This is an introduction to a case of micro-fine square hole processing on a tungsten plate with a thickness of 0.1mm.
【Processing Specifications】
Plate Thickness: 0.1mm
Hole Dimensions (Incident Surface): 0.3×0.3mm
Pitch: 0.6mm
Processing Range: 45×45mm
You will see that it has been processed in a very beautiful state with minimal thermal impact, without chipping or cracking. The gap between the square holes is approximately 0.015mm or less, making it a good example of the characteristics of short pulse lasers.
Tungsten (W) has an extremely high melting and boiling point and is the material with the lowest coefficient of linear expansion among metals. Additionally, due to its very high hardness, it is well known as a material for cemented carbide. However, it is difficult to process, and in machining, there are challenges such as tool wear and chipping, making it particularly regarded as a material that is difficult for fine processing. Nevertheless, there is a high demand for fine processing, and various methods have been repeatedly challenged, but none of the conventional methods were able to achieve the desired shapes. At Lips Works Co., Ltd., we thoroughly explored the appropriate values for optical systems, control systems, laser power, etc., and finally established beautiful fine processing technology for tungsten. There are no concerns about tool wear or breakage, or variations in quality that are seen in machining or other methods.
![Microfabrication of different shapes on the top and bottom surfaces [Processing Technology]](https://image.mono.ipros.com/public/product/image/82e/2001483545/IPROS44302754277131338421.jpeg?w=280&h=280)
