Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
46～60 item / All 84 items
A completely new concept for a rotating plating device that replaces barrels.
A completely new concept of a rotary plating device developed by Technique Corporation, which replaces barrels.
Semi-additive pattern plating is also possible! We would like to introduce our molten copper plating equipment.
The device can perform electrolytic copper plating on blind vias and through holes. Material thickness ranges from PI 25μm, and material width is up to 540mm. Semi-additive pattern plating is also possible. Additionally, plating for CCL materials is available. Please feel free to consult us. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 0.5m to 1.5m/min (depending on specifications) ■ Material width: 540mm ■ Material thickness: PI 25μm and above ■ Processing surface: Both sides (one side or both sides) *For more details, please refer to the PDF document or feel free to contact us.
The transfer speed is 2.0m/min, material thickness: compatible with PI 25μm and above! Introducing our electroless tin plating equipment.
This product is a device for electroless tin plating on wiring patterns. The transport speed is 2.0 m/min, and the material width is for TAB/CSP/COF ranging from 35 mm to 160 mm, and for FPC from 250 mm to 300 mm. The device consists of the following processes: unwinding → pretreatment → tin plating → post-treatment/water rinse → water wash → liquid separation → drying → winding. 【Specifications】 ■ Lane configuration: 2 Lane ■ Material thickness: PI 25 μm and above ■ Processing surface: single side ■ Utilities: Power supply AC 200V・220V / 50Hz・60Hz, city water, pure water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 38mL × 2.5mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate. *For more details, please refer to the PDF document or feel free to contact us.
The transport speed is 1.0m to 2.0m/min, and the material thickness is compatible with PI 25μm and above! Introducing our electroplated Ni/Au equipment.
This product is a device for electroplating Ni + Au on wiring patterns. The transport speed is 1.0m to 2.0m/min, and the material width is 35mm to 160mm for TAB/CSP/COF, and 250mm to 300mm for FPC. The device consists of the following processes: unwinding → pretreatment → Ni plating → Au plating → hot water rinse → water rinse → liquid draining → drying → winding. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Material thickness: PI 25μm and above ■ Processing surface: single side ■ Utilities: Power supply AC 200V・220V / 50Hz・60Hz, city water, pure water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 38mL × 2.5mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate. *For more details, please refer to the PDF document or feel free to contact us.
At SETO ENGINEERING, we specialize in the design and manufacturing of various types of plating equipment, utilizing roll-to-roll technology!
As a technology group specialized in roll-to-roll manufacturing equipment, SETO ENGINEERING Co., Ltd. has been reformed with the main technical staff from the former Seto Giken Kogyo Co., Ltd. In the future, we will operate as a group of specialists in roll-to-roll manufacturing equipment. Among our strengths is the design and manufacturing of "plating equipment." We utilize roll-to-roll manufacturing technology to accommodate various types of plating. 【Manufactured Equipment Achievements】 ● Melting Copper Plating Equipment This equipment can perform electrolytic copper plating on blind vias and through holes. The material thickness ranges from PI 25μm and the material width is up to 540mm. Semi-additive pattern plating is also possible. Additionally, plating for CCL materials is available. ● Electrolytic Copper Plating Equipment (Non-Melting Copper Plating) Copper plating can be applied to the product pattern sections. The process includes pre-treatment of the film foil, copper plating, rinsing, and drying, conducted in a roll-to-roll vertical transport method for both sides of the product. The reference dimensions of the equipment, excluding the control panel and ancillary equipment, are 20m (L) × 4.6m (W) × 4.4m (H). Basic information on other types of plating equipment is provided.
This will explain the methods and types of plating processes conducted using the roll-to-roll method, as well as electroless plating (chemical plating)!
This document introduces the plating process conducted using the roll-to-roll method. There are various methods and types of plating performed using the roll-to-roll technique. Among them, this document explains electroless plating (chemical plating). It also discusses the characteristics and challenges of electroless plating, as well as suitable equipment for this process. We encourage you to read it. *For more details, please refer to the PDF document or feel free to contact us.
Patents have been obtained in the USA, EU, and China.
In the workshop, we not only assist everyone with their prototypes but also conduct independent research for development. We look forward to your use of our services.
The substrate is hooked onto a specific jig for plating treatment.
- It can be switched to various processes. - It can accommodate various types of metal plating. - We propose compact equipment that is efficient and highly maintainable. - It is suitable for processing large substrates and similar items. - Individual current management for each processing tank or hanging fixture is possible, making it easy to select multiple processing steps. *For more details, please refer to the PDF document or feel free to contact us.
The standard equipment is a stand for suspending the hooking jig! It enables stable and clean plating.
The "Teri MM-18T" is a medium-sized universal plating device with constant voltage and constant current. Due to its constant voltage and constant current, it enables stable and clean plating. The liquid is agitated, allowing for uniform plating. It comes standard with a stand for hanging hooks, and partial plating is possible using an optional plating pen. 【Included Accessories】 ■ 2 beakers ■ 1 degreasing electrode plate ■ 1 plating electrode plate ■ Complete set of electrode cables ■ 1 hanging hook fixture ■ 1 thermometer ■ 2 hot stirrers (with temperature control) *For more details, please refer to the PDF materials or feel free to contact us.
Masking-free! You can easily achieve partial plating with the feel of coloring using felt pens!
We would like to introduce our "Partial Plating Equipment Series." Partial plating (spot plating) required masking, but with our product, masking is not necessary. You can easily perform partial plating with the feel of a felt pen. We offer an easy-to-use partial plating device with low running costs, the "Pen Plating Mini PMM-1," as well as the "Pen Plating PM-100," which is equipped with a bath-type electrolytic degreasing function. 【Partial Plating Equipment Lineup】 ■ Pen Plating Mini PMM-1 ■ Pen Plating PM-100 ■ Gloss (Teri) Junior (Plating Pen Option) MM-10Jp ■ Gloss (Teri) Junior Long Type / with Plating Pen Option MM-10J03LBp *For more details, please refer to the PDF document or feel free to contact us.
A vertical continuous plating device with a simple structure and easy maintenance.
The "U-VCPS" is a fully automatic vertical transport continuous plating device without an upper and lower mechanism, designed for PKG/HDI substrates. It features a simple mechanism with only an upper clamp, capable of handling thin substrates of less than 50μm. The device has a sealed structure, is environmentally friendly, and its simple design makes maintenance easy. We also offer the "U-VCP," a vertical transport continuous electroplating device with a simple structure that minimizes the occurrence of failures. 【Features】 ■ Designed for PKG/HDI substrates ■ Simple mechanism with only an upper clamp ■ Capable of handling thin substrates of less than 50μm ■ Simple structure for easy maintenance ■ Efficient material transfer achieved through a unique circulation method *For more details, please refer to the PDF document or feel free to contact us.
No barrel! Media-less! It's an efficient chill cup type plating device.
The Chiru Cup-type plating device is a next-generation plating device that offers high plating efficiency compared to barrel plating, as there are no obstructions between the workpiece and the anode. Despite being media-free, it allows for plating in a short time. Power supply to the workpiece is conducted through a button-shaped cathode electrode installed at the bottom of the cup. It is also possible to automate processes including the front and back stages, using a robot to transport a basket containing the workpieces. 【Features】 ○ Media-free ○ No obstructions between the anode and workpiece ○ High plating efficiency ○ Adjustable cup tilt and rotation speed ○ Automation compatible For more details, please contact us or download the catalog.
You can also prototype using robots for the production equipment!
This product is a compact automatic plating device that allows for manual experiments without the use of robots. Since each processing tank is integrated, it can easily accommodate changes in processes such as additions or replacements. Additionally, each processing tank can be equipped with options such as an overflow tank, cathode, and anode electrodes. Please consult us regarding high-temperature chemicals. 【Features】 ■ Suitable for small quantities of various types, experiments, and prototypes ■ Manual experiments are possible without using robots ■ Prototyping can be done using robots *For more details, please refer to the PDF materials or feel free to contact us.
Supports various plating processes! By implementing a production management system, you can manage various data.
Our company's "Ceiling-Mounted Fully Automatic Device" can easily adapt to changes in processing volume, regardless of the size of the products, and has a wide range of applications for various plating processes. As a safety measure, sensors are installed in various locations to prevent collisions, double feeding, overruns, and other issues. Additionally, by implementing a production management system to ensure consistent work efficiency and product quality, various data can be managed. (Processing time, current values, temperature, oscillation counts, oscillation speed, and more can be discussed.) [Features] ■ High-speed operation is possible by changing the program ■ Cycle time can be reduced ■ Lot tracking is possible in case of abnormalities ■ Compatible with various plating processes ■ Various data can be managed through the implementation of a production management system *For more details, please refer to the PDF document or feel free to contact us.
A plating device that does not use jigs. It not only eliminates the complexity of installation and plating defects due to the deterioration of jig components, but also significantly improves the yield rate of good products!
The current wafer plating equipment is predominantly vertical, and the usability of the jigs attached to the plating devices is poor, leading to many issues such as the following: - Parts must be constantly replaced due to erosion from the plating solution. - Poor electrical conductivity results in defective plating. - The structure takes a long time to set the wafers, hindering smooth operations. - Difficult to transport, making efficient movement challenging. Furthermore, there is a demand for improved production efficiency due to the increasing need for high aspect ratio compatibility (supply of metal ions, uniform liquid flow) and enhanced uniform film thickness. Our "Wafer Plating Equipment" is jig-free, horizontal, and upward-facing, allowing us to resolve the issues present in conventional products. *For more details, please download the PDF or feel free to contact us.*
