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Introduction of Tsukuba Kiko's achievements in manufacturing equipment and labor-saving devices.
This is an introduction to the manufacturing achievements of Tsukuba Kiko's equipment and labor-saving devices.
Technological capabilities that contribute to the development and practical application of advanced materials.
We propose a surface treatment device that condenses our unique manufacturing technology. In recent years, with the increasing complexity of three major types of circuits—flexible printed circuits (FPC), rigid printed circuits, and packages—we handle various surface treatment devices such as plating equipment, developing, etching, and stripping equipment (DES), and cleaning devices that respond to the trends of high density and miniaturization. We take full responsibility for the design, manufacturing, assembly, construction, and maintenance of various devices.
Anyone can easily achieve beautiful plating! Introducing a bath plating device equipped with an electrolytic degreasing function.
The quality of plating is determined by the cleaning process before treatment. The "Koki (Teri) Series" is equipped with an electrolytic degreasing function, making it easy for anyone to achieve beautiful plating. We offer the "Koki Junior MM-10J," which features electrolytic degreasing, as well as the "Koki MM-10," which includes electrolytic polishing and degreasing functions, and the "Koki MM-20T," which is a medium-sized universal plating device with constant voltage and current for electrolytic polishing and degreasing. 【Product Lineup】 ■ Small, low-cost, high-performance plating device "Koki Junior MM-10J" ■ Low-cost, high-performance plating device "Koki MM-10" equipped with electrolytic polishing function ■ Medium-sized universal plating device "Koki MM-20T" *For more details, please refer to the PDF materials or feel free to contact us.
Stable functionality! Three types available: side-running, ceiling-running, and gantry types.
The "UF Career" is a fully automatic programmable plating device that has received extremely high evaluations and achievements in terms of functionality and reliability since its release. It is a system that can handle everything from small items to large items, as well as a mixture of various processing items, and it automatically processes them through programming methods, such as rack processing, barrel processing, and basket processing. The stable functionality and the rich system that accommodates various specifications can be safely used in the precise manufacturing process of printed circuit boards. Additionally, we also offer a fully automatic plating device with a continuous transport system known as the "Elevator Type." 【Features】 ■ A system that mixes various processing items ■ Automatic processing through programming methods ■ A rich system that accommodates stable functionality and various specifications ■ Safe for use in the precise manufacturing process of printed circuit boards *For more details, please refer to the PDF materials or feel free to contact us.
A series of processes such as the first plating, rinsing, and second plating can be performed in one module!
The "Flow-through Plating System RP-2" is a fully automated plating device specifically designed for small items. A series of processes such as the first plating, rinsing, and second plating can be performed within a single module, and if the processing volume increases, additional modules can be added to accommodate it. Based on this product, we also offer the "RP-2FA," which has been developed to enhance productivity and achieve labor-saving and unmanned operations through full automation. 【Features】 ■ Capable of high current density (high-speed) plating ■ Plating of fine powders (10-50μm) is possible by changing the filter ■ The amount of liquid carried in/out and the generation of gas/mist are drastically reduced compared to conventional devices ■ A series of processes such as the first plating, rinsing, and second plating can be performed within a single module ■ If the processing volume increases, additional modules can be added to accommodate it *For more details, please refer to the PDF document or feel free to contact us.
Vertical plating device for thin materials.
Vertical plating device for thin materials For more details, please refer to the catalog or feel free to contact us.
Product compatibility for hangers and jigs! Jigs can be adjusted up and down, left and right, making them useful when dealing with a diverse range of products.
We would like to introduce the vertical electroplating copper plating equipment. Special JIG: Customizable according to customer company specifications and product sizes. Accurate current authorization is composed of two rectifiers per product. The configuration of the front part of the equipment is as follows: Equipment height: 4,000 (Max 610 product standard) Equipment width: 7,000 (including washing equipment). 【Features】 ■ Compatibility with hangers and jigs ■ Uniform maintenance of spacing between substrates in the plating bath ■ Rectifier control ■ Defective hanger checker ■ Substrate guide within the tank *For more details, please refer to the PDF document or feel free to contact us.
We will introduce continuous plating equipment and barrel plating equipment, among others.
The surface treatment system comprehensive catalog for plating equipment includes various products such as the "Continuous Plating Equipment," which allows for minimal plating of only the necessary parts for electronic components; the "Barrel Plating Equipment," which uses barrels to plate small components like electronic parts; the "Horizontal Desmear Equipment," which achieves improved maintenance with a simple design; and the "Hard Chrome Plating Equipment," which performs hard chrome plating on engine piston rings for automobiles, among many others. 【Featured Products】 ○ Continuous Plating Equipment ○ Barrel Plating Equipment ○ Printed Circuit Board Plating Equipment ○ Horizontal Desmear Equipment ○ Hard Chrome Plating Equipment, etc. For more details, please contact us or download the catalog.
Achieve labor savings and high productivity with high-speed carriers! With computer control, we flexibly respond to diverse needs.
The "Icy Carrier Fully Automatic Plating Device" flexibly responds to diverse needs with computer control. It achieves labor-saving and high productivity with a high-speed carrier. The selection of processes from loading to pretreatment, plating, and unloading, as well as program changes, can be easily made. Additionally, safety measures against accidents (such as carrier collisions, overruns, and double dropping of workpieces) are thoroughly in place. 【Features】 ■ Quickly responds to a wide variety of processing contents (7,000 types) with fully automatic processing ■ Easy selection of processes and program changes ■ High-speed carrier operation (500mm/s) shortens cycle time ■ Soft start and soft stop ensure that workpieces are transported without shock ■ Comprehensive safety measures against potential accidents *For more details, please refer to the PDF document or feel free to contact us.
Efficient experiments are possible! Introducing an on-demand film formation device using laser sintering technology.
The "HLP-DCL100" is a high-speed laser plating device that sinters metal nanoparticle paste with a laser to form a metal film. It can create films on a wide range of metal materials, including standard steel. Additionally, it can form films on substrates such as copper, which are significantly affected by heat in conventional furnace firing. Furthermore, the monitoring function allows for the evaluation of the sample condition at each stage of the process. 【Features】 ■ Joint research and development with M&M Laboratory and Ibaraki University ■ Capable of forming films on a wide range of metal materials, including standard steel ■ Can be processed in atmospheric and inert gas environments ■ Comfortable user interface operable via a touch panel screen ■ Efficient experiments enabled through process monitoring ■ Compact desktop design *For more details, please refer to the PDF materials or feel free to contact us.
Solving surface treatment for small quantities and diverse types of electronic components that require strict quality standards!
The 『HOBJET(C)』 is a jet plating device that allows for processing with the barrel table remaining in place for both pre- and post-processing, and also facilitates easy sampling during processing. It can be applied widely, from small-scale prototypes to mass production. With a cassette system, moving between tanks for pre-treatment, plating, and post-treatment is effortless. 【Features】 ■ Improvement in plating quality and reduction in thickness variation ■ No lid design prevents jamming ■ Easy to attach and detach due to the cassette system ■ Barrel heads can be freely exchanged ■ The lead (cathode) tip is replaceable with a screw type, etc. *For more details, please download the PDF or feel free to contact us.
Isn't it the case that the manufacturer who made the machine is far away, making it impossible to repair it quickly?
Do you have concerns like, 'The manufacturer who made the machine is in the Kanto region, and it takes time to get them to come for repairs...'? Our company, based in Osaka, can quickly resolve such issues. Additionally, when it comes to repairing machines, if the manufacturer has outsourced the electrical control, it can take even longer. You may have experienced situations where you couldn't reach the person in charge of electrical control and ended up with a whole day of downtime. At Kami Kiko, we possess not only the know-how for 'machines' but also the expertise in 'electrical control,' allowing us to respond swiftly and accurately even in such situations. *For more details, please refer to the PDF document or feel free to contact us.
It is a highly productive and high operating rate production facility! We also accept custom design and manufacturing.
The "elevator-type barrel plating device" is a plating apparatus that allows for the plating of workpieces that cannot be attached to stationary jigs, such as bolts, nuts, and washers. It operates by placing these workpieces into a barrel drum, rotating them while passing current through lead wires to deposit a film thickness. A connected shaft with a diameter of 120mm is erected at both ends of the device, with large sprockets of approximately 1,000mm in diameter positioned above and below. A hanger is attached at a 1,000mm pitch to the lateral drive unit, which has a mechanism for vertical movement. Surrounding this setup are pre-treatment and plating tanks, and the hanger is moved every 90 to 360 seconds (6 minutes) to carry out the plating process. *For more details, please feel free to contact us.*
The liquid and pen are different types! Suitable for pinpoint plating and partial plating after repairs.
The "PEN-MEKKI MINI" is a pencil-type plating device. Since the liquid and the plating pen are separate, you can use only the necessary amount of liquid, making it economical and waste-free. It is also very useful for repairs and sample creation as it can be done in a short time. Additionally, when changing the plating liquid, you only need to replace the pen tip. The fine tip allows for use on complex items and even on neck chains. 【Features】 ■ Easy and clean partial plating ■ The liquid and plating pen are separate, allowing for economical use of only the necessary amount of liquid ■ Very useful for repairs and sample creation as it can be done in a short time ■ Simply replace the pen tip when changing the plating liquid ■ Suitable for partial plating after repairs with a laser welder *For more details, please refer to the PDF document or feel free to contact us.
You can choose the beaker size! The liquid is stirred, allowing for uniform plating.
The "Hikari TERI Radiance MM-18T" is a medium-sized versatile plating device that allows for stable and beautiful plating due to its constant voltage and constant current features. The beaker sizes range from 1 liter to 5 liters. The liquid is stirred, enabling uniform plating. Additionally, we offer various plating solutions as options, including plating pen sets, rhodium plating, K24, K18 plating, and glossy nickel plating. 【Features】 ■ Constant voltage and constant current type ■ Enables stable and beautiful plating ■ Uniform plating due to liquid stirring *For more details, please refer to the PDF materials or feel free to contact us.
