We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Microfabrication.
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Microfabrication Product List and Ranking from 45 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Microfabrication Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 光機械製作所 HIKARI LASER LAB. Mie//Manufacturing and processing contract
  2. リプス・ワークス Tokyo//Manufacturing and processing contract
  3. ブル精密 (株)ブル精密　本社 Tochigi//Glass and clay products
  4. 4 ソディックエフ・ティ Kanagawa//Machine elements and parts
  5. 5 Y-MOLD Nagano//Manufacturing and processing contract
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Microfabrication Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Dimple processing examples リプス・ワークス
  2. [Glass Processing Examples] Precision Micro Machining ブル精密 (株)ブル精密　本社
  3. Ultra-precision micro-machining ソディックエフ・ティ
  4. 4 Ultrafine! Introduction to Laser Processing ナラサキ産業 メカトロソリューション部　機能材料課
  5. 4 Examples of dimple processing for punches リプス・ワークス

Microfabrication Product List

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Precision machining and micro machining

Precision machining and micro machining

Our company helps with manufacturing.

Ultrasonic Micro-Hole Processing 　● Capable of processing difficult-to-machine and hard materials down to Φ0.05 　　・ Various ceramics 　　・ Silicon wafers 　　・ Special metals such as titanium 　　・ Composite plastics Precision Cutting Processing 　　・ Production of prototypes and parts through cutting 　　・ Production lot: 1 to 1000 pieces 　　・ General machining accuracy: ±0.01 　　・ Processable materials: Various plastics and metals

  • others

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Ultrafine! Introduction to Laser Processing

Ultrafine! Introduction to Laser Processing

It is possible to process fine pores of about a few microns to 20 microns and perform micro machining.

By using ultra-short pulse lasers with a duration of less than picoseconds, we achieve processing with extremely minimal thermal damage to the surrounding area. - Non-thermal - Non-contact - High precision - Dry processing Additionally, we can perform fine processing on various materials: - Diamond = hard - Glass = brittle - Plastic = soft - CFRP = composite We process a wide range of materials. By utilizing high-output laser processing machines, we offer a selection of processing materials that is unmatched by other companies, allowing us to take on all kinds of fine processing challenges. Furthermore, we can modify surfaces and apply water-repellent treatments, and we accept contract processing starting from a single prototype. When you request our services, we can prepare materials in various patterns, from test pieces of high-performance materials to products processed based on drawings. Please feel free to consult with us first.

  • Processing Contract
  • Fine Ceramics
  • Other processing machines

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Laser microfabrication

Laser microfabrication

Numerous achievements in the research field! Laser technology capable of fine processing of polymer materials with adhesive properties.

CSTEC's laser microfabrication allows for processing with high precision and minimal burr formation, making it suitable for processing resin materials that may crack when punched. Fine patterns and naming can be applied to parts and other items. With four-wavelength laser microfabrication, higher quality processing has become possible. We offer fine contract processing, prototyping, and mass production services for researchers and design engineers. 【Features】 ■ Capable of microfabrication on difficult-to-process adhesive polymer materials ■ Reduces burrs on the processed cross-section with low thermal impact photodecomposition processing ■ Can accommodate from one piece without the need for molds, ideal for prototyping evaluation ■ Cost-effective mass production through a combination of laser processing and mold punching ■ Higher quality processing made possible with four-wavelength laser microfabrication *For more details, please refer to the PDF materials or feel free to contact us.

  • Laser marker
  • Processing Contract
  • Surface treatment contract service

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High aspect ratio through-hole micro-machining

High aspect ratio through-hole micro-machining

High aspect ratio through-hole micro machining

For delicate and difficult-to-process silicon wafers, laser processing can be done stress-free. In this example, high-aspect perforation processing was performed on a standard wafer of 0.6 mm thickness using THG-YAG.

  • Processing Contract

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Examples of dimple processing for punches

Examples of dimple processing for punches

We achieved dimple processing without introducing dimensional errors to the high-precision machined punch surface.

From the perspective of resource conservation, energy saving, and guaranteeing machine performance, improving the characteristics and friction behavior of friction surfaces is essential. Additionally, the amount and frequency of lubrication in breaking and plastic processing are important from the standpoint of process improvement. Our company has achieved a dimple processing method that serves as a reservoir for oil, enabling continuous processing and lubrication with minimal oil quantity, without introducing dimensional errors to the precisely machined surfaces.

  • Other consumables

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Realization of anisotropic structural colors using nanoperiodic structures (LIPSS)

Realization of anisotropic structural colors using nanoperiodic structures (LIPSS)

We will introduce the application of femtosecond lasers for the creation of nano-periodic structures.

At Lips Works, we have successfully controlled the directionality of LIPSS (nano-periodic structures) using femtosecond laser processing. By selectively changing the directionality of the nano-periodic structures, it is possible to create patterns with different emission colors side by side. With the completion of this technology, we can freely apply nano-periodic structures with different orientations. As shown in the photo, various emissions can be observed. Nano-periodic structures reflect the wavelength components contained in light as they are, depending on the angle of incidence from a certain direction. This is a proposal for processing that utilizes the reflection of fine structures to achieve decorative properties.

  • Processing Contract

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Various precision machining for Inconel.

Various precision machining for Inconel.

Using a femtosecond pulse laser, we performed drilling, counterboring, and groove processing on Inconel.

Inconel, an alloy with excellent high-temperature properties such as heat resistance, corrosion resistance, oxidation resistance, and creep resistance, is used in various fields including space shuttles, aircraft jet engines, and, in more familiar contexts, high-end automotive mufflers.

  • Engine parts
  • Processing Contract

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Various microfabrication techniques for silicon nitride.

Various microfabrication techniques for silicon nitride.

We would like to introduce logo processing on silicon nitride.

Using ultrashort pulse lasers on silicon nitride, which is utilized in high-temperature, acid-resistant materials like nozzles, high-temperature structural materials like gas turbine blades, and cutting tools and bearings that leverage wear resistance, we performed cutting, drilling, and various groove processing.

  • Ceramics
  • Fine Ceramics
  • Processing Contract

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Adhesive, applicable for fine processing

Adhesive, applicable for fine processing

Adhesive, applicable for fine processing.

Dispenser (Open Type) This is our unique micro-machining technology that involves cutting out an outer diameter of 0.23mm and drilling a small hole of 0.13mm in the center. 【Features】 ● Enables adhesive application to smaller precision parts than ever before. ● By using a four-structure nozzle in a machined integrated process, we reduce PCD errors to 1/100, achieving accurate application.

  • Contract manufacturing
  • Processing Contract

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Technical Introduction: Precious Metal Processing

Technical Introduction: Precious Metal Processing

Can you make something like this? Precision machining is proposed by Nikyu!

We are pleased to offer various proposals to solve the concerns of our customers in metal processing and precision machining. Please contact us at Niku first! Niku has a track record of making concrete proposals that delve deeper into our customers' issues and thoughts. For more details, please inquire or take a look at our catalog.

  • Other machine elements
  • Other metal materials

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Micro-machining of hard brittle materials and difficult-to-process materials.

Micro-machining of hard brittle materials and difficult-to-process materials.

We offer precision machining services for hard and brittle materials as well as difficult-to-machine materials.

This is high-quality processing using our company's ultrasonic vibration table.

  • Processing Contract

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Cross-edge microfabrication [silicon products]

Cross-edge microfabrication [silicon products]

Material purity of 99.999999999% or higher! Impurity contamination management is implemented with dedicated silicon equipment.

We use a material with the same thermal expansion rate as silicon wafers to reduce slip occurrence on the wafers.

  • others

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Cross-edge microfabrication [Glass through-hole wiring board (TGV)]

Cross-edge microfabrication [Glass through-hole wiring board (TGV)]

Three-dimensional wafer-level packaging (WLP) is suitable for miniaturizing semiconductors. Through-silicon vias enable improvements in high-frequency characteristics.

This product features numerous electrically conductive metal via-holes formed within borosilicate glass substrates such as Pyrex and Tempax. It can accommodate substrates up to a maximum diameter of 8 inches. It has good flatness and airtightness, making it suitable for anodic bonding for sealing silicon-based devices. 【Features】 ○ Capable of anodic bonding with silicon wafers Solves outgassing issues by enabling anodic bonding without the use of adhesives. ○ Excellent high-frequency characteristics - Ensures low stray inductance and low electrical resistance of vias. - Achieves high insulation compared to silicon by using glass as the base material. ○ Designed to function as a heat sink - Allows the vias to serve as thermal vias by incorporating silicon. ○ Transmits visible light - Enables confirmation of bonding points and transmission of optical signals. ○ Compatible with wafers up to Φ200mm. *For more details, please download the catalog or contact us.

  • Glass

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Cross-edge microfabrication

Cross-edge microfabrication

Combining multiple processes to develop innovative products! We propose solutions that match your needs.

"Cross-edge microfabrication" refers to a processing method that combines two or more different types of processing within the manufacturing of a single product. The five core processing techniques are "cutting, grinding, polishing, metallizing, and joining." At our company, we propose solutions that match our customers' needs by considering "quality, cost, and mass production" through composite processing technology that crosses these five advanced techniques. [Features] ■ Maintains stable quality ■ Achieves processing with short lead times ■ Provides cost-effective services ■ Solves customer challenges by developing innovative products through the combination of multiple processes *For more details, please refer to the PDF document or feel free to contact us.

  • Glass
  • Other processing machines
  • Processing Contract

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Micron precision specialized processing technology - fine processing

Micron precision specialized processing technology - fine processing

Processing technology specialized for micron precision using abundant dedicated microfabrication equipment.

Leave the processing of precision parts and tools made of ceramics and various metals to us. We are equipped with advanced facilities and technical skills to handle a wide range of processing needs. Please try our specialized processing technology focused on micron precision, utilizing our extensive equipment for fine processing. For more details, please contact us.

  • Processing Contract

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