We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Plating Equipment.
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Plating Equipment Product List and Ranking from 37 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

Plating Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

  1. 共和機器製作所 Saitama//Machine elements and parts
  2. 上村工業 Osaka//Chemical
  3. テクニックジャパン Kanagawa//Resin/Plastic 横浜実験室
  4. 4 山本鍍金試験器 Tokyo//Resin/Plastic
  5. 5 SETO ENGINEERING Ibaraki//Industrial Machinery 守谷事業所
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Plating Equipment Product ranking

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

  1. Small item dedicated plating device 'Flow-through Plater RP-2' 上村工業
  2. Plating equipment - Roll to roll plating equipment テクニックジャパン 横浜実験室
  3. Surface treatment, electroplating, barrel plating: Case study of open-type detachable inclined barrel. 共和機器製作所
  4. Surface treatment and electroplating: Fully automatic barrel plating equipment with IH carrier system. 共和機器製作所
  5. 4 Automatic barrel plating equipment 増田工業 我孫子本店

Plating Equipment Product List

31～45 item / All 82 items

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Medium-sized universal plating device "Light TERI Shine MM-18T"

Medium-sized universal plating device "Light TERI Shine MM-18T"

You can choose the beaker size! The liquid is stirred, allowing for uniform plating.

The "Hikari TERI Radiance MM-18T" is a medium-sized versatile plating device that allows for stable and beautiful plating due to its constant voltage and constant current features. The beaker sizes range from 1 liter to 5 liters. The liquid is stirred, enabling uniform plating. Additionally, we offer various plating solutions as options, including plating pen sets, rhodium plating, K24, K18 plating, and glossy nickel plating. 【Features】 ■ Constant voltage and constant current type ■ Enables stable and beautiful plating ■ Uniform plating due to liquid stirring *For more details, please refer to the PDF materials or feel free to contact us.

  • Other processing machines

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Examples of surface treatment, electroplating, and barrel plating with a four-sided drop design barrel lid.

Examples of surface treatment, electroplating, and barrel plating with a four-sided drop design barrel lid.

Countermeasures against clamping defects for ultra-small precision parts and ultra-thin sheet parts! Suppressing the time-dependent deformation of barrels for longer lifespan! For surface treatment, electroplating, and barrel plating!

We would like to introduce a case study that implemented our original "four-sided drop lid (slide opening and closing mechanism)." In terms of design, we manufactured with a lid clearance of at least 0.3 mm for large barrels, 0.2 mm for medium barrels, and 0.1 mm for small barrels, addressing issues with the clamping of extremely small and thin parts. As a result, we successfully eliminated unnecessary sorting processes after the plating process, achieving significant cost reductions. [Case Study] <Problems> ■ We want to eliminate product lid clamping defects and reduce costs. ■ We aim to extend the lifespan by suppressing barrel deformation. <Implementation Effects> ■ Achieved significant cost reductions. ■ Enabled longer lifespan than before. *For more details, please refer to the PDF document or feel free to contact us.

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  • Other surface treatment equipment

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Surface treatment, electroplating, barrel plating: Case study of open-type detachable inclined barrel.

Surface treatment, electroplating, barrel plating: Case study of open-type detachable inclined barrel.

Improve the refresh rate of the processing liquid in micro-hole barrels or mesh-coated barrels! It enables a reduction in surface treatment and plating time!

Here is a case study introducing the "open-type inclined barrel" equipped with a liquid circulation pump. In a customer’s operation where ultra-fine precision parts are plated using a conventional sealed barrel with a lid opening and closing, the liquid renewal inside and outside the barrel was poor due to the sealed design. As a result, the metal concentration was depleted during the plating process, leading to defects caused by voltage issues. In response, we proposed our product. Additionally, the design allows for easy one-touch detachment of the barrel, enabling the preparation of multiple barrels with different sizes and specifications for various plating products, thus accommodating small-batch, diverse plating processes. 【Case Study】 <Implementation Effects> ■ Capable of handling small-batch, diverse plating processes ■ Improved uniformity of the plating film ■ Enhanced liquid renewal due to the circulation pump ■ Reduction of sticking and floating of ultra-fine products inside the barrel achieved through radial liquid ejection *For more details, please refer to the PDF document or feel free to contact us.

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  • Other surface treatment equipment

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Surface treatment and barrel plating equipment "Super Barrel" *Case studies available.

Surface treatment and barrel plating equipment "Super Barrel" *Case studies available.

For barrel plating of fine precision parts. Solving various issues such as poor adhesion to lids with a wide range of product specifications.

The "Super Barrel" is a barrel plating device that can perform high-quality plating treatments on precision parts (electrical and semiconductor components) with excellent uniformity and adhesion. Thanks to its unique lid opening and closing mechanism, it minimizes the risk of small and thin parts getting caught in the lid, preventing adhesion and snagging on the inner surface. It contributes to improving defect rates while maintaining high plating efficiency. We offer a lineup including ultra-compact experimental models, manual motor-equipped types, and fully automated models. In addition to standard sizes, we can also accommodate customization of specifications and dimensions. 【Features】 ■ High internal product agitation efficiency, resulting in excellent uniformity of plating thickness ■ Specially designed electrodes that do not deform even for easily bendable products ■ Capable of meeting needs such as extending barrel lifespan and reducing plating time *For more details, please refer to the materials available for download in PDF format. We are also offering a "Case Study Collection" that introduces specification examples! Feel free to contact us for inquiries.

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  • Other surface treatment equipment

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Reel to reel connector plating device

Reel to reel connector plating device

Achieving plating accuracy of ±0.1mm with our drum plating structure!

We offer the 'REEL to REEL Connector Plating Equipment' that achieves a plating accuracy of ±1.0mm through the adoption of special liquid level control. With a product pass line of FL +1000mm for ease of operation and a compact design, it supports energy saving and reduced wastewater. Additionally, stable transport can be achieved with special guide rollers. 【Equipment Configuration】 ■ Basic Model: MRC-02 to 03 ■ Number of Lines: 2 to 3 lines ■ Line Speed: 1.0 to 25.0m/min ■ Target Products: Connectors and materials ■ Target Materials: Cu alloys, SUS, etc. *For more details, please download the PDF or feel free to contact us.

  • Plating Equipment

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Short-length Ag spot plating device

Short-length Ag spot plating device

You can change the plating jig without stopping the other lanes!

Our company offers a compact design of the 'Short-Length Ag Spot Plating Device' with a convenient pass line of FL+1000mm. It adopts a special overflow method suitable for thin materials and multiple pins. Additionally, the loading section can switch between vacuum and chuck types. 【Device Overview】 ■ Basic Model: MMS-02 (03・04) ■ Number of Bars: 4 bars ■ Line Speed: 0.5m to 2.0m/min (Normal: 1.6m/min) ■ Pass Line: FL+1000mm ■ Cycle Time: 17.5 seconds/cycle (Machine: 8sec + Plating) and more *For more details, please download the PDF or feel free to contact us.

  • Plating Equipment

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High-speed partial plating method "I-Cor Plating"

High-speed partial plating method "I-Cor Plating"

No need for a plating tank. High-speed plating can be done only on the necessary parts at the site.

"Icall Plating" uses a portable power source to perform high-speed partial plating only where needed. It is an electroplating method that does not require a plating bath, and the metal to be plated is deposited from a plating solution contained in a dedicated gauze attached to the electrode. Additionally, plating of approximately 30 different metals is possible. 【Features】 ■ High adhesion ■ High-speed plating ■ Portable device ■ Easy thickness management *For more details, please download the PDF or feel free to contact us.

  • Surface treatment contract service

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[Research Material] World Market for Plating Equipment

[Research Material] World Market for Plating Equipment

World Market for Plating Equipment: Automatic Plating Equipment, Semi-Automatic Plating Equipment, Others, Automotive, Machinery, Home Appliances, Electronics, Others

This research report (Global Plating Equipment Market) investigates and analyzes the current state of the global plating equipment market and its outlook for the next five years. It includes information on the overview of the global plating equipment market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the plating equipment market include automatic plating equipment, semi-automatic plating equipment, and others, while the segments by application cover automotive, machinery, home appliances, electronics, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of plating equipment. It also includes the market share of major companies in plating equipment, product and business overviews, and sales performance.

  • Other services

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Shimatani Giken Co., Ltd. - Products Handled

Shimatani Giken Co., Ltd. - Products Handled

We will introduce the "Electrolytic Device Cleaning and Drying Equipment" and "Plating Equipment" that we handle.

Shimatani Giken Co., Ltd. designs and manufactures custom-made electroplating equipment, electroless plating equipment, diaphragm electrolysis equipment, acid treatment equipment, chemical treatment equipment, and anodizing equipment. We offer a wide range of products, including the "Direct Electrolysis Device" that uses titanium plates to recover rare metals, the safety-enhanced "Fully Automatic Cleaning, Suction, and Drying Device," and the cleanroom-compatible "Electroless Ni/Pd/Au Plating Device." 【Product Lineup (Excerpt)】 < Electrolysis and Cleaning Drying Equipment > ■ Direct Electrolysis Device ■ Fully Automatic Ultrasonic Cleaning Device ■ Fully Automatic Cleaning, Suction, and Drying Device *For more details, please refer to the PDF document or feel free to contact us.

  • Drying Equipment
  • Plating Equipment
  • Other machine elements

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Dedicated small parts fully automatic high-speed plating equipment

Dedicated small parts fully automatic high-speed plating equipment

A series of plating processes can be performed in a single module.

High current density (high speed) plating is possible. By changing the filter, plating on fine powders (10-50μm) is possible. It can also be used as an experimental device.

  • Other surface treatment equipment
  • Other electronic parts

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Zinc elevator-type barrel plating device

Zinc elevator-type barrel plating device

Zinc elevator-type barrel plating device

The zinc elevator-type barrel plating device developed by our company has significantly increased processing speed compared to previous devices with a takt time of 30 seconds. By adopting an elevator system, it allows for efficient processing, greatly increasing the amount processed per unit time. Being a compact processing device, it is ideal for post-processing of small lots with a variety of products. ★ Short takt time The usual takt time of 3 minutes has been reduced to 30 seconds, dramatically reducing the labor required for post-processing. ★ Elevator system By adopting an elevator system, we have achieved efficient processing and increased the amount processed per unit time. ★ Suitable for small lots with a variety of products As a compact processing device, it is optimal for post-processing of small lots with a variety of products.

  • Other processing machines
  • Other surface treatment equipment
  • Other semiconductor manufacturing equipment

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Continuous baking type zinc plating equipment

Continuous baking type zinc plating equipment

Continuous baking-type zinc plating equipment

The continuous baking-type zinc plating equipment developed by our company is very convenient as it comes standard with a baking device. Additionally, the baking device can automatically load and process materials, eliminating the need for manual loading and reducing the overall processing time. Furthermore, by adopting a carrier system, efficient processing can be achieved, significantly increasing the amount processed per unit of time.

  • Other processing machines
  • Other surface treatment equipment
  • Other semiconductor manufacturing equipment

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Plating equipment SBE (jet-type) plating equipment

Plating equipment SBE (jet-type) plating equipment

A completely new concept for a rotating plating device that replaces barrels.

A completely new concept of a rotary plating device developed by Technique Corporation, which replaces barrels.

  • Other surface treatment equipment

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Dissolving copper plating device

Dissolving copper plating device

Semi-additive pattern plating is also possible! We would like to introduce our molten copper plating equipment.

The device can perform electrolytic copper plating on blind vias and through holes. Material thickness ranges from PI 25μm, and material width is up to 540mm. Semi-additive pattern plating is also possible. Additionally, plating for CCL materials is available. Please feel free to consult us. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 0.5m to 1.5m/min (depending on specifications) ■ Material width: 540mm ■ Material thickness: PI 25μm and above ■ Processing surface: Both sides (one side or both sides) *For more details, please refer to the PDF document or feel free to contact us.

  • Other cleaning machines
  • Drying Equipment
  • Plating Equipment

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Non-electrolytic tin plating equipment

Non-electrolytic tin plating equipment

The transfer speed is 2.0m/min, material thickness: compatible with PI 25μm and above! Introducing our electroless tin plating equipment.

This product is a device for electroless tin plating on wiring patterns. The transport speed is 2.0 m/min, and the material width is for TAB/CSP/COF ranging from 35 mm to 160 mm, and for FPC from 250 mm to 300 mm. The device consists of the following processes: unwinding → pretreatment → tin plating → post-treatment/water rinse → water wash → liquid separation → drying → winding. 【Specifications】 ■ Lane configuration: 2 Lane ■ Material thickness: PI 25 μm and above ■ Processing surface: single side ■ Utilities: Power supply AC 200V・220V / 50Hz・60Hz, city water, pure water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 38mL × 2.5mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate. *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • Plating Equipment

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