We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Microfabrication.
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Microfabrication Product List and Ranking from 45 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Microfabrication Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 光機械製作所 HIKARI LASER LAB. Mie//Manufacturing and processing contract
  2. リプス・ワークス Tokyo//Manufacturing and processing contract
  3. ブル精密 (株)ブル精密　本社 Tochigi//Glass and clay products
  4. 4 ソディックエフ・ティ Kanagawa//Machine elements and parts
  5. 5 Y-MOLD Nagano//Manufacturing and processing contract
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Microfabrication Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Dimple processing examples リプス・ワークス
  2. [Glass Processing Examples] Precision Micro Machining ブル精密 (株)ブル精密　本社
  3. Ultra-precision micro-machining ソディックエフ・ティ
  4. 4 Ultrafine! Introduction to Laser Processing ナラサキ産業 メカトロソリューション部　機能材料課
  5. 4 Examples of dimple processing for punches リプス・ワークス

Microfabrication Product List

46～60 item / All 119 items

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High-precision micro-machining with reduced material stress and thermal deformation.

High-precision micro-machining with reduced material stress and thermal deformation.

Micron-level precision machining of various discharge machining (shape cutting discharge, fine groove processing) and brazed products.

Our company aims to provide consistent production from prototype to mass production, including material procurement, processing, surface treatment, and assembly, in line with customer requests for cost, quality, and delivery time, as well as creating products with strong proposal capabilities. We specialize in fine processing of copper and aluminum with reduced stress on materials, and we are capable of various types of processing such as fine engraving, narrow grooves, thin plate wire cutting, and high-precision machining. We accommodate a wide range of metal processing for materials including forged and cast materials, utilizing our unique technologies and know-how developed over many years to meet the diverse needs of our customers. 【Strengths】 ■ Fine processing of copper and aluminum with reduced stress on materials ■ Various types of processing: fine engraving, narrow grooves, thin plate wire cutting, high-precision machining ■ Fine and high-precision processing of high-hardness materials *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Wafer microfabrication

Wafer microfabrication

Can be processed into various semiconductor substrates, glass, diamonds, etc.

Our company has a track record of processing various wafers at a sub-micron scale. Additionally, we can process according to your desired periodic patterns and aspect ratios, and we also offer suggestions from the design of the patterns.

  • Etching Equipment
  • Electron beam lithography equipment
  • Processing Contract

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Urethane ECZ fine processing

Urethane ECZ fine processing

We performed fine hole drilling on urethane using punch processing. ECZ has a relatively low density, and while the precision aspect is strict, it is machinable.

It was made by punching from a 10t plate material. It's quite small at φ3.8×φ1.2, and when there are many, removing the center waste can be quite challenging. We can accept orders even from prototypes, so please feel free to contact us.

  • Other polymer materials

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Microfabrication of different shapes on the top and bottom surfaces [Processing Technology]

Microfabrication of different shapes on the top and bottom surfaces [Processing Technology]

We will take on a wide variety of precision machining, focusing on micron grinding and wire electrical discharge machining!

The photo shows a test processing that has been enlarged to the specified dimensions. In this processing, the width of the islands remaining inside the holes was successfully reduced to 0.2 mm or less. A plate of 0.2 mm or less penetrates to a depth of 30 mm. We aim to make it even thinner and longer by changing the conditions. *For more details, please download the PDF or contact us.*

  • Processing Contract
  • alloy

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Microfabrication of ultra-thin plates

Microfabrication of ultra-thin plates

We will take on a wide variety of precision machining, focusing on micron grinding and wire electrical discharge machining!

The left photo shows the side view captured with tweezers. Outer diameter approximately 10 mm Inner diameter 8 mm, tolerance 2 microns Thickness 0.02 mm Processing thin plates is difficult due to many issues such as chucking and bending, but we have succeeded in ensuring tolerances and mass production through jig manufacturing. *For more details, please download the PDF or contact us.*

  • Processing Contract
  • alloy

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Prototype and mass production, precision machining

Prototype and mass production, precision machining

We undertake everything from prototype development to mass production processing.

Prototype and mass production processing "microfabrication" offers optimal processing methods based on various laser processing machines and years of accumulated data and know-how, carried out by skilled technicians. For more details, please download the catalog or contact us.

  • Processing Contract
  • Prototype Services

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"Laser Micromachining" *Materials with case studies will be provided.

"Laser Micromachining" *Materials with case studies will be provided.

Achieving high-quality precision processing with optical systems tailored to materials and shapes. Consistent support from prototyping to mass production.

Our company conducts prototyping and mass production using "laser microprocessing." Leveraging our knowledge and experience from selling laser processing equipment, we propose optical systems and oscillators that match the materials and processing requirements. Additionally, we can provide comprehensive support in-house for combined processing that incorporates machining and micro-blasting, addressing a wide range of needs from prototyping to mass production. ★ You can view materials showcasing processing examples from the "PDF Download." 【Examples Listed (Excerpt)】 ◎ Laser Drilling Multi-hole processing on ceramics, drilling on tempered glass, and through-hole drilling and counterboring on glass substrates. ◎ Cutting, Grooving, Drilling, Thin Film Removal Grooving on SiC substrates, free-form cutting of polyimide, and cutting out carbon sheets. *Please feel free to contact us with any inquiries.

  • Processing Contract
  • Other processing machines

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Dimple processing examples

Dimple processing examples

Dimple processing for punches, piston rings, and the inner surface of cylinders.

By applying dimple processing to the punch, piston rings, and the inner surface of the cylinder, it is possible to maintain a good sliding environment without experiencing oil film breakage, even under harsh sliding conditions that might otherwise lead to oil film failure.

  • cylinder

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Case study of fine square hole machining on tungsten (W) using ultrashort pulse laser.

Case study of fine square hole machining on tungsten (W) using ultrashort pulse laser.

This is an introduction to a case of micro-fine square hole processing on a tungsten plate with a thickness of 0.1mm.

【Processing Specifications】 Plate Thickness: 0.1mm Hole Dimensions (Incident Surface): 0.3×0.3mm Pitch: 0.6mm Processing Range: 45×45mm You will see that it has been processed in a very beautiful state with minimal thermal impact, without chipping or cracking. The gap between the square holes is approximately 0.015mm or less, making it a good example of the characteristics of short pulse lasers. Tungsten (W) has an extremely high melting and boiling point and is the material with the lowest coefficient of linear expansion among metals. Additionally, due to its very high hardness, it is well known as a material for cemented carbide. However, it is difficult to process, and in machining, there are challenges such as tool wear and chipping, making it particularly regarded as a material that is difficult for fine processing. Nevertheless, there is a high demand for fine processing, and various methods have been repeatedly challenged, but none of the conventional methods were able to achieve the desired shapes. At Lips Works Co., Ltd., we thoroughly explored the appropriate values for optical systems, control systems, laser power, etc., and finally established beautiful fine processing technology for tungsten. There are no concerns about tool wear or breakage, or variations in quality that are seen in machining or other methods.

  • Processing Contract

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CFRP straight hole machining case study

CFRP straight hole machining case study

We will introduce micro-fine processing of CFRP materials using ultra-short pulse lasers.

CFRP has been utilized mainly in automobiles and aircraft, where improving fuel efficiency and maintaining strength are essential, due to its strength and lightness. On the other hand, it has traditionally been considered a material that is difficult to process, with challenges such as burrs caused by thermal effects during cutting and delamination due to its laminated structure. At Lips Works, we propose micro-fine processing of CFRP using ultra-short pulse lasers. The processing example we are introducing this time is straight hole machining. As you can see, we are able to achieve processing with almost no burrs or delamination. At Lips Works, we also offer various processing options besides drilling, such as cutting and micro-texturing. Please take a look at our company website.

  • Processing Contract

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Various fine processing for SK materials

Various fine processing for SK materials

Cutting, engraving, and grooving of SK material were performed using an ultra-short pulse laser.

Using ultra-short pulse lasers with minimal heat impact on SK material (carbon tool steel) used for punches and dies in press molds, we performed recessed machining and various groove machining.

  • Processing Contract

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Various fine processing of graphite paper

Various fine processing of graphite paper

Please take a look at the fine picosecond laser processing that distinguishes between shallow grooves, deep grooves, and cutting in three stages by changing the conditions.

Graphite, which has high heat resistance and also possesses lubricating and conductive properties, is widely used in applications ranging from engines and laptops to airplanes and food-related industries. This time, we used an ultra-short pulse laser on a 25μm thick graphite paper to perform cutting, engraving, and various groove processing. Please take a look at the fine picosecond laser processing that distinguishes three stages: shallow engraving, deep engraving, and cutting by changing the conditions!

  • Processing Contract
  • Organic Natural Materials

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Various microfabrication techniques for silicon carbide.

Various microfabrication techniques for silicon carbide.

We would like to introduce logo processing on silicon carbide.

Using ultra-short pulse lasers on silicon carbide, which has a hardness second only to diamond and is used in abrasives and cutting tools, we performed engraving and various groove processing.

  • Ceramics
  • Fine Ceramics
  • Processing Contract

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Ultrafine processing

Ultrafine processing

By controlling the axis deviation as much as possible, accuracy is improved! Introducing fine and high-precision machining technology.

"Ultra-fine processing" enables more detailed and high-precision cutting operations. By controlling the spindle runout as much as possible through laser tool correction and linear table movement, accuracy is increased. We excel in fine processing, such as precise hole pitches and high aspect ratio convex shapes. Additionally, our company uses the ultra-precision micro-processing machine "NANO-21," which allows for automatic measurement of tool diameter and tool length using lasers. [Features] ■ Increased accuracy by controlling spindle runout as much as possible ■ Expertise in fine processing *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Other processing machines

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◇◆Microfabrication Business◆◇

◇◆Microfabrication Business◆◇

Precision sheet metal and press processing, fine machining processing.

We process ultra-small products the size of rice grains and sesame seeds. With fiber lasers and bending machines dedicated to thin plates, as well as a machining center specialized for fine processing, all housed in a temperature-controlled room, we can accommodate products with strict precision in the micron range. ◆ Fine Laser Processing Fine fiber laser processing machine: 1 unit 【Processing thickness】 0.03 to 0.8mm 【Processing precision】 ±0.01～ ◆ Precision Bending Processing 6 to 7-ton benders: 7 units, 18-ton benders: 4 units 【Processing thickness】 0.03 to 1.0mm 【Processing precision】 ±0.03～ ◆ Fine Machining Processing High-precision machining centers: 2 units 【Processing size】 Up to □100mm 【Processing precision】 ±3μm

  • Brake parts

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