We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Plating Equipment.
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Plating Equipment Product List and Ranking from 37 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

Plating Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

  1. 共和機器製作所 Saitama//Machine elements and parts
  2. 上村工業 Osaka//Chemical
  3. テクニックジャパン Kanagawa//Resin/Plastic 横浜実験室
  4. 4 山本鍍金試験器 Tokyo//Resin/Plastic
  5. 5 SETO ENGINEERING Ibaraki//Industrial Machinery 守谷事業所
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Plating Equipment Product ranking

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

  1. Small item dedicated plating device 'Flow-through Plater RP-2' 上村工業
  2. Plating equipment - Roll to roll plating equipment テクニックジャパン 横浜実験室
  3. Surface treatment, electroplating, barrel plating: Case study of open-type detachable inclined barrel. 共和機器製作所
  4. Surface treatment and electroplating: Fully automatic barrel plating equipment with IH carrier system. 共和機器製作所
  5. 4 Automatic barrel plating equipment 増田工業 我孫子本店

Plating Equipment Product List

46～60 item / All 82 items

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Electrolytic Ni/Au plating device

Electrolytic Ni/Au plating device

The transport speed is 1.0m to 2.0m/min, and the material thickness is compatible with PI 25μm and above! Introducing our electroplated Ni/Au equipment.

This product is a device for electroplating Ni + Au on wiring patterns. The transport speed is 1.0m to 2.0m/min, and the material width is 35mm to 160mm for TAB/CSP/COF, and 250mm to 300mm for FPC. The device consists of the following processes: unwinding → pretreatment → Ni plating → Au plating → hot water rinse → water rinse → liquid draining → drying → winding. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Material thickness: PI 25μm and above ■ Processing surface: single side ■ Utilities: Power supply AC 200V・220V / 50Hz・60Hz, city water, pure water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 38mL × 2.5mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate. *For more details, please refer to the PDF document or feel free to contact us.

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  • Plating Equipment

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Plating device

Plating device

At SETO ENGINEERING, we specialize in the design and manufacturing of various types of plating equipment, utilizing roll-to-roll technology!

As a technology group specialized in roll-to-roll manufacturing equipment, SETO ENGINEERING Co., Ltd. has been reformed with the main technical staff from the former Seto Giken Kogyo Co., Ltd. In the future, we will operate as a group of specialists in roll-to-roll manufacturing equipment. Among our strengths is the design and manufacturing of "plating equipment." We utilize roll-to-roll manufacturing technology to accommodate various types of plating. 【Manufactured Equipment Achievements】 ● Melting Copper Plating Equipment This equipment can perform electrolytic copper plating on blind vias and through holes. The material thickness ranges from PI 25μm and the material width is up to 540mm. Semi-additive pattern plating is also possible. Additionally, plating for CCL materials is available. ● Electrolytic Copper Plating Equipment (Non-Melting Copper Plating) Copper plating can be applied to the product pattern sections. The process includes pre-treatment of the film foil, copper plating, rinsing, and drying, conducted in a roll-to-roll vertical transport method for both sides of the product. The reference dimensions of the equipment, excluding the control panel and ancillary equipment, are 20m (L) × 4.6m (W) × 4.4m (H). Basic information on other types of plating equipment is provided.

  • Plating Equipment
  • Other surface treatment equipment
  • Surface treatment contract service

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What is roll to roll? ~Plating Edition Part 1~

What is roll to roll? ~Plating Edition Part 1~

This will explain the methods and types of plating processes conducted using the roll-to-roll method, as well as electroless plating (chemical plating)!

This document introduces the plating process conducted using the roll-to-roll method. There are various methods and types of plating performed using the roll-to-roll technique. Among them, this document explains electroless plating (chemical plating). It also discusses the characteristics and challenges of electroless plating, as well as suitable equipment for this process. We encourage you to read it. *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements

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Japan Platech Alloy Coating Equipment (Carrier Type)

Japan Platech Alloy Coating Equipment (Carrier Type)

Patents have been obtained in the USA, EU, and China.

In the workshop, we not only assist everyone with their prototypes but also conduct independent research for development. We look forward to your use of our services.

  • Processing Contract

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Medium-sized universal plating device "Koki (Teri) MM-18T"

Medium-sized universal plating device "Koki (Teri) MM-18T"

The standard equipment is a stand for suspending the hooking jig! It enables stable and clean plating.

The "Teri MM-18T" is a medium-sized universal plating device with constant voltage and constant current. Due to its constant voltage and constant current, it enables stable and clean plating. The liquid is agitated, allowing for uniform plating. It comes standard with a stand for hanging hooks, and partial plating is possible using an optional plating pen. 【Included Accessories】 ■ 2 beakers ■ 1 degreasing electrode plate ■ 1 plating electrode plate ■ Complete set of electrode cables ■ 1 hanging hook fixture ■ 1 thermometer ■ 2 hot stirrers (with temperature control) *For more details, please refer to the PDF materials or feel free to contact us.

  • Other processing machines
  • Other machine elements
  • Heating device

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Partial plating equipment series

Partial plating equipment series

Masking-free! You can easily achieve partial plating with the feel of coloring using felt pens!

We would like to introduce our "Partial Plating Equipment Series." Partial plating (spot plating) required masking, but with our product, masking is not necessary. You can easily perform partial plating with the feel of a felt pen. We offer an easy-to-use partial plating device with low running costs, the "Pen Plating Mini PMM-1," as well as the "Pen Plating PM-100," which is equipped with a bath-type electrolytic degreasing function. 【Partial Plating Equipment Lineup】 ■ Pen Plating Mini PMM-1 ■ Pen Plating PM-100 ■ Gloss (Teri) Junior (Plating Pen Option) MM-10Jp ■ Gloss (Teri) Junior Long Type / with Plating Pen Option MM-10J03LBp *For more details, please refer to the PDF document or feel free to contact us.

  • Other surface treatment equipment

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Vertical Conveying Continuous Plating Device 'U-VCPS'

Vertical Conveying Continuous Plating Device 'U-VCPS'

A vertical continuous plating device with a simple structure and easy maintenance.

The "U-VCPS" is a fully automatic vertical transport continuous plating device without an upper and lower mechanism, designed for PKG/HDI substrates. It features a simple mechanism with only an upper clamp, capable of handling thin substrates of less than 50μm. The device has a sealed structure, is environmentally friendly, and its simple design makes maintenance easy. We also offer the "U-VCP," a vertical transport continuous electroplating device with a simple structure that minimizes the occurrence of failures. 【Features】 ■ Designed for PKG/HDI substrates ■ Simple mechanism with only an upper clamp ■ Capable of handling thin substrates of less than 50μm ■ Simple structure for easy maintenance ■ Efficient material transfer achieved through a unique circulation method *For more details, please refer to the PDF document or feel free to contact us.

  • Plating Equipment

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Surface treatment equipment - Chilled cup type plating device

Surface treatment equipment - Chilled cup type plating device

No barrel! Media-less! It's an efficient chill cup type plating device.

The Chiru Cup-type plating device is a next-generation plating device that offers high plating efficiency compared to barrel plating, as there are no obstructions between the workpiece and the anode. Despite being media-free, it allows for plating in a short time. Power supply to the workpiece is conducted through a button-shaped cathode electrode installed at the bottom of the cup. It is also possible to automate processes including the front and back stages, using a robot to transport a basket containing the workpieces. 【Features】 ○ Media-free ○ No obstructions between the anode and workpiece ○ High plating efficiency ○ Adjustable cup tilt and rotation speed ○ Automation compatible For more details, please contact us or download the catalog.

  • Plating Equipment

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Automated conveyor-type small plating device

Automated conveyor-type small plating device

You can also prototype using robots for the production equipment!

This product is a compact automatic plating device that allows for manual experiments without the use of robots. Since each processing tank is integrated, it can easily accommodate changes in processes such as additions or replacements. Additionally, each processing tank can be equipped with options such as an overflow tank, cathode, and anode electrodes. Please consult us regarding high-temperature chemicals. 【Features】 ■ Suitable for small quantities of various types, experiments, and prototypes ■ Manual experiments are possible without using robots ■ Prototyping can be done using robots *For more details, please refer to the PDF materials or feel free to contact us.

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Uniform work efficiency and product quality 【Overhead traveling fully automated system】

Uniform work efficiency and product quality 【Overhead traveling fully automated system】

Supports various plating processes! By implementing a production management system, you can manage various data.

Our company's "Ceiling-Mounted Fully Automatic Device" can easily adapt to changes in processing volume, regardless of the size of the products, and has a wide range of applications for various plating processes. As a safety measure, sensors are installed in various locations to prevent collisions, double feeding, overruns, and other issues. Additionally, by implementing a production management system to ensure consistent work efficiency and product quality, various data can be managed. (Processing time, current values, temperature, oscillation counts, oscillation speed, and more can be discussed.) [Features] ■ High-speed operation is possible by changing the program ■ Cycle time can be reduced ■ Lot tracking is possible in case of abnormalities ■ Compatible with various plating processes ■ Various data can be managed through the implementation of a production management system *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Plating Equipment

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No tooling required! "Wafer plating device"

No tooling required! "Wafer plating device"

A plating device that does not use jigs. It not only eliminates the complexity of installation and plating defects due to the deterioration of jig components, but also significantly improves the yield rate of good products!

The current wafer plating equipment is predominantly vertical, and the usability of the jigs attached to the plating devices is poor, leading to many issues such as the following: - Parts must be constantly replaced due to erosion from the plating solution. - Poor electrical conductivity results in defective plating. - The structure takes a long time to set the wafers, hindering smooth operations. - Difficult to transport, making efficient movement challenging. Furthermore, there is a demand for improved production efficiency due to the increasing need for high aspect ratio compatibility (supply of metal ions, uniform liquid flow) and enhanced uniform film thickness. Our "Wafer Plating Equipment" is jig-free, horizontal, and upward-facing, allowing us to resolve the issues present in conventional products. *For more details, please download the PDF or feel free to contact us.*

  • Plating Equipment
  • Surface treatment contract service

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Plating device "Chibi Plating"

Plating device "Chibi Plating"

A simple operation specialized for one ring! The definitive small plating device!

"Chibi Meki" is a compact plating device designed for simple operation, specifically for plating one ring. It is pre-set to the current value suitable for one ring, so there is no need to adjust the current during use. The liquid temperature is electronically controlled to be optimal for rhodium plating solution. 【Features】 ■ Specialized for one ring (pre-set to the current value for one ring) ■ Simple operation compact plating device ■ No current adjustment needed ■ Electronically controlled to the optimal liquid temperature for rhodium plating solution Videos are available on the Harp website. *For more details, please refer to the PDF document or feel free to contact us.

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Plating device "Plating Basic"

Plating device "Plating Basic"

Pursuing ease of use and compactness! Adopting a constant current control circuit eliminates the need for current density adjustment!

The "Mekki Basic" is a plating device that improves workability by adopting a constant current control circuit, eliminating the need for cumbersome current density adjustments. It maintains the plating solution at an appropriate temperature using a heater installed in the plating tank. The temperature can be selected from 45°C and 55°C, allowing for flexible operation tailored to the plating solution. We also offer a compact plating device called "Chibi Mekki," which is specifically designed for plating a single ring with simple operation. 【Features】 ■ Adoption of constant current control circuit ■ No need for current density adjustments ■ Maintains plating solution at an appropriate temperature with a heater installed in the plating tank ■ Selectable between 45°C and 55°C *For more details, please refer to the PDF document or feel free to contact us.

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A must-see for companies establishing new factories! We handle everything from the design to the manufacturing of plating processing equipment.

A must-see for companies establishing new factories! We handle everything from the design to the manufacturing of plating processing equipment.

Introducing various plating processing equipment for new factory setups and replacement of existing equipment!

Kahmi Kiko Co., Ltd. is a company engaged in machine design, electrical design, manufacturing, modification, and the sale of peripheral consumables, as well as robot system integration (SI) business. Our company possesses various plating processing equipment, including "copper sulfate plating equipment," "high-aspect copper plating equipment," and "desmear treatment equipment." We cater to each of these processes. Please feel free to consult us when needed. 【Equipment Owned】 ■ Copper sulfate plating equipment ■ High-aspect copper plating equipment ■ Desmear treatment equipment ■ Desmear copper plating equipment ■ Electroless copper plating equipment ■ Blackening treatment equipment *For more details, please refer to the PDF materials or feel free to contact us.

  • Other surface treatment equipment
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Kamikiko, a manufacturer of surface treatment equipment.

Kamikiko, a manufacturer of surface treatment equipment.

We are continuously engaged in the production of small machines, including on-site construction, as well as the manufacturing of levelers and automatic machines!

Kabi Kiko Co., Ltd. offers a wide range of services from the production of levelers to automatic plating equipment. We can handle everything from "machining to assembly" and "electrical schematics to electrical control," and we can also accommodate partial requests. In terms of plating equipment, we have experience in both carrier-type and elevator-type systems, as well as in the production of fine levelers (eutectic and lead-free) and material handling machines. Please feel free to contact us for inquiries. 【Features】 ■ Wide-ranging support from levelers to automatic plating equipment ■ Comprehensive support from "design to software creation" and everything in between ■ Capability to handle "machining to assembly" and "electrical schematics to electrical control," including partial requests ■ Effective utilization of human resources using robots *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing
  • Other surface treatment equipment
  • Plating Equipment

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