We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Plating Equipment.
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Plating Equipment Product List and Ranking from 39 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

Plating Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. 上村工業 Osaka//Chemical
  2. 共和機器製作所 Saitama//Machine elements and parts
  3. テクニックジャパン 横浜実験室 Kanagawa//Resin/Plastic
  4. 4 山本鍍金試験器 Tokyo//Resin/Plastic
  5. 5 SETO ENGINEERING 守谷事業所 Ibaraki//Industrial Machinery
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Plating Equipment Product ranking

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. Small item dedicated plating device 'Flow-through Plater RP-2' 上村工業
  2. Surface treatment, electroplating, barrel plating: Case study of open-type detachable inclined barrel. 共和機器製作所
  3. Vertical Conveying Continuous Plating Device 'U-VCPS' 上村工業
  4. Plating equipment - Roll to roll plating equipment テクニックジャパン 横浜実験室
  5. 5 Electroplating of precision parts (surface treatment) with barrel plating! Super Barrel. 共和機器製作所

Plating Equipment Product List

61～82 item / All 82 items

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Kamikiko, a manufacturer of surface treatment equipment.

Kamikiko, a manufacturer of surface treatment equipment.

We are continuously engaged in the production of small machines, including on-site construction, as well as the manufacturing of levelers and automatic machines!

Kabi Kiko Co., Ltd. offers a wide range of services from the production of levelers to automatic plating equipment. We can handle everything from "machining to assembly" and "electrical schematics to electrical control," and we can also accommodate partial requests. In terms of plating equipment, we have experience in both carrier-type and elevator-type systems, as well as in the production of fine levelers (eutectic and lead-free) and material handling machines. Please feel free to contact us for inquiries. 【Features】 ■ Wide-ranging support from levelers to automatic plating equipment ■ Comprehensive support from "design to software creation" and everything in between ■ Capability to handle "machining to assembly" and "electrical schematics to electrical control," including partial requests ■ Effective utilization of human resources using robots *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing
  • Other surface treatment equipment
  • Plating Equipment
  • Plating Equipment

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Automated Driving Vehicle Type Barrel Plating Device 'PB404'

Automated Driving Vehicle Type Barrel Plating Device 'PB404'

We also offer completely custom-made products made 100% in-house!

Our automated driving barrel plating device 'PB404' has improved processing speed through enhancements in barrel hole design. (Patent pending) The process selection is easy, and individual barrel current adjustment is possible. We also accept design and manufacturing of labor-saving machines and automation equipment, so please feel free to contact us if you have any requests. *For more details, please download the PDF or feel free to contact us.

  • Plating Equipment
  • Mechanical Design
  • Contract manufacturing
  • Plating Equipment

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Plating device "Light TERI Shine MM-10"

Plating device "Light TERI Shine MM-10"

This one machine is good for electrolysis, degreasing, and plating!

The "Hikari TERI Radiance MM-10" is a compact plating device that can be installed in a small space. By using the optional plating pen, it is also capable of partial plating. Additionally, it allows for plating processing in a short time, contributing to repairs and sample creation. 【Features】 ■ Partial plating is possible with the optional plating pen ■ Easy to use, clean, and convenient ■ Useful for repairs and sample creation due to quick processing ■ Beaker size can be changed from 300ml to 500ml with options ■ Requires a small amount of plating solution, reducing waste *For more details, please download the PDF or feel free to contact us.

  • Plating Equipment
  • Plating Equipment

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Equipment, ancillary devices, construction

Equipment, ancillary devices, construction

We create inspection equipment and more from scratch based on your proposals! We fully support your desires related to manufacturing.

At YKC Corporation, we provide a comprehensive service for "equipment, ancillary devices, and construction," including the selection and installation of factory exhaust ducts and scrubbers. We also offer custom proposals for inspection devices tailored to your products, supporting your manufacturing needs with full commitment to your "wants." We respond to diverse needs, so please feel free to contact us when you require our services. 【Features】 ■ Comprehensive support from the selection of factory exhaust ducts and scrubbers to installation ■ Custom proposals for inspection devices tailored to your products ■ Full support for your manufacturing desires *For more details, please refer to the PDF document or feel free to contact us.

  • Other consumables
  • tank
  • Wastewater/wastewater treatment equipment
  • Plating Equipment

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Electroplating of precision parts (surface treatment) with barrel plating! Super Barrel.

Electroplating of precision parts (surface treatment) with barrel plating! Super Barrel.

Are you having trouble with barrel plating of precision parts? We have the know-how to achieve a more uniform film thickness without defects in barrel plating than ever before!

The "Super Barrel" can achieve very uniform and high-quality plating and surface treatment for precision parts (electrical and semiconductor components), which have traditionally been considered difficult. Electroplating (surface treatment) of precision parts such as chip capacitors and chip resistors has faced issues with size uniformity and defect rates due to their extremely small size. The "Super Barrel" from Kyowa Equipment Manufacturing maintains the high plating efficiency characteristic of barrel plating while improving the defect rates of precision and micro parts. ■ Features - Unique lid opening and closing mechanism that prevents precision parts and micro products from getting stuck or caught on the inner surface. - High opening rate that enhances the stirring efficiency of products inside and excels in plating thickness uniformity. - Specially shaped electrodes that do not deform even with easily bendable products. * For more details, please download the PDF or contact us.

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  • Other surface treatment equipment
  • Plating Equipment

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Surface treatment and electroplating: Fully automatic barrel plating equipment with IH carrier system.

Surface treatment and electroplating: Fully automatic barrel plating equipment with IH carrier system.

Short delivery times, low costs, high efficiency, and high productivity! It is packed with Kyoei's unique technological know-how.

The "IH Carrier System Fully Automatic Barrel Plating Device" is equipped with a unique ultra-compact "IH Carrier" utilizing a H-beam monorail system. Control can be customized from fully automatic to semi-automatic as desired. It adopts an add-on method, making it easy to expand after installation. Of course, a super operator can also be installed. The accompanying equipment is filled with Kyoei's unique technical know-how. This product is characterized by short delivery times, low costs, high efficiency, and high productivity. 【Features】 ■ Automatic machine specification with a double-barrel (BF butterfly type with mesh) ■ Equipped with a unique ultra-compact "IH Carrier" utilizing a H-beam monorail system ■ Customizable from fully automatic to semi-automatic ■ Adopts an add-on method, making it easy to expand after installation ■ Super operator can also be installed *For more details, please refer to the PDF document or feel free to contact us.

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  • Other surface treatment equipment
  • Plating Equipment

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Surface treatment and barrel plating equipment "Super Barrel" *Case studies available

Surface treatment and barrel plating equipment "Super Barrel" *Case studies available

For barrel plating of fine precision parts. Solving various issues such as entrapment defects in lids. Presenting case studies that compile our know-how! Perfect for surface treatment of precision parts.

The "Super Barrel" is a barrel plating device that achieves high-quality plating with excellent uniformity and adhesion for precision parts (electrical and semiconductor components). Thanks to its unique lid opening and closing mechanism, even extremely small and thin parts are not pinched by the lid, preventing adhesion and snagging on the inner surface. It maintains high plating efficiency while contributing to the improvement of defect rates. We offer a lineup including ultra-compact experimental models, manual motor-equipped types, and automatic machines. We can provide standard sizes as well as accommodate customization of specifications and dimensions. 【Features】 ■ High opening rate ensures efficient stirring of products inside, resulting in excellent plating thickness uniformity. ■ Specially designed electrodes that do not deform, even for easily bendable products. ■ Capable of meeting needs such as extending barrel lifespan and reducing plating time. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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  • Other surface treatment equipment
  • Plating Equipment

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REEL to REEL Ag spot plating device

REEL to REEL Ag spot plating device

Compact design with FL +1000mm! Partial plating is also possible with drum plating.

Our company offers the 'REEL to REEL Ag Spot Plating Equipment' with automatic control using a touch panel and sequencer. By adopting an image processing system, we can reproduce plating area accuracy of ±0.07mm without pilot pins. Additionally, stable power supply and transport can be ensured with special power supply rollers and guide rollers. 【Equipment Overview】 ■ Number of Rows: 2 to 3 rows ■ Line Speed: Standard 3.6 to 4.0m/min ■ Target Products: Lead Frame, LED Frame, and others ■ Basic Plating Specifications: Cu + Ni + Ag Spot ■ Target Materials: 42 Alloy, Cu Alloy *For more details, please download the PDF or feel free to contact us.

  • Plating Equipment
  • Plating Equipment

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Small carrier-type plating equipment for substrates

Small carrier-type plating equipment for substrates

Communication between the computer and the sequencer allows for easy operation and data management!

We handle a "small carrier-type plating device for substrates" designed to function as a comprehensive system, including tanks, carriers, and circulation methods. The entire device is compact and considers workability. Additionally, the use of AC servo motors for the carrier ensures stable operation. 【Device Overview】 ■ Basic Style: MCS-02P ■ Basic Mechanism: Cantilever Carrier Type ■ Travel Speed: 20m/min ■ Lifting Speed: 7m/min ■ Plating Specifications: According to your specifications ■ Material: Printed Circuit Board *For more details, please download the PDF or feel free to contact us.

  • Plating Equipment
  • Plating Equipment

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Semiconductor rack-type semi-automatic plating equipment

Semiconductor rack-type semi-automatic plating equipment

Use cassettes at the load/unload station!

We offer a "semiconductor rack-type semi-automatic plating device" that contributes to productivity improvement through parallel processing of two plates. Due to the presence of a buffer area for the fixtures, production can proceed without affecting user operation procedures. Additionally, we can provide equipment tailored to customer processes. Please feel free to contact us with your requests. 【Device Overview】 ■ Target Size: 6 inches to 12 inches ■ Target Plating: Composite such as Ni/Cu/Sn ■ Device Type: Semi-Automatic (Includes equipment for loading and unloading products onto the fixture) *For more details, please download the PDF or feel free to contact us.

  • Plating Equipment
  • Plating Equipment

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Automatic barrel plating equipment

Automatic barrel plating equipment

The automatic barrel plating device provides a production line from degreasing the material to plating and drying.

The automatic barrel plating equipment provides a production line from degreasing of the material to plating and drying. With computer-controlled management, quality stability is maintained, and by incorporating special operations, it is possible to prevent stains on the products. This advanced technology allows for various types of plating. The types of plating produced on the automatic barrel plating line include copper plating such as blue copper, copper sulfate, and copper pyrophosphate, nickel plating, semi-gloss and matte silver plating, and semi-gloss and matte tin plating (organic acid bath). It also accommodates tin-nickel alloy plating, zinc plating, and copper-tin alloy plating (black, white) that is nickel-free. Additionally, a variety of platings are available, including gold plating and black tin-cobalt alloy plating. As a result, high-quality plating treatments are provided to meet all needs, achieving high durability and beautiful finishes required for precision products. Related URL: http://www.masuda.to/quality/

  • Surface treatment contract service
  • Plating Equipment

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What is roll to roll? ~Plating Edition Part 2~

What is roll to roll? ~Plating Edition Part 2~

We provide an easy-to-understand explanation of the "electrolytic plating" using the roll-to-roll method!

This document introduces the plating process conducted using a roll-to-roll method. There are various methods and types of plating performed using the roll-to-roll technique. Among them, we explain the electrolytic plating. In the section on types of electrolytic plating, we also introduce the features, conditions, and challenges. As mentioned in "Plating Part 1," both electrolytic and electroless plating have their own characteristics, so it is necessary to choose the plating that leverages those characteristics depending on the product being made. Please take a moment to read it. *For more details, please refer to the PDF document or feel free to contact us.*

  • Other machine elements
  • Plating Equipment

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Japan Platech Zinc Coating Equipment (Pusher Type)

Japan Platech Zinc Coating Equipment (Pusher Type)

Patents have been obtained in the USA, EU, and China.

In our workshop, we not only assist everyone with their prototypes but also conduct independent research for development. We look forward to your use of our services.

  • Processing Contract
  • Plating Equipment

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Japan Playtech Rotating Zinc Plating Device (Pusher Type)

Japan Playtech Rotating Zinc Plating Device (Pusher Type)

Patents have been obtained in the USA, EU, and China.

In our workshop, we not only assist everyone with their prototypes but also conduct independent research for development. We look forward to your use of our services.

  • Processing Contract
  • Plating Equipment

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Japan Platech Manual Iron Plating Device

Japan Platech Manual Iron Plating Device

Patents have been obtained in the USA, EU, and China.

In our workshop, we not only assist everyone with their prototypes but also conduct independent research for development. We look forward to your use of our services.

  • Processing Contract
  • Plating Equipment

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[Web Seminar] Basics of Plating in the Lithography Process

[Web Seminar] Basics of Plating in the Lithography Process

Plating in the lithography process, basics of resist masks and troubleshooting measures - Stabilization of shape and dimensions, adhesion and peeling, bubble and defect countermeasures.

In recent years, plating technology has established its importance as a foundational technology in the electronics industry. In electronics such as semiconductor devices, high-frequency printed circuit boards, and MEMS, it is primarily utilized as a wiring formation technology. Additionally, lithography technology is necessary to form high-precision wiring and plug structures. This technology forms a plating layer limited to areas designed with a resist mask. The resist mask is also used as an etching mask. High precision of the resist mask is essential for controlling the wiring shape through plating. In this seminar, we will discuss the plating technology of wiring materials such as Cu and Ni, the basics of lithography technology, and the enhancement of resist mask precision. We will also explain troubleshooting methods for issues such as mask deformation and mask peeling. This course is designed to be easy to understand for beginners, allowing them to learn from the basics. Additionally, we will address daily troubleshooting consultations that participants may have.

  • Company：S&T出版
  • Price：10,000 yen-100,000 yen
  • Management Skills Seminar
  • Technical Seminar
  • Plating Equipment

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Plating of fine products *Barrel size can be selected according to product shape and quantity.

Plating of fine products *Barrel size can be selected according to product shape and quantity.

Depending on the shape and quantity of the barrel plating products, we will adjust the hardness of the lead wires and the shape of the contact parts accordingly.

Our barrel plating line, with various specifications, accommodates a wide range of fine products. Depending on the shape and quantity of the products, we offer several barrel sizes, and for small quantities, we can accommodate by adding a medium that facilitates electrical conduction. Thanks to our unique medium shapes and quantities, plating of fine products is made possible. 【Features】 ■ Innovations in lead wires - We adapt the hardness and shape of the contact part of the lead wires according to the shape and quantity of the products. ■ Selection of barrels based on product shape and quantity - We have several barrel sizes available to accommodate the shape and quantity of the products. - For small quantities, we add a medium that facilitates electrical conduction. - Plating of fine products is possible due to our unique medium shapes and quantities. *For more details, please refer to the PDF document or feel free to contact us.

  • Plating Equipment
  • Plating Equipment

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[Research Material] World Market for Plating Equipment

[Research Material] World Market for Plating Equipment

World Market for Plating Equipment: Automatic Plating Equipment, Semi-Automatic Plating Equipment, Others, Automotive, Machinery, Home Appliances, Electronics, Others

This research report (Global Plating Equipment Market) investigates and analyzes the current state of the global plating equipment market and its outlook for the next five years. It includes information on the overview of the global plating equipment market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the plating equipment market include automatic plating equipment, semi-automatic plating equipment, and others, while the segments by application cover automotive, machinery, home appliances, electronics, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of plating equipment. It also includes the market share of major companies in plating equipment, product and business overviews, and sales performance.

  • Other services
  • Plating Equipment

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[Research Material] Global Market for Film Plating Equipment

[Research Material] Global Market for Film Plating Equipment

World Market for Film Coating Equipment: Evaporation Coating Machines, Sputter Coating Machines, Industrial, Automotive, Consumer Goods, Others

This research report (Global Film Plating Machine Market) investigates and analyzes the current status and outlook for the global film plating machine market over the next five years. It includes information on the overview of the global film plating machine market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the film plating machine market focus on evaporation coating machines and sputtering coating machines, while the segments by application cover industrial, automotive, consumer goods, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of film plating machines. It also includes the market share of major companies in the film plating machine sector, product and business overviews, and sales performance.

  • Other services
  • Plating Equipment

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Japan Platech Rotating Nickel Plating Device (Carrier Type)

Japan Platech Rotating Nickel Plating Device (Carrier Type)

Patents have been obtained in the USA, EU, and China.

In our workshop, we not only assist everyone with their prototypes but also conduct independent research for development. We look forward to your use of our services.

  • Processing Contract
  • Plating Equipment

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Japan Platech Tin Plating Equipment (Carrier Type)

Japan Platech Tin Plating Equipment (Carrier Type)

Patents have been obtained in the USA, EU, and China.

In our workshop, we not only assist everyone with their prototypes but also conduct independent research for development. We look forward to your use of our services.

  • Processing Contract
  • Plating Equipment

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[Research Material] Global Market for Electroplating Equipment

[Research Material] Global Market for Electroplating Equipment

World Market for Electroplating Equipment: Automatic, Semi-Automatic, Others, Automotive, Machinery, Home Appliances, Electronic Devices, Others

This research report (Global Electroplating Equipment Market) investigates and analyzes the current status and outlook for the global market of electroplating equipment over the next five years. It includes information on the overview of the global electroplating equipment market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the electroplating equipment market include automatic, semi-automatic, and others, while the segments by application cover automotive, machinery, home appliances, electronic devices, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of electroplating equipment. It also includes the market share of major companies in the electroplating equipment sector, product and business overviews, and sales performance.

  • Other services
  • Plating Equipment

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