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Polishing machine Product List and Ranking from 43 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 10, 2025～Oct 07, 2025
This ranking is based on the number of page views on our site.

Polishing machine Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 10, 2025～Oct 07, 2025
This ranking is based on the number of page views on our site.

  1. 松田精機 Hyogo//Manufacturing and processing contract
  2. フジミインコーポレーテッド Gifu//Electronic Components and Semiconductors
  3. アイエムティー Wakayama//Testing, Analysis and Measurement
  4. 4 null/null
  5. 5 チップトン Aichi//Manufacturing and processing contract
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Polishing machine Product ranking

Last Updated： Aggregation Period:Sep 10, 2025～Oct 07, 2025
This ranking is based on the number of page views on our site.

  1. Belt Grinder "Bader Machine" 松田精機
  2. Plate-shaped white particles of titanium phosphate contribute to the improvement of the lubrication performance of solid lubricants! フジミインコーポレーテッド
  3. [Grinding Device] Tape Grinding Unit "BM Series" Kovax Corporation
  4. 4 Horizontal Ball Grinding Machine "ND460" *Grinding Stone Diameter φ460 西田機械工作所
  5. 5 Magnetic Fluid Grinding (MRF) Device QED Technologies International, Inc.

Polishing machine Product List

301～315 item / All 812 items

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Small Centerless Grinding Machine 'CCB-10'

Small Centerless Grinding Machine 'CCB-10'

Easy to operate for anyone! A compact, space-saving centerless grinding machine.

The "CCB-10" is a compact, space-saving small centerless grinding machine. It can be used with a household 100V power supply. It is easy to operate, making it accessible for anyone. 【Specifications (partial)】 ■ Workpiece size that can be ground (outer diameter × length): φ3 to φ10 × 150mm ■ Grinding wheel rotation motor: single-phase 100V × 200W ■ Grinding wheel size (outer diameter × width × hole diameter): φ150 × 30 width × φ12.7mm ■ Grinding wheel rotation speed: 3175 r.p.m / 3810 r.p.m ■ Feed wheel rotation motor: single-phase 100V / 40W ■ Workpiece grinding feed speed: MAX (2.5m / 3m) / min ■ Grinding wheel center height: 180mm ■ Machine dimensions (width × depth × height): 450 × 600 × 280mm ■ Approximate weight: 35kg *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Hand polishing and filing

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NC6 Axis Grinding Machine 'NBG-03-S6'

NC6 Axis Grinding Machine 'NBG-03-S6'

Simultaneous 6-axis control allows for flexible polishing of twisted surfaces!

The "NBG-03-S6" is a product from Nobimizu Machinery Manufacturing Co., Ltd., a professional company specializing in machine finishing that covers the grinding and polishing category. It can perform complex curved surface polishing, which traditionally relied on manual labor, quickly and accurately in fully automatic mode. 【Features】 ■ With simultaneous 6-axis control, twisted surfaces can be processed freely. ■ While 5-axis processing is common, 6-axis processing is also possible. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • others

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Small Centerless Grinding Machine "ECO Raku 2 CCB-10 Model"

Small Centerless Grinding Machine "ECO Raku 2 CCB-10 Model"

Can be used with a household 100V power supply! Compact size and space-saving.

The "ECO Raku 2 CCB-10 model" is a compact centerless grinding machine that anyone can easily use for grinding. It can be used with a household 100V power supply. With dimensions of 450×600×280mm, it is compact and space-saving. Additionally, it is equipped with a small handle, making it easy to operate the spindle and feed wheel back and forth. 【Features】 ■ Anyone can easily grind ■ No complicated adjustments required ■ Easy operation of the spindle and feed wheel with the small handle ■ Simple start with a button switch *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Centerless Grinder "NCB-50II"

Centerless Grinder "NCB-50II"

Non-woven fabric wheels and buffs can be used widely! Polishing can be done without requiring advanced skills.

The "NCB-50II" is a centerless grinding machine that can perform external diameter grinding on various types of pipes and shafts regardless of their material. Operation is simple. It allows for grinding without requiring skilled expertise. Additionally, we can accommodate a variety of special specifications based on the standard model. (Discharge devices, wheel-less devices, conveyor systems, wet specifications, etc.) 【Features】 ■ Capable of external diameter grinding on various types of pipes and shafts regardless of material ■ Easy operation ■ Custom design and manufacturing for special specifications available *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Precision Grinding Device "MA-400e"

Precision Grinding Device "MA-400e"

High-precision angular bearings are adopted as the main axis! Achieving a flatness accuracy of ±10μm on the reference table.

The "MA-400e" is a precision grinding device with a spindle directly mounted on a surface plate that has been ground and finished with high precision. The brushless DC motor allows for high-precision grinding as there is no change in rotational speed due to load fluctuations. By combining the automatic grinding mechanism's roller holding unit, roller-type swinging holding unit, and various sample holders, we have achieved high-precision automatic grinding for electronic materials, electronic components, ceramics, metal materials, as well as for the pretreatment of TEM, SEM, SIMS samples, and orientation using X-rays. 【Features】 - The spindle is directly mounted on a surface plate that has been ground and finished with high precision. - High-precision angular bearings are used in the spindle. - Achieves flatness accuracy within ±10μm on the reference table. - The brushless DC motor allows for high-precision grinding as there is no change in rotational speed due to load fluctuations. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-300e"

Precision Grinding Device "MA-300e"

Interlock covers are also available! We have achieved further efficiency in polishing operations.

The "MA-300e" is a precision polishing device suitable for polishing large samples such as 3-inch and 4-inch specimens. By installing automatic sample holding units in three locations, it achieves further efficiency in polishing operations. Additionally, by equipping a shaking device, it is expected to improve polishing accuracy and maintain the flatness of the polishing disc. It adopts a sequence control program, allowing for centralized management of the polishing process recipes. 【Features】 - Suitable for polishing large samples such as 3-inch and 4-inch specimens - Three automatic sample holding units installed for further efficiency in polishing operations - Adopts a sequence control program for centralized management of polishing process recipes - Equipped with a leakage breaker and emergency stop button for safe and secure polishing operations - Interlock cover also available *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-200e"

Precision Grinding Device "MA-200e"

Ideal for sample preparation for research and development! Successfully reduced vibration and noise significantly.

The "MA-200e" is a precision grinding device that is highly accurate and suitable for sample preparation in research and development. With the emergency stop button, leakage breaker, and interlock cover (optional), it enables grinding operations with a focus on safety and security. Additionally, it is now possible to manage a wide variety of grinding processes and recipes collectively via a touch panel. 【Features】 ■ Highly accurate and suitable for sample preparation in research and development ■ Improved drive system and rigidity successfully reduce vibration and noise significantly ■ Comfortable operation with digital control using an LCD touch panel ■ Ability to collectively manage a wide variety of grinding processes and recipes via the touch panel ■ Enables grinding operations with a focus on safety and security *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Fully Automatic Wafer Grinding and Polishing Equipment 'CMG-802XJ'

Fully Automatic Wafer Grinding and Polishing Equipment 'CMG-802XJ'

It performs chuck surface cleaning, rough grinding, finishing grinding, and polishing fully automatically with one machine!

The "CMG-802XJ" is a fully automated wafer grinding and polishing composite device that places four vacuum chucks on a sorting table and processes in sequence: chuck surface cleaning, rough grinding, finishing grinding, and polishing, using a rotary transfer type. It was newly developed in response to the high-precision downsizing demands for a wide variety of IC cards and SiP products. With an integrated mechanism with the MDS (Tape Mounting and Peeling Device), it provides a total solution for damage-free processing and ultra-thin wafer thickness. 【Features】 ■ Supports 300mm ultra-thin wafers ■ Integrated mechanism with MDS (Tape Mounting and Peeling Device) ■ Provides total solutions for damage-free processing and ultra-thin wafer thickness ■ Capable of grinding 8-inch/12-inch wafers down to a thickness of 30μm ■ Automatically performs chuck surface cleaning, rough grinding, finishing grinding, and polishing all in one machine *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Comtech Co., Ltd. "Polishing Equipment"

Comtech Co., Ltd. "Polishing Equipment"

Leave the front and back inversion to the robot! A polishing device that achieves energy savings with nighttime power!

Our company offers a "grinding machine" that achieves stable grinding without being affected by the wear of grinding stones. Automatic grinding of round blades at set angles and depths. Additionally, with the optional robot, it is possible to grind unattended at night. 【Features】 ■ Automatic reversal allows the operator to simply set the round blade ■ Asymmetric grinding is possible ■ Grinding can be performed through automatic diameter measurement ■ Stable grinding is possible even with different outer diameter dimensions ■ Equipped with an automatic stabilization device for grinding force *Please contact us for more details.

  • Wafer processing/polishing equipment

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Case Study of Glass Film Implementation: Tokyo Metro Co., Ltd.

Case Study of Glass Film Implementation: Tokyo Metro Co., Ltd.

This is an example of preventing glass shattering due to internal and external causes. *Case study presentation.

Our company handles a variety of wrapping products, including vehicle wrapping, vending machines, signs and billboards, interior decorations, and road surface displays. We would like to introduce a case study of the glass film implemented by Tokyo Metro Co., Ltd. Tokyo Metro Co., Ltd. consulted us as a countermeasure due to a series of window breakage incidents. We used an actual vehicle (a decommissioned car) to conduct a comparative study with various films and application methods, confirming that the measures were sufficient before they decided to implement the solution. Additionally, to prevent breakage after application, we calculate the thermal load on the glass when selecting films, and based on our years of accumulated experience, we provide proposals and support for implementation. Please feel free to consult us. *The materials provide an overview of the background leading to the implementation, the solutions, and their effects. You can easily download it from "PDF Download."

  • Other safety and hygiene products

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Blade sharpening machine

Blade sharpening machine

Adjustable specifications! Introducing workability × efficiency × special custom equipment design.

MINA Technology Co., Ltd. offers "blade sharpening machines." Custom equipment design is tailored to create devices suitable for specific projects and processes. If you have an image, we can conceptualize and realize the design. We enhance the efficiency, productivity, and competitiveness of our customers' operations. Please feel free to contact us when you need our services. 【Features】 ■ We can conceptualize and realize the design as long as you have an image. ■ Unlike commercially available products, we can optimize for specific tasks or processes. *For more details, please refer to the PDF materials or feel free to contact us.

  • Mechanical Design

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Explosive Shock Wave Method Nano Diamond (SNMD)

Explosive Shock Wave Method Nano Diamond (SNMD)

The world of particle sizes 2.6 to 2.8 mm! Leave it to us for anything related to nano diamonds.

The detonation nanodiamond is a product manufactured by mixing TNT (trinitrotoluene) and RDX (cyclotrimethylenetrinitramine: hexogen) and detonating it in an oxygen-free environment. It has realized the reuse of military explosives for peaceful purposes. Please feel free to contact us if you have any inquiries. 【Features of ND particles】 ■ Presence of a hydration layer (non-freezing) ■ High dispersibility in certain solutions ■ Oxidized graphite ■ Particle size ranges from 2.6 to 2.8 mm ■ Carbon composite compound with a thin layer of diamond inclusion and oxidized nanographite *For more details, please download the PDF or feel free to contact us.

  • Chemicals

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Grinding and Polishing Machine "Abrapole-30"

Grinding and Polishing Machine "Abrapole-30"

Efficiently polishing large samples or a large quantity of samples in a short time.

The "Abrapole-30" is an advanced polishing and grinding device that uses a fixed sample plate. It features a double droplet system that optimizes the dripping of suspensions and lubricants, a grinding rate sensor, and a safety transparent cover. It can uniformly drip over a wide area, making it compatible with a 350mm diameter disc and a 200mm fixed sample plate. 【Features】 ■ Powerful motor with a robust design to support it ■ Compatible with large samples ■ Easy operation *For more details, please download the PDF or contact us.

  • Wafer processing/polishing equipment

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Sample Grinder "Abraplan-30"

Sample Grinder "Abraplan-30"

High reliability, large capacity, precise and efficient surface grinding equipment.

The "Abrasive Plan-30" is an advanced surface grinding machine that can accommodate fixed sample plates with a diameter of up to 200mm. It is suitable for processing large samples or a large number of samples continuously in the field. Additionally, it reduces working time and enhances the productivity of the grinding and polishing processes. 【Features】 ■ High precision and powerful performance ■ Easy and fast operation ■ Large capacity *For more details, please download the PDF or contact us.

  • Wafer processing/polishing equipment

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Fully Automatic Grinding and Polishing Solution 'Xmatic'

Fully Automatic Grinding and Polishing Solution 'Xmatic'

Complete automation of the grinding and polishing process! Reducing human errors and ensuring very high reproducibility.

The "Xmatic" is a fully automated grinding and polishing solution for high-throughput laboratories. It can accommodate up to 8 sample plates at once, allowing various methods to be assigned to each sample plate. Once the consumables are placed in their designated positions, they are recognized by a unique data matrix code, and their positions are automatically registered in the user interface. Additionally, we offer the "Xmatic Compact," which is suitable for situations with limited installation space. 【Features】 ■ Maximizes reproducibility with consistent fully automated grinding and polishing ■ Improves lab efficiency by minimizing the working time of sample preparation operators per sample ■ Increases throughput through optimized high-quality sample preparation processes ■ Enhances safety in the working environment with minimal human resources ■ Simplifies processes with quick, easy, and intuitive operation *For more details, please refer to the PDF document or feel free to contact us.

  • Testing Equipment and Devices
  • Wafer processing/polishing equipment

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