMX-20DP Ultrasonic Metal Welding Machine 日本エマソン株式会社 ブランソン事業本部
  5. 5 Surfactant activation bonding device アユミ工業

Joining Equipment Product List

46~60 item / All 80 items

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SPS Sintering Device SPS Joining Device

Magnetic materials, solid electrolytes, nanomaterials, and difficult-to-sinter materials can be sintered and diffusion-bonded in a short time.

Magnetic materials, solid electrolytes, nanomaterials, difficult-to-sinter materials, high-temperature sintering materials, and special composition materials that cannot be bulked by dissolution methods can be sintered in a short time. Diffusion bonding of dissimilar metals is also possible. As part of the lineup, there are Roll-to-Roo type bonding devices, press + SPS devices in a magnetic field, and SPS devices with a glove box.

  • Contract manufacturing
  • Heating device
  • Powder Molding Machine

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Equipped with the latest ultrasonic oscillator Pro! Ultrasonic metal joining machine catalog now available.

"Unlimited charm of ultrasonic oscillators × astonishing bonding reproduction power" What matters is controlled energy transfer! Proposing suitable metal bonding according to the application.

Equipped with a servo press that efficiently transmits ultrasonic energy to the workpiece and an oscillator from RINCO with excellent ultrasonic control functions. It suppresses deformation and slipping of the base material during joining, preventing cracks and disconnection troubles. Additionally, if you want to realize your company's ideals rather than standard products, consultations are welcome. We will support you while sharing know-how for each customer's application, so modifications and program adjustments are also accepted. 【Features】 ■ Settings can be adjusted according to material characteristics ■ Customization and program modifications are possible ■ Support available for overseas deliveries *For more details, please refer to the PDF materials or feel free to contact us.

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  • Other processing machines

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Ultrasonic metal joining machine suitable for battery laminated foil and TAB busbar electrode bonding.

Achieves high-speed, stable, and high-quality bonding of TAB busbar electrodes for battery stacking foils (over 100 sheets). A high-spec ultrasonic bonding machine for the manufacturing of next-generation battery electrodes.

Ultrasonic bonding of battery laminated foils requires the application of a controlled amplitude under a stable pressure for a certain period of time. Our servo press achieves "pressure that follows the behavior changes between laminated foils," which is difficult to control with air press machines, enabling high-quality and stable bonding of multilayer battery foils. This device can bond 140 layers of laminated foil with Al terminals, further improving the efficiency of power extraction from secondary batteries. Additionally, the position information of the high-speed tracking motor and ultrasonic output information are acquired as part of an automated system via Ethernet/IP, significantly contributing to the big data needed for mass production quality standards. *We welcome inquiries for various metal bonding experiments and equipment demonstrations. Please feel free to consult us.

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  • Secondary Cells/Batteries

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Ultrasonic Handheld Welder 'SONIICS H500 Series'

Tool change costs can be reduced with a chip-type design! Equipped with a variety of features, including a soft start function.

The "SONIICS H500 Series" is a compact, lightweight, and easy-to-use ultrasonic handheld welder. Despite its compact size, it offers a robust 500W, making it ideal for riveting and spot welding. Cosmo System has established a testing room to provide various welding tests, technical comments, and data collection for different welding methods. Our specialized technicians will provide comments on welding shapes and methods tailored to your welding products, so please feel free to consult with us. 【Features (Excerpt)】 ■ Achieves responsive oscillation with a microprocessor ■ Digital timer control ■ Energy control (Type E only) ■ Digital amplitude control ■ Auto-tuning function ■ Soft start function * For more details, please refer to the PDF materials or feel free to contact us.

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  • Welding Machine

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Automatic optical axis alignment bonding device (bonding of lenses)

Automatic lens and lens alignment joint. Lens attachment and detachment operations are also easy with PC control.

The automatic optical axis alignment and bonding device for eccentricity measurement is a system that automatically performs high-precision lens and lens alignment bonding in the balsam process (commonly known) in a short time. Lens attachment and detachment operations can also be easily performed via PC control. It conducts reflection eccentricity measurements for the curvature centers of the top surface, bonding surface, and bottom surface, determines the optical axes of Lens1 and Lens2, and automatically aligns the optical axes. Everything is done automatically up to UV curing with an alignment precision of 0.1 μm. It can also be upgraded for existing OC-MOT AB users. For more details, please contact us or refer to the catalog.

  • Optical Measuring Instruments
  • Other measurement, recording and measuring instruments

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Universal Wafer Bonding Device SB6/8 Gen2

Wafer bonding equipment suitable for various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components, from research and development to prototyping and small-scale production.

【Features】 - Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. - Accommodates wafers and substrates up to 200mm in diameter and stacking thicknesses up to 6mm. - Achieves high-precision post-bond alignment accuracy through the combination of a transport fixture with a clamping mechanism and the SUSS BA6/8 bond aligner. - Control of the bonding environment through vacuum or gas atmosphere control.

  • Other processing machines

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Wafer surface modification and precision bonding equipment

Ultra-high vacuum - compatible with pressurized atmospheres! A bonding system equipped with uniform heating and pressurization functions!

This product is a device for precision bonding of wafer-level silicon, metal, quartz, glass, etc., after surface modification treatment in a vacuum or any atmosphere. It supports various bonding for 4 to 6-inch wafer levels. We propose surface modification treatments and precision bonding models suitable for bonding materials such as anodic bonding, diffusion/eutectic bonding, direct bonding, and thermocompression bonding. 【Features】 ■ Supports various bonding for 4 to 6-inch wafer levels ■ Pre-treatment function with surface modification treatment suitable for any material ■ Bonding system equipped with uniform heating and pressurization functions ■ Heating and cooling system to reduce residual stress ■ Capable of operating in ultra-high vacuum to pressurized atmosphere ■ Control mechanism for arbitrary position pressurization and voltage application *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer
  • Other machine elements

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Friction welding machine

Achieving high product quality with the latest joining technology.

Friction welding of dissimilar materials with high precision, high strength, and in a short time. We propose an environmentally friendly joining method that utilizes heat generated by friction. 【Features】 ○ High dimensional accuracy and reproducibility ○ Strong joint strength ○ Joining of components that are difficult to weld ○ Capability to join dissimilar materials ○ Energy-saving and environmentally friendly ○ Cost reduction For more details, please contact us or download the catalog.

  • Special Processing Machinery
  • Other machine tools
  • Other processing machines

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Ultrasonic processing machine USP2000 model press

Technical specifications

For over 30 years, we have been providing high-quality, high-rigidity ultrasonic processing machines (welding, cutting, riveting, etc.) and various application equipment using ultrasonic technology to meet our customers' needs. Moving forward, we will continue to offer equipment, systems, and continuous production lines for cutting, sealing, perforating, and joining plastics, resins, and non-woven fabrics, leveraging the characteristics of ultrasonic processing such as high speed, no fraying, no burning, and no liquid leakage.

  • Other FA equipment

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Ultrasonic Metal Welding Machine USW1521G6Y

Multi-display of menu and graphs on a large color display.

Optimal for joining similar and dissimilar materials such as aluminum, copper, and nickel.

  • Ultrasonic Oscillator

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Ultrasonic welding device "Manufactured by Adwells Co., Ltd."

Achieved stable bonding through high-rigidity horn clamp technology (rigid clamp)!

Adwells contributes to the advancement of technology development aimed at energy saving, electrification, and weight reduction in electronics products, automobiles, and industrial equipment through ultrasonic joining devices that enable room temperature, short time, and dissimilar metal joining.

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  • aluminum
  • Secondary Cells/Batteries

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