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Microfabrication Product List and Ranking from 68 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Sep 02, 2026～Sep 29, 2026
This ranking is based on the number of page views on our site.

Microfabrication Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 02, 2026～Sep 29, 2026
This ranking is based on the number of page views on our site.

  1. HEF DURFERRIT JAPAN Kanagawa//Manufacturing and processing contract
  2. 光機械製作所 HIKARI LASER LAB. Mie//Manufacturing and processing contract
  3. リプス・ワークス Tokyo//Manufacturing and processing contract
  4. 4 後藤精機 Kanagawa//others
  5. 5 フジデノロ Aichi//Manufacturing and processing contract
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Microfabrication Product ranking

Last Updated： Aggregation Period:Sep 02, 2026～Sep 29, 2026
This ranking is based on the number of page views on our site.

  1. Achieving improved friction performance and fine precision processing! Solutions for semiconductor backend processes. HEF DURFERRIT JAPAN
  2. Fundamental Knowledge of Microfabrication: "The Difference Between Precision Machining and Microfabrication" 後藤精機
  3. Ultrafine processing フジデノロ
  4. Laser microprocessing: Chip breaker (groove) processing 光機械製作所 HIKARI LASER LAB.
  5. Ultrafine! Introduction to Laser Processing ナラサキ産業 メカトロソリューション部　機能材料課

Microfabrication Product List

31～60 item / All 131 items

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Points for Reducing Man-Hours and Improving Quality in Micro Machining Wire Electrical Discharge Machining

Points for Reducing Man-Hours and Improving Quality in Micro Machining Wire Electrical Discharge Machining

We will introduce cost reductions achieved by replacing electrical discharge machining with cutting machining.

We will introduce key points for reducing man-hours and improving quality in wire electrical discharge machining, based on the design and manufacturing of precision machined parts. Topics include "Cost reduction through the replacement of electrical discharge machining with cutting machining," "Key points for machining complex-shaped parts with electrical discharge machining," "Key points for machining complex-shaped parts with wire cutting," "Points for reducing machining time and improving accuracy in electrical discharge machining," and "Points for improving machining quality with wire cutting." For more details, please contact us or refer to the catalog.

  • Technical and Reference Books
  • Microfabrication

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High-speed dicing of difficult-to-process materials such as SiC and glass - TLS-Dicing

High-speed dicing of difficult-to-process materials such as SiC and glass - TLS-Dicing

High-speed cutting of extremely difficult-to-process materials like "SiC and glass" is possible! A technology essential for the spread of EVs!

With the spread of EVs (electric vehicles) and the increase in power consumption due to network connections between electronic devices, there is a growing demand for semiconductors that can handle higher output and higher current. "Power semiconductors" using next-generation semiconductor materials such as SiC are gaining attention. However, the processing of hard and brittle SiC requires advanced technology. Traditional mechanical and laser cutting methods face many issues, such as slow processing speeds, chipping, a wide cutting width leading to reduced production volume, and the inability to cut electrode surfaces. Our laser micro-processing technology, "TLS-Dicing," utilizes thermal stress from temperature differences between heating and cooling, enabling high-speed cutting even for difficult-to-process materials like SiC and glass. It can be utilized in various industries that handle hard-to-cut semiconductor materials. *Actual processing photos and data for difficult-to-cut materials and hard brittle materials can be downloaded and viewed from the link below.

  • Company：光
  • Price：Other
  • Processing Contract
  • Microfabrication

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Processing technology - Microfabrication

Processing technology - Microfabrication

Introducing medical device components that have undergone microfabrication.

At Gamagori Manufacturing Co., Ltd., we have been working on micro-precision machining (using drills and end mills with a diameter of 0.1mm or less) in collaboration with Toyohashi University of Technology and OSG Corporation for about seven years. In the fields of medical devices, communication equipment, and optical devices, as equipment becomes more advanced, there is a growing demand for high precision and miniaturization of parts, leading to an increasing need for micro-machining technology. In "micro-machining," we introduce a medical device component that has 81 holes with a diameter of 0.05mm drilled into one side of an 18-karat gold block with a side length of 1mm. 【Features】 - Capable of processing aluminum parts that are prone to distortion and handling high-difficulty machining - Continuously challenges new machining and work materials, enabling VA and VE proposals - Supports cutting-edge machining technology - Clear machining history - Available for consultations on difficult machining For more details, please contact us or download the catalog.

  • Processing Contract
  • Other electronic parts
  • Other optical parts
  • Microfabrication

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Achieving improved friction performance and fine precision processing! Solutions for semiconductor backend processes.

Achieving improved friction performance and fine precision processing! Solutions for semiconductor backend processes.

We propose suitable solutions according to the application! With laser technology and hard coating for fine precision processing, we achieve improved surface friction performance and enhanced functionality.

Our company provides solutions for the back-end processes of semiconductor manufacturing using DLC, PVA coating technology, and femtosecond laser technology. We achieve fine precision processing through laser technology and functional improvements through various types of hard coating film processing. We offer proposals tailored to our customers' applications and situations, including coating selection, as well as support for new development and research. 【Features】 ■ Fine precision processing using laser technology (such as drilling holes with a diameter of less than 10μm and dicing) ■ Processing of various types of hard coating films (DLC, CrN, TiN, etc.) ■ Improvement of friction performance and functionality of surface films ■ Support for decoating and 3D patterning ■ Applicable to a wide range of uses including packaging, semiconductor front-end equipment, and wafer-related applications *For more details, please download the PDF or feel free to contact us.

  • Other semiconductor manufacturing equipment
  • Microfabrication

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[Processing Introduction] Fine processing technology of 0.02mm (20μm) (Electrical Discharge Machining)

[Processing Introduction] Fine processing technology of 0.02mm (20μm) (Electrical Discharge Machining)

Electrical discharge machining that enables extremely small diameters and slits that cannot be achieved with cutting machines!

"Electrical discharge machining" allows for fine processing that cannot be achieved with cutting machines. This introduction to processing technology features the character "0.02" in the photo. It is not visible to the naked eye unless light is shone from below the workpiece. Holes measuring "0.02mm" have been processed in "75 locations" with precision, making the characters stand out! Furthermore, the surrounding lines are processed with a "0.02mm" wire electrical discharge machining, achieving a slit width of "0.025mm"! Fine processing that cannot be done with cutting machines is possible. We perform processing in a wide range of fields, including medical devices (such as the tips of endoscopes), electronic components for mobile phones, semiconductor parts, and automotive components. 【Features】 ■ Capable of ultra-small diameter processing ■ Capable of ultra-small slit processing ■ Compatible with difficult-to-cut materials ■ Minimum hole diameter φ0.02mm ■ Minimum wire diameter φ0.02mm *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Other molds
  • Processing Contract
  • Processing Jig
  • Microfabrication

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Ultra-fine processing using the latest technology with lasers!

Ultra-fine processing using the latest technology with lasers!

Contract processing! We respond to various processing requests such as ultra-fine hole drilling, groove processing, thin film peeling, and fine marking.

■Micromachining down to several tens of microns → High-quality processing is possible with state-of-the-art machining equipment ■Non-thermal processing is possible → Processing without thermal effects, as the irradiation stops before heat spreads → No molten parts, so there are no burrs. Edges are finished sharply ■Compatible with various materials → Broad compatibility with aluminum, copper alloys, various metals, plastics, ceramics, glass, and more For processing examples and details, please visit our website! https://www.ebtohoku.co.jp/result/laser/

  • Processing Contract
  • Microfabrication

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We have many achievements in precision prototype sheet metal processing for thin small items! High-precision ultra-fine processing.

We have many achievements in precision prototype sheet metal processing for thin small items! High-precision ultra-fine processing.

Leave ultra-fine prototype processing to us! We can handle thin sheets of 0.02mm and small items of 1mm square! Plus, we offer short delivery times! We provide high-difficulty processed products.

Kuroda Seiki is a specialized company for prototype precision sheet metal and press parts. We can provide prototype parts ranging from ultra-fine 1mm to 300mm with high precision and short delivery times. We have a wide range of delivery records in various fields, from terminals to aerospace components. You can also rely on us for prototype parts for recent trends such as EV vehicles and rapid chargers. Based on our prototyping know-how, we also offer cost reduction proposals. Please feel free to contact us when you need our services. 【Prototype Examples】 Terminals, connectors, bus bars, spring parts, cases, brackets, motor cores, and precision parts for automotive, optical medical, electrical, OA equipment, and aerospace applications. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other machine elements
  • Microfabrication

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Ultra-precision microfabrication (imprint technology)

Ultra-precision microfabrication (imprint technology)

We have imprint technology that forms fine structures on glass surfaces.

Using ultra-high precision molds, it is possible to directly form nano- and micro-order resin microstructures on various glass substrates with high accuracy. Additionally, by adopting original optical resins, it is possible to meet various optical characteristics and reliability standards.

  • Glass
  • Microfabrication

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Microfabrication

Microfabrication

We process small parts of a few millimeters in size with micron (μ) precision to create precise components.

Microfabrication utilizes advanced processing techniques such as high-precision cutting, hole machining, wire cutting, and electrical discharge machining to manufacture metal micro-components according to your specifications. With years of cultivated expertise, we can accommodate various shapes, including ultra-thin profiles and tiny hole shapes, down to approximately 0.05mm. Additionally, we offer one-stop solutions for surface treatment and plating of the manufactured parts. The produced components are so small that their shapes cannot be distinguished by the naked eye, but we ensure quality by measuring them using a measuring microscope. We have extensive experience in manufacturing precision parts for medical applications and precise mechanical components, so please feel free to contact us if you have any needs for micro or precision parts.

  • Contract manufacturing
  • Microfabrication

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Laser microfabrication: Glass hole processing, fine holes

Laser microfabrication: Glass hole processing, fine holes

Laser shape processing: Trimming long holes in glass (quartz).

Material: Glass (Quartz) / Thickness 0.15mm A long hole with a width of 0.5mm has been trimmed into the glass thin plate. It is possible to shape fine holes. Fine processing of glass, such as cutting and trimming of thin and fragile glass plates, is possible.

  • Glass
  • Processing Contract
  • Other semiconductors
  • Microfabrication

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Laser microfabrication: Titanium hexagonal trimming processing with fine holes.

Laser microfabrication: Titanium hexagonal trimming processing with fine holes.

Laser shape processing: Trimming hexagons from difficult-to-machine titanium.

We have trimmed hexagonal holes into a thin sheet of highly biocompatible titanium. It is possible to shape fine holes. With a narrow remaining width, we can achieve fine processing with minimal burrs even for complex shapes. Material: Titanium Thickness: 0.2mm Size: Opening 200μm Shape: Hexagonal hole

  • Processing Contract
  • alloy
  • Lithium-ion battery
  • Microfabrication

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Microfabrication, nickel, hexagonal, trimming process, micro holes.

Microfabrication, nickel, hexagonal, trimming process, micro holes.

Laser fine shape processing: Nickel hexagonal trimming processing

Trimming processing was performed on nickel thin plates with a short-pulse laser, creating hexagonal holes. It is possible to shape fine holes. With non-thermal processing using a short-pulse laser, even difficult-to-cut materials can be finely processed with minimal burrs, even for complex shapes and narrow residual widths. While conventional machining imposes significant stress on the workpiece, leading to distortion and thermal effects that make it difficult to work with certain materials, short-pulse lasers can handle these challenges. Material: Nickel / Thickness: 200μm Hexagonal hole: Opening 200μm

  • Processing Contract
  • Evaporation Equipment
  • Engine parts
  • Microfabrication

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Laser microprocessing, glass processing, internal modification, marking.

Laser microprocessing, glass processing, internal modification, marking.

Laser microfabrication: Achieving internal modification of glass through processing to enable marking within the glass.

【Laser Micromachining Glass Processing Internal Modification Marking】 【Material】 Glass 【Industry/Application】 Medical parts-related industry 【Processing】 Ultrafast pulse laser processing 【Features】 This product underwent internal modification processing without damaging the glass surface using an ultrafast pulse laser. Since marking was performed inside the glass, it will not wear away. By using an ultrafast pulse laser, physical damage and thermal effects are significantly minimized, allowing for fine processing with minimal burrs. ◆ Micromachining of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects We take care of everything from processing to equipment setup. Hikari Kikai Seisakusho Co., Ltd. ■ HIKARI LASER LAB. 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

  • Processing Contract
  • Laser marker
  • Glass
  • Microfabrication

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Laser micromachining, fine trimming processing, copper, Cu, fine holes.

Laser micromachining, fine trimming processing, copper, Cu, fine holes.

Laser microfabrication: Ultra-fine long holes were trimmed into copper.

【Laser Micromachining Micro Trimming Processing Copper Cu Micro Holes】 【Material】 Copper (Cu) 【Material Dimensions】 Thickness 0.1mm (100μm) 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product achieves micro trimming processing on 0.1mm thick copper. The residual allowance between the long holes is 50μm, which is very fine. Copper is a material that is easily affected by heat, but by selecting the wavelength of the ultrashort pulse laser, it is possible to process fine shapes with reduced thermal effects. Physical damage and thermal effects are significantly minimized, resulting in fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects Leave it to us. We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hik

  • Processing Contract
  • Other semiconductor manufacturing equipment
  • Non-ferrous metals
  • Microfabrication

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Micro holes CFRP composite material micro machining

Micro holes CFRP composite material micro machining

Laser microprocessing: fine holes, CFRP, composite materials, microprocessing

【Micro Holes CFRP Composite Material Micro Machining】 【Material】 Composite Material CFRP 【Dimensions】 Hole Diameter 0.1mm Thickness 0.1mm 【Processing】 Ultra Short Pulse Laser Processing 【Features】 Drilling processing is performed on CFRP material. In mechanical processing, issues such as fiber entanglement and fiber breakage due to tool engagement can occur, but using a non-contact laser allows for processing without compromising functionality. The use of ultra-short pulse lasers minimizes physical damage and thermal effects, enabling fine machining with minimal burrs. ◆ Fine machining of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

  • Processing Contract
  • Contract manufacturing
  • Brake parts
  • Microfabrication

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Microfabrication Company Logo Ultra-short Pulse Laser Thin Film Material

Microfabrication Company Logo Ultra-short Pulse Laser Thin Film Material

Marking on aluminum thin films using ultrashort pulse lasers.

【Microfabrication Company Logo Mark Ultra-Short Pulse Laser Thin Film Material】 【Material】 Aluminum foil Thickness: 11μm 【Industry and Application】 Automotive industry Medical devices and medical parts industry Semiconductors and electronic components 【Dimensions】 Processing size: 3mm x 3mm square range 【Processing】 Ultra-short pulse laser processing 【Features】 This product features a company logo mark laser processed onto aluminum thin film material. Due to its thickness of 11μm, it is less likely to be affected by heat, allowing for clean processing.

  • Other electronic parts
  • Microfabrication

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Micro glass groove processing, contract processing, micro channels, medical parts.

Micro glass groove processing, contract processing, micro channels, medical parts.

Fine groove processing on the surface of glass materials is possible through contract processing.

【Material and Processing】 Glass, Microchannel, Groove width 200μm 【Features】 This product can process not only straight grooves but also curved microchannels in glass using ultrashort pulse lasers. 【Industry and Applications】 Automotive industry Medical devices and medical parts industry Semiconductors and electronic components

  • Glassware and containers
  • Microfabrication

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We processed holes in SUS pipes using fine laser machining!

We processed holes in SUS pipes using fine laser machining!

Fine holes were processed into SUS304 pipes using fine laser machining.

【Industry and Application】 Automotive-related industry Medical devices and medical parts-related industry Precision stainless steel micro parts for medical devices 【Material】 SUS304 (sus304) 【Dimensions】 Pipe outer diameter Φ1.5mm / Through hole diameter Φ0.5mm 【Processing】 Ultrashort pulse laser processing 【Features】 This product has undergone hole processing on a pipe shape made of SUS304 (sus304) material. Our fine laser processing allows for not only flat plate processing but also processing of cylindrical shapes like pipes. Since this product uses ultrashort pulse laser, physical damage and thermal effects are significantly minimized, enabling fine processing with minimal burrs.

  • Other electronic parts
  • Microfabrication

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High-precision micro-machining with reduced material stress and thermal deformation.

High-precision micro-machining with reduced material stress and thermal deformation.

Micron-level precision machining of various discharge machining (shape cutting discharge, fine groove processing) and brazed products.

Our company aims to provide consistent production from prototype to mass production, including material procurement, processing, surface treatment, and assembly, in line with customer requests for cost, quality, and delivery time, as well as creating products with strong proposal capabilities. We specialize in fine processing of copper and aluminum with reduced stress on materials, and we are capable of various types of processing such as fine engraving, narrow grooves, thin plate wire cutting, and high-precision machining. We accommodate a wide range of metal processing for materials including forged and cast materials, utilizing our unique technologies and know-how developed over many years to meet the diverse needs of our customers. 【Strengths】 ■ Fine processing of copper and aluminum with reduced stress on materials ■ Various types of processing: fine engraving, narrow grooves, thin plate wire cutting, high-precision machining ■ Fine and high-precision processing of high-hardness materials *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Microfabrication

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Wafer microfabrication

Wafer microfabrication

Can be processed into various semiconductor substrates, glass, diamonds, etc.

Our company has a track record of processing various wafers at a sub-micron scale. Additionally, we can process according to your desired periodic patterns and aspect ratios, and we also offer suggestions from the design of the patterns.

  • Etching Equipment
  • Electron beam lithography equipment
  • Processing Contract
  • Microfabrication

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Urethane ECZ fine processing

Urethane ECZ fine processing

We performed fine hole drilling on urethane using punch processing. ECZ has a relatively low density, and while the precision aspect is strict, it is machinable.

It was made by punching from a 10t plate material. It's quite small at φ3.8×φ1.2, and when there are many, removing the center waste can be quite challenging. We can accept orders even from prototypes, so please feel free to contact us.

  • Other polymer materials
  • Microfabrication

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Microfabrication of different shapes on the top and bottom surfaces [Processing Technology]

Microfabrication of different shapes on the top and bottom surfaces [Processing Technology]

We will take on a wide variety of precision machining, focusing on micron grinding and wire electrical discharge machining!

The photo shows a test processing that has been enlarged to the specified dimensions. In this processing, the width of the islands remaining inside the holes was successfully reduced to 0.2 mm or less. A plate of 0.2 mm or less penetrates to a depth of 30 mm. We aim to make it even thinner and longer by changing the conditions. *For more details, please download the PDF or contact us.*

  • Processing Contract
  • alloy
  • Microfabrication

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Microfabrication of ultra-thin plates

Microfabrication of ultra-thin plates

We will take on a wide variety of precision machining, focusing on micron grinding and wire electrical discharge machining!

The left photo shows the side view captured with tweezers. Outer diameter approximately 10 mm Inner diameter 8 mm, tolerance 2 microns Thickness 0.02 mm Processing thin plates is difficult due to many issues such as chucking and bending, but we have succeeded in ensuring tolerances and mass production through jig manufacturing. *For more details, please download the PDF or contact us.*

  • Processing Contract
  • alloy
  • Microfabrication

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Micro-dimple treatment for serrated edges

Micro-dimple treatment for serrated edges

Countermeasures against edge chipping by applying compressive residual stress! MD treatment to suppress adhesion of the target object *Also compatible with PFAS regulations.

Our company performs "micro-dimple processing" on serrated edges. This process involves projecting fine particles with a diameter of several tens of micrometers onto the surface of the substrate, resulting in plastic deformation that forms micro dimples on the substrate surface. Additionally, this imparts compressive residual stress, improving the fatigue strength and sliding characteristics of the substrate. By further applying an ultra-thin DLC film, we can enhance durability and corrosion resistance without affecting cutting performance. 【Features】 - Improved fatigue strength and sliding characteristics of the substrate - Enhanced durability - Reduced cleaning frequency - Improved cleanability - Suppression of adhesion on the target object *For more details, please download the PDF or feel free to contact us.

  • Other contract services
  • Microfabrication

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Prototype and mass production, precision machining

Prototype and mass production, precision machining

We undertake everything from prototype development to mass production processing.

Prototype and mass production processing "microfabrication" offers optimal processing methods based on various laser processing machines and years of accumulated data and know-how, carried out by skilled technicians. For more details, please download the catalog or contact us.

  • Processing Contract
  • Prototype Services
  • Microfabrication

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"Laser Micromachining" *Materials with case studies will be provided.

"Laser Micromachining" *Materials with case studies will be provided.

Achieving high-quality precision processing with optical systems tailored to materials and shapes. Consistent support from prototyping to mass production.

Our company conducts prototyping and mass production using "laser microprocessing." Leveraging our knowledge and experience from selling laser processing equipment, we propose optical systems and oscillators that match the materials and processing requirements. Additionally, we can provide comprehensive support in-house for combined processing that incorporates machining and micro-blasting, addressing a wide range of needs from prototyping to mass production. ★ You can view materials showcasing processing examples from the "PDF Download." 【Examples Listed (Excerpt)】 ◎ Laser Drilling Multi-hole processing on ceramics, drilling on tempered glass, and through-hole drilling and counterboring on glass substrates. ◎ Cutting, Grooving, Drilling, Thin Film Removal Grooving on SiC substrates, free-form cutting of polyimide, and cutting out carbon sheets. *Please feel free to contact us with any inquiries.

  • Processing Contract
  • Other processing machines
  • Microfabrication

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Dimple processing examples

Dimple processing examples

Dimple processing for punches, piston rings, and the inner surface of cylinders.

By applying dimple processing to the punch, piston rings, and the inner surface of the cylinder, it is possible to maintain a good sliding environment without experiencing oil film breakage, even under harsh sliding conditions that might otherwise lead to oil film failure.

  • cylinder
  • Microfabrication

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Case study of fine square hole machining on tungsten (W) using ultrashort pulse laser.

Case study of fine square hole machining on tungsten (W) using ultrashort pulse laser.

This is an introduction to a case of micro-fine square hole processing on a tungsten plate with a thickness of 0.1mm.

【Processing Specifications】 Plate Thickness: 0.1mm Hole Dimensions (Incident Surface): 0.3×0.3mm Pitch: 0.6mm Processing Range: 45×45mm You will see that it has been processed in a very beautiful state with minimal thermal impact, without chipping or cracking. The gap between the square holes is approximately 0.015mm or less, making it a good example of the characteristics of short pulse lasers. Tungsten (W) has an extremely high melting and boiling point and is the material with the lowest coefficient of linear expansion among metals. Additionally, due to its very high hardness, it is well known as a material for cemented carbide. However, it is difficult to process, and in machining, there are challenges such as tool wear and chipping, making it particularly regarded as a material that is difficult for fine processing. Nevertheless, there is a high demand for fine processing, and various methods have been repeatedly challenged, but none of the conventional methods were able to achieve the desired shapes. At Lips Works Co., Ltd., we thoroughly explored the appropriate values for optical systems, control systems, laser power, etc., and finally established beautiful fine processing technology for tungsten. There are no concerns about tool wear or breakage, or variations in quality that are seen in machining or other methods.

  • Processing Contract
  • Microfabrication

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CFRP straight hole machining case study

CFRP straight hole machining case study

We will introduce micro-fine processing of CFRP materials using ultra-short pulse lasers.

CFRP has been utilized mainly in automobiles and aircraft, where improving fuel efficiency and maintaining strength are essential, due to its strength and lightness. On the other hand, it has traditionally been considered a material that is difficult to process, with challenges such as burrs caused by thermal effects during cutting and delamination due to its laminated structure. At Lips Works, we propose micro-fine processing of CFRP using ultra-short pulse lasers. The processing example we are introducing this time is straight hole machining. As you can see, we are able to achieve processing with almost no burrs or delamination. At Lips Works, we also offer various processing options besides drilling, such as cutting and micro-texturing. Please take a look at our company website.

  • Processing Contract
  • Microfabrication

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Various fine processing for SK materials

Various fine processing for SK materials

Cutting, engraving, and grooving of SK material were performed using an ultra-short pulse laser.

Using ultra-short pulse lasers with minimal heat impact on SK material (carbon tool steel) used for punches and dies in press molds, we performed recessed machining and various groove machining.

  • Processing Contract
  • Microfabrication

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