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Plating Equipment Product List and Ranking from 39 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Feb 18, 2026~Mar 17, 2026
This ranking is based on the number of page views on our site.

Plating Equipment Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Feb 18, 2026~Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. 上村工業 Osaka//Chemical
  2. 共和機器製作所 Saitama//Machine elements and parts
  3. テクニックジャパン 横浜実験室 Kanagawa//Resin/Plastic
  4. 4 山本鍍金試験器 Tokyo//Resin/Plastic
  5. 5 SETO ENGINEERING 守谷事業所 Ibaraki//Industrial Machinery

Plating Equipment Product ranking

Last Updated: Aggregation Period:Feb 18, 2026~Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. Small item dedicated plating device 'Flow-through Plater RP-2' 上村工業
  2. Surface treatment, electroplating, barrel plating: Case study of open-type detachable inclined barrel. 共和機器製作所
  3. Vertical Conveying Continuous Plating Device 'U-VCPS' 上村工業
  4. Plating equipment - Roll to roll plating equipment テクニックジャパン 横浜実験室
  5. 5 Electroplating of precision parts (surface treatment) with barrel plating! Super Barrel. 共和機器製作所

Plating Equipment Product List

31~60 item / All 82 items

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Surface treatment and barrel plating equipment "Super Barrel" *Case studies available.

For barrel plating of fine precision parts. Solving various issues such as poor adhesion to lids with a wide range of product specifications.

The "Super Barrel" is a barrel plating device that can perform high-quality plating treatments on precision parts (electrical and semiconductor components) with excellent uniformity and adhesion. Thanks to its unique lid opening and closing mechanism, it minimizes the risk of small and thin parts getting caught in the lid, preventing adhesion and snagging on the inner surface. It contributes to improving defect rates while maintaining high plating efficiency. We offer a lineup including ultra-compact experimental models, manual motor-equipped types, and fully automated models. In addition to standard sizes, we can also accommodate customization of specifications and dimensions. 【Features】 ■ High internal product agitation efficiency, resulting in excellent uniformity of plating thickness ■ Specially designed electrodes that do not deform even for easily bendable products ■ Capable of meeting needs such as extending barrel lifespan and reducing plating time *For more details, please refer to the materials available for download in PDF format. We are also offering a "Case Study Collection" that introduces specification examples! Feel free to contact us for inquiries.

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  • Other surface treatment equipment
  • Plating Equipment

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Reel to reel connector plating device

Achieving plating accuracy of ±0.1mm with our drum plating structure!

We offer the 'REEL to REEL Connector Plating Equipment' that achieves a plating accuracy of ±1.0mm through the adoption of special liquid level control. With a product pass line of FL +1000mm for ease of operation and a compact design, it supports energy saving and reduced wastewater. Additionally, stable transport can be achieved with special guide rollers. 【Equipment Configuration】 ■ Basic Model: MRC-02 to 03 ■ Number of Lines: 2 to 3 lines ■ Line Speed: 1.0 to 25.0m/min ■ Target Products: Connectors and materials ■ Target Materials: Cu alloys, SUS, etc. *For more details, please download the PDF or feel free to contact us.

  • Plating Equipment
  • Plating Equipment

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Short-length Ag spot plating device

You can change the plating jig without stopping the other lanes!

Our company offers a compact design of the 'Short-Length Ag Spot Plating Device' with a convenient pass line of FL+1000mm. It adopts a special overflow method suitable for thin materials and multiple pins. Additionally, the loading section can switch between vacuum and chuck types. 【Device Overview】 ■ Basic Model: MMS-02 (03・04) ■ Number of Bars: 4 bars ■ Line Speed: 0.5m to 2.0m/min (Normal: 1.6m/min) ■ Pass Line: FL+1000mm ■ Cycle Time: 17.5 seconds/cycle (Machine: 8sec + Plating) and more *For more details, please download the PDF or feel free to contact us.

  • Plating Equipment
  • Plating Equipment

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High-speed partial plating method "I-Cor Plating"

No need for a plating tank. High-speed plating can be done only on the necessary parts at the site.

"Icall Plating" uses a portable power source to perform high-speed partial plating only where needed. It is an electroplating method that does not require a plating bath, and the metal to be plated is deposited from a plating solution contained in a dedicated gauze attached to the electrode. Additionally, plating of approximately 30 different metals is possible. 【Features】 ■ High adhesion ■ High-speed plating ■ Portable device ■ Easy thickness management *For more details, please download the PDF or feel free to contact us.

  • Surface treatment contract service
  • Plating Equipment

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Suzume plating: Continuous production of sulfuric acid baths and organic acid baths using fully automatic machines.

We are introducing a fully automatic rack plating system (glossy tin, semi-gloss, and matte tin).

Our company has introduced fully automatic rack plating equipment (glossy tin, semi-gloss, and matte tin). Advantages of fully automatic rack plating equipment: - Since production is carried out consistently under computer control, there are benefits such as stable quality and efficient production. - As it is fully automatic, mass production is possible (on-time delivery). - Quality control for issues like plating stains is thorough. - Additionally, manual processing for glossy silver plating, matte silver plating, gold plating, nickel plating, and black tin-nickel plating is also available.

  • Surface treatment contract service
  • Plating Equipment

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Tsukada Riken Kogyo Co., Ltd.

Pioneer of plastic plating, Tsukada Riken

Tsukada Riken is a long-established company in the field of plastic plating, recognized globally. We continuously develop cutting-edge and sustainable solutions in plastic plating. Thanks to years of accumulated technology, we can offer a wide variety of small lot productions and diverse types of plating, as well as high adhesion plating for many materials.

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Shimatani Giken Co., Ltd. - Products Handled

We will introduce the "Electrolytic Device Cleaning and Drying Equipment" and "Plating Equipment" that we handle.

Shimatani Giken Co., Ltd. designs and manufactures custom-made electroplating equipment, electroless plating equipment, diaphragm electrolysis equipment, acid treatment equipment, chemical treatment equipment, and anodizing equipment. We offer a wide range of products, including the "Direct Electrolysis Device" that uses titanium plates to recover rare metals, the safety-enhanced "Fully Automatic Cleaning, Suction, and Drying Device," and the cleanroom-compatible "Electroless Ni/Pd/Au Plating Device." 【Product Lineup (Excerpt)】 < Electrolysis and Cleaning Drying Equipment > ■ Direct Electrolysis Device ■ Fully Automatic Ultrasonic Cleaning Device ■ Fully Automatic Cleaning, Suction, and Drying Device *For more details, please refer to the PDF document or feel free to contact us.

  • Drying Equipment
  • Plating Equipment
  • Other machine elements
  • Plating Equipment

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Dedicated small parts fully automatic high-speed plating equipment

A series of plating processes can be performed in a single module.

High current density (high speed) plating is possible. By changing the filter, plating on fine powders (10-50μm) is possible. It can also be used as an experimental device.

  • Other surface treatment equipment
  • Other electronic parts
  • Plating Equipment

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Plating equipment (electrolytic and non-electrolytic)

Electroplating equipment that can be optimally customized to meet customer needs.

We support various types of plating such as Ni/Cu/Au and can optimally customize the design of work sizes according to customer needs, including experimental machines, manual machines, and automatic machines. After confirming performance and uniformity in collaboration with specialized plating manufacturers, we can ship immediately.

  • Plating Equipment
  • Plating Equipment

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Zinc elevator-type barrel plating device

Zinc elevator-type barrel plating device

The zinc elevator-type barrel plating device developed by our company has significantly increased processing speed compared to previous devices with a takt time of 30 seconds. By adopting an elevator system, it allows for efficient processing, greatly increasing the amount processed per unit time. Being a compact processing device, it is ideal for post-processing of small lots with a variety of products. ★ Short takt time The usual takt time of 3 minutes has been reduced to 30 seconds, dramatically reducing the labor required for post-processing. ★ Elevator system By adopting an elevator system, we have achieved efficient processing and increased the amount processed per unit time. ★ Suitable for small lots with a variety of products As a compact processing device, it is optimal for post-processing of small lots with a variety of products.

  • Other processing machines
  • Other surface treatment equipment
  • Other semiconductor manufacturing equipment
  • Plating Equipment

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Continuous baking type zinc plating equipment

Continuous baking-type zinc plating equipment

The continuous baking-type zinc plating equipment developed by our company is very convenient as it comes standard with a baking device. Additionally, the baking device can automatically load and process materials, eliminating the need for manual loading and reducing the overall processing time. Furthermore, by adopting a carrier system, efficient processing can be achieved, significantly increasing the amount processed per unit of time.

  • Other processing machines
  • Other surface treatment equipment
  • Other semiconductor manufacturing equipment
  • Plating Equipment

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Formation of aluminum electrode UBM on wafer, electroless plating equipment for UBM formation.

Plating chemicals, total proposals for surface treatment processes and equipment. UBM formation for power semiconductors, electroless plating process/plating equipment.

We have newly developed the "TORYZA EL PROCESS," an electroless plating process for forming UBM for power semiconductors that suppresses aluminum electrode delamination and localized corrosion, making it suitable for high-temperature applications. Additionally, leveraging the know-how gained as a surface treatment and plating chemical manufacturer, we have designed and developed the "TORYZA EL SYSTEM," an electroless plating equipment for UBM formation in collaboration with equipment manufacturers. We offer a comprehensive proposal that includes plating chemicals, surface treatment processes, and equipment.

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Electroless plating equipment for UBM formation for wafers

Plating chemicals, total proposals for surface treatment processes and equipment, electroless plating equipment for UBM formation for wafers.

Utilizing the know-how gained as a surface treatment and plating chemical manufacturer, we designed and developed the electroless plating equipment "TORYZA EL SYSTEM" for UBM formation in collaboration with equipment manufacturers. Along with the plating process "TORYZA EL PROCESS" for UBM formation on aluminum electrodes on wafers, we offer a comprehensive proposal for plating chemicals, surface treatment processes, and equipment for semiconductor back-end processes.

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Plating equipment SBE (jet-type) plating equipment

A completely new concept for a rotating plating device that replaces barrels.

A completely new concept of a rotary plating device developed by Technique Corporation, which replaces barrels.

  • Other surface treatment equipment
  • Plating Equipment

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Dissolving copper plating device

Semi-additive pattern plating is also possible! We would like to introduce our molten copper plating equipment.

The device can perform electrolytic copper plating on blind vias and through holes. Material thickness ranges from PI 25μm, and material width is up to 540mm. Semi-additive pattern plating is also possible. Additionally, plating for CCL materials is available. Please feel free to consult us. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 0.5m to 1.5m/min (depending on specifications) ■ Material width: 540mm ■ Material thickness: PI 25μm and above ■ Processing surface: Both sides (one side or both sides) *For more details, please refer to the PDF document or feel free to contact us.

  • Other cleaning machines
  • Drying Equipment
  • Plating Equipment
  • Plating Equipment

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Non-electrolytic tin plating equipment

The transfer speed is 2.0m/min, material thickness: compatible with PI 25μm and above! Introducing our electroless tin plating equipment.

This product is a device for electroless tin plating on wiring patterns. The transport speed is 2.0 m/min, and the material width is for TAB/CSP/COF ranging from 35 mm to 160 mm, and for FPC from 250 mm to 300 mm. The device consists of the following processes: unwinding → pretreatment → tin plating → post-treatment/water rinse → water wash → liquid separation → drying → winding. 【Specifications】 ■ Lane configuration: 2 Lane ■ Material thickness: PI 25 μm and above ■ Processing surface: single side ■ Utilities: Power supply AC 200V・220V / 50Hz・60Hz, city water, pure water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 38mL × 2.5mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate. *For more details, please refer to the PDF document or feel free to contact us.

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  • Plating Equipment
  • Plating Equipment

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Electrolytic Ni/Au plating device

The transport speed is 1.0m to 2.0m/min, and the material thickness is compatible with PI 25μm and above! Introducing our electroplated Ni/Au equipment.

This product is a device for electroplating Ni + Au on wiring patterns. The transport speed is 1.0m to 2.0m/min, and the material width is 35mm to 160mm for TAB/CSP/COF, and 250mm to 300mm for FPC. The device consists of the following processes: unwinding → pretreatment → Ni plating → Au plating → hot water rinse → water rinse → liquid draining → drying → winding. 【Specifications】 ■ Lane configuration: 2 Lanes ■ Material thickness: PI 25μm and above ■ Processing surface: single side ■ Utilities: Power supply AC 200V・220V / 50Hz・60Hz, city water, pure water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 38mL × 2.5mW × 2.5mH (approx.) *Control panel and ancillary equipment are separate. *For more details, please refer to the PDF document or feel free to contact us.

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  • Plating Equipment
  • Plating Equipment

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Plating device

At SETO ENGINEERING, we specialize in the design and manufacturing of various types of plating equipment, utilizing roll-to-roll technology!

As a technology group specialized in roll-to-roll manufacturing equipment, SETO ENGINEERING Co., Ltd. has been reformed with the main technical staff from the former Seto Giken Kogyo Co., Ltd. In the future, we will operate as a group of specialists in roll-to-roll manufacturing equipment. Among our strengths is the design and manufacturing of "plating equipment." We utilize roll-to-roll manufacturing technology to accommodate various types of plating. 【Manufactured Equipment Achievements】 ● Melting Copper Plating Equipment This equipment can perform electrolytic copper plating on blind vias and through holes. The material thickness ranges from PI 25μm and the material width is up to 540mm. Semi-additive pattern plating is also possible. Additionally, plating for CCL materials is available. ● Electrolytic Copper Plating Equipment (Non-Melting Copper Plating) Copper plating can be applied to the product pattern sections. The process includes pre-treatment of the film foil, copper plating, rinsing, and drying, conducted in a roll-to-roll vertical transport method for both sides of the product. The reference dimensions of the equipment, excluding the control panel and ancillary equipment, are 20m (L) × 4.6m (W) × 4.4m (H). Basic information on other types of plating equipment is provided.

  • Plating Equipment
  • Other surface treatment equipment
  • Surface treatment contract service
  • Plating Equipment

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What is roll to roll? ~Plating Edition Part 1~

This will explain the methods and types of plating processes conducted using the roll-to-roll method, as well as electroless plating (chemical plating)!

This document introduces the plating process conducted using the roll-to-roll method. There are various methods and types of plating performed using the roll-to-roll technique. Among them, this document explains electroless plating (chemical plating). It also discusses the characteristics and challenges of electroless plating, as well as suitable equipment for this process. We encourage you to read it. *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements
  • Plating Equipment

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Japan Platech Alloy Coating Equipment (Carrier Type)

Patents have been obtained in the USA, EU, and China.

In the workshop, we not only assist everyone with their prototypes but also conduct independent research for development. We look forward to your use of our services.

  • Processing Contract
  • Plating Equipment

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Carrier transport plating device

The substrate is hooked onto a specific jig for plating treatment.

- It can be switched to various processes. - It can accommodate various types of metal plating. - We propose compact equipment that is efficient and highly maintainable. - It is suitable for processing large substrates and similar items. - Individual current management for each processing tank or hanging fixture is possible, making it easy to select multiple processing steps. *For more details, please refer to the PDF document or feel free to contact us.

  • Plating Equipment
  • Plating Equipment

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Medium-sized universal plating device "Koki (Teri) MM-18T"

The standard equipment is a stand for suspending the hooking jig! It enables stable and clean plating.

The "Teri MM-18T" is a medium-sized universal plating device with constant voltage and constant current. Due to its constant voltage and constant current, it enables stable and clean plating. The liquid is agitated, allowing for uniform plating. It comes standard with a stand for hanging hooks, and partial plating is possible using an optional plating pen. 【Included Accessories】 ■ 2 beakers ■ 1 degreasing electrode plate ■ 1 plating electrode plate ■ Complete set of electrode cables ■ 1 hanging hook fixture ■ 1 thermometer ■ 2 hot stirrers (with temperature control) *For more details, please refer to the PDF materials or feel free to contact us.

  • Other processing machines
  • Other machine elements
  • Heating device
  • Plating Equipment

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Partial plating equipment series

Masking-free! You can easily achieve partial plating with the feel of coloring using felt pens!

We would like to introduce our "Partial Plating Equipment Series." Partial plating (spot plating) required masking, but with our product, masking is not necessary. You can easily perform partial plating with the feel of a felt pen. We offer an easy-to-use partial plating device with low running costs, the "Pen Plating Mini PMM-1," as well as the "Pen Plating PM-100," which is equipped with a bath-type electrolytic degreasing function. 【Partial Plating Equipment Lineup】 ■ Pen Plating Mini PMM-1 ■ Pen Plating PM-100 ■ Gloss (Teri) Junior (Plating Pen Option) MM-10Jp ■ Gloss (Teri) Junior Long Type / with Plating Pen Option MM-10J03LBp *For more details, please refer to the PDF document or feel free to contact us.

  • Other surface treatment equipment
  • Plating Equipment

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Vertical Conveying Continuous Plating Device 'U-VCPS'

A vertical continuous plating device with a simple structure and easy maintenance.

The "U-VCPS" is a fully automatic vertical transport continuous plating device without an upper and lower mechanism, designed for PKG/HDI substrates. It features a simple mechanism with only an upper clamp, capable of handling thin substrates of less than 50μm. The device has a sealed structure, is environmentally friendly, and its simple design makes maintenance easy. We also offer the "U-VCP," a vertical transport continuous electroplating device with a simple structure that minimizes the occurrence of failures. 【Features】 ■ Designed for PKG/HDI substrates ■ Simple mechanism with only an upper clamp ■ Capable of handling thin substrates of less than 50μm ■ Simple structure for easy maintenance ■ Efficient material transfer achieved through a unique circulation method *For more details, please refer to the PDF document or feel free to contact us.

  • Plating Equipment
  • Plating Equipment

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Surface treatment equipment - Chilled cup type plating device

No barrel! Media-less! It's an efficient chill cup type plating device.

The Chiru Cup-type plating device is a next-generation plating device that offers high plating efficiency compared to barrel plating, as there are no obstructions between the workpiece and the anode. Despite being media-free, it allows for plating in a short time. Power supply to the workpiece is conducted through a button-shaped cathode electrode installed at the bottom of the cup. It is also possible to automate processes including the front and back stages, using a robot to transport a basket containing the workpieces. 【Features】 ○ Media-free ○ No obstructions between the anode and workpiece ○ High plating efficiency ○ Adjustable cup tilt and rotation speed ○ Automation compatible For more details, please contact us or download the catalog.

  • Plating Equipment
  • Plating Equipment

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Automated conveyor-type small plating device

You can also prototype using robots for the production equipment!

This product is a compact automatic plating device that allows for manual experiments without the use of robots. Since each processing tank is integrated, it can easily accommodate changes in processes such as additions or replacements. Additionally, each processing tank can be equipped with options such as an overflow tank, cathode, and anode electrodes. Please consult us regarding high-temperature chemicals. 【Features】 ■ Suitable for small quantities of various types, experiments, and prototypes ■ Manual experiments are possible without using robots ■ Prototyping can be done using robots *For more details, please refer to the PDF materials or feel free to contact us.

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Uniform work efficiency and product quality 【Overhead traveling fully automated system】

Supports various plating processes! By implementing a production management system, you can manage various data.

Our company's "Ceiling-Mounted Fully Automatic Device" can easily adapt to changes in processing volume, regardless of the size of the products, and has a wide range of applications for various plating processes. As a safety measure, sensors are installed in various locations to prevent collisions, double feeding, overruns, and other issues. Additionally, by implementing a production management system to ensure consistent work efficiency and product quality, various data can be managed. (Processing time, current values, temperature, oscillation counts, oscillation speed, and more can be discussed.) [Features] ■ High-speed operation is possible by changing the program ■ Cycle time can be reduced ■ Lot tracking is possible in case of abnormalities ■ Compatible with various plating processes ■ Various data can be managed through the implementation of a production management system *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Plating Equipment
  • Plating Equipment

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No tooling required! "Wafer plating device"

A plating device that does not use jigs. It not only eliminates the complexity of installation and plating defects due to the deterioration of jig components, but also significantly improves the yield rate of good products!

The current wafer plating equipment is predominantly vertical, and the usability of the jigs attached to the plating devices is poor, leading to many issues such as the following: - Parts must be constantly replaced due to erosion from the plating solution. - Poor electrical conductivity results in defective plating. - The structure takes a long time to set the wafers, hindering smooth operations. - Difficult to transport, making efficient movement challenging. Furthermore, there is a demand for improved production efficiency due to the increasing need for high aspect ratio compatibility (supply of metal ions, uniform liquid flow) and enhanced uniform film thickness. Our "Wafer Plating Equipment" is jig-free, horizontal, and upward-facing, allowing us to resolve the issues present in conventional products. *For more details, please download the PDF or feel free to contact us.*

  • Plating Equipment
  • Surface treatment contract service
  • Plating Equipment

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Plating device "Chibi Plating"

A simple operation specialized for one ring! The definitive small plating device!

"Chibi Meki" is a compact plating device designed for simple operation, specifically for plating one ring. It is pre-set to the current value suitable for one ring, so there is no need to adjust the current during use. The liquid temperature is electronically controlled to be optimal for rhodium plating solution. 【Features】 ■ Specialized for one ring (pre-set to the current value for one ring) ■ Simple operation compact plating device ■ No current adjustment needed ■ Electronically controlled to the optimal liquid temperature for rhodium plating solution Videos are available on the Harp website. *For more details, please refer to the PDF document or feel free to contact us.

  • Plating Equipment
  • Plating Equipment

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Plating device "Plating Basic"

Pursuing ease of use and compactness! Adopting a constant current control circuit eliminates the need for current density adjustment!

The "Mekki Basic" is a plating device that improves workability by adopting a constant current control circuit, eliminating the need for cumbersome current density adjustments. It maintains the plating solution at an appropriate temperature using a heater installed in the plating tank. The temperature can be selected from 45°C and 55°C, allowing for flexible operation tailored to the plating solution. We also offer a compact plating device called "Chibi Mekki," which is specifically designed for plating a single ring with simple operation. 【Features】 ■ Adoption of constant current control circuit ■ No need for current density adjustments ■ Maintains plating solution at an appropriate temperature with a heater installed in the plating tank ■ Selectable between 45°C and 55°C *For more details, please refer to the PDF document or feel free to contact us.

  • Plating Equipment
  • Plating Equipment

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