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Polishing Product List and Ranking from 404 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

Polishing Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. アイエムティー Wakayama//Testing, Analysis and Measurement
  2. 山口研磨 Aichi//Manufacturing and processing contract
  3. null/null
  4. 4 null/null
  5. 5 フジミインコーポレーテッド Gifu//Electronic Components and Semiconductors
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Polishing Product ranking

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. Isn't that sample damaged during polishing? [Presentation of sample polishing service materials]
  2. Collection of buff polishing examples for metal parts such as iron and stainless steel. 山口研磨
  3. Sample Grinding Tool - Tsukamerukun アイエムティー
  4. 4 Fluid polishing キャステック
  5. 5 Alumina grinding paper アイエムティー

Polishing Product List

661～675 item / All 876 items

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Compression spring grinding and polishing processing cost reduction

Compression spring grinding and polishing processing cost reduction

By eliminating the grinding process on both ends, cost reduction can be expected.

When the wire diameter of a compression spring is thick, the ends of the spring are ground flat. Grinding is also referred to as polishing. The purpose of grinding is to improve the seating of the spring. Now, regarding the wire diameter at which grinding is performed, it is not actually specified in the JIS standards. Many spring-related publications suggest that grinding is done for wire diameters of 0.5mm or more. If grinding is not performed, the price of the spring will be lower. Therefore, if there are no issues with usage, I recommend considering "no grinding" even for wire diameters of 0.5mm or more. As a guideline, if the wire diameter is 2.0mm or less and the spring index (the value obtained by dividing the average coil diameter by the wire diameter) is 13 or more, it is considered that the spring can be used without grinding and still have good seating. For this spring, the wire diameter is 2.0mm, the average coil diameter is 28mm, and the spring index is 14. How does that look? The spring on the left in the photo has good seating visually, and the perpendicularity meets JIS Class 2 (approximately 2.9 degrees) and is kept below 2 degrees. If you have any questions about "grinding" for compression springs, please feel free to consult us. We can also accommodate prototype assessments with a short lead time.

  • Spring

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Lock pin, hard steel wire, SW-C Φ1.2, barrel polished.

Lock pin, hard steel wire, SW-C Φ1.2, barrel polished.

We are performing barrel polishing to remove fine burrs and other imperfections.

The material used is "hard steel wire - SW-C." While "hard steel wire" has lower durability compared to the iron-based spring material "piano wire," it is a cost-effective material with good workability. After forming, heat treatment is performed, and barrel polishing is carried out to remove fine burrs and other imperfections. The surface treatment is "electroless nickel plating." If you have any issues with springs or forming, please feel free to consult us. Our technical staff will respond carefully. Tsurugaoka Spring Co., Ltd. Contact: Ujiie Phone: 0235-22-0407 FAX: 0235-22-0546 Email: web@tohj.com We also support web conferencing.

  • Contract manufacturing

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Guide ring SUS316-WPAΦ5.0 barrel polished

Guide ring SUS316-WPAΦ5.0 barrel polished

The ring surface is finished smoothly with barrel polishing.

Material: Spring stainless steel wire, SUS316-WPA Wire diameter: Φ5.0 After forming, heat treatment is performed, and barrel polishing is applied to achieve a smooth surface. The barrel polishing uses a vibrating type. If you have any issues with springs, please feel free to consult us. Tsuruoka Spring Co., Ltd. Contact: Ujiie Phone: 0235-22-0407 FAX: 0235-22-0546 Email: web@tohj.com

  • Spring

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Processing "Lenses, Prisms, Spherical Processing"

Processing "Lenses, Prisms, Spherical Processing"

We can process lenses, prisms, and spheres!

"Lens, Prism, and Spherical Processing" is a unique processing method developed by our company that enables the processing of lenses, prisms, and spheres. We can process various materials, including optical glass, ceramics, and composites. Additionally, we can accommodate spherical diameters ranging from φ10 to 100, so please feel free to consult us if you have any requests. [Features] ■ Spherical processing is possible for ceramics, glass, and composites ■ Spherical diameters can be accommodated from φ10 to 100 *For more details, please contact us or download the catalog.

  • Other processing machines
  • Ceramics
  • Glass

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Renewal Service "Natural Stone Renewal (Restoration)"

Renewal Service "Natural Stone Renewal (Restoration)"

Before giving up and thinking 'there's no choice but to renovate,' please try our renewal (restoration) service!

At Supplement Co., Ltd., we perform renewal (restoration) of natural stones. Natural stones have a luxurious feel and are used as flooring materials in various places. However, depending on the type of stone, some are soft and easily scratched, while others are sensitive to chemicals, leading to different characteristics. Therefore, we use restoration methods tailored to each stone's specific properties. After restoration, we apply a coating that makes it difficult for dirt to adhere, making maintenance easier. This allows you to postpone the time for replacement, so please feel free to consult us. 【Features】 ■ Revives the original luster of natural stones ■ Easy cleaning and lasting beauty ■ Much more budget-friendly than remodeling ■ Significant reduction in the effort and time required for cleaning natural stones, making it eco-friendly ■ Renewal (restoration) of various types of natural stones is possible *For more details, please refer to the PDF materials or feel free to contact us.

  • Other contract services

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Renewal Service "Toilet Renewal (Restoration)"

Renewal Service "Toilet Renewal (Restoration)"

Water-repellent effect makes it hard for dirt to stick! Introduction to toilet renewal (restoration).

At Supplement Co., Ltd., we are engaged in toilet renewal (restoration). Parts where water accumulates may turn black, and limescale or dirt that follows the flow of water can become stubborn over the years, making it difficult to clean thoroughly with regular cleaning. Our company uses different liquids and pads depending on the type of dirt, removing surface stains and ingrained dirt, and restoring shine through coating. Additionally, surfaces become less prone to dirt accumulation, making maintenance easier and eliminating unpleasant odors specific to toilets. This allows you to postpone the timing of replacement, so please feel free to consult us. 【Features】 ■ Water-repellent effect makes it difficult for dirt to adhere ■ Continued cleanliness and easy cleaning ■ Much more economical than replacement ■ Significant savings in effort and time with easy cleaning ■ Renewal services available for areas other than the toilet bowl *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services

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Renewal Service "Sink Renewal (Restoration)"

Renewal Service "Sink Renewal (Restoration)"

A wallet eco that is much more reasonable than replacing it! Introduction to sink renewal.

At Supplement Co., Ltd., we offer renewal (restoration) services for sinks. When cleaning does not remove dullness or when rust stains accumulate, the shine of stainless steel can be lost. Our company removes water stains, rust stains, and minor scratches from stainless steel through polishing, restoring its luster. Stainless steel is highly resistant to corrosion and, with proper maintenance, can remain beautiful and usable for a long time. You can postpone the need for replacement, so please feel free to consult us. 【Features】 ■ Clean shine ■ Lasting cleanliness and easy cleaning ■ Much more economical than replacement ■ Significant savings in effort and time with easy cleaning ■ Recommended for various scenes *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services

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Toyo Stainless Steel Polishing Co., Ltd. Processing Technology Introduction

Toyo Stainless Steel Polishing Co., Ltd. Processing Technology Introduction

Introducing the "polishing technology" that breathes life into metal!

At Toyo Stainless Polishing Industry Co., Ltd., we provide "metal products" and the "polishing technology" to process those metals. We perform polishing tailored to the products we aim to create, starting from the raw state of the metal material. We process that material and apply final polishing (finishing) to the completed product. Additionally, since we handle everything from material sourcing to processing, we take full responsibility for the entire process. If you have any requests, please feel free to contact us. 【Features】 ■ Responding to various requests for metal expressions ■ Special polishing expressions that materialize images ■ Combined expressions of three-dimensional techniques and polishing technology *For more details, please refer to our catalog or feel free to contact us.

  • Processing Contract
  • Other metal materials
  • Contract manufacturing

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Surface pressure distribution measurement system "I-SCAN"

Surface pressure distribution measurement system "I-SCAN"

Real-time measurement and display of various contact pressure distributions! Suitable for applications in industrial fields and medical/healthcare sectors.

"I-SCAN" is a system that measures pressure distribution in real-time using an ultra-thin sensor sheet. The sensing points can be up to approximately 2,000, allowing for high-density pressure distribution measurement. Additionally, the sensitivity of the sensors can be adjusted on the software side according to the measurement pressure. It is suitable for applications in industrial fields as well as in medical and health welfare sectors. 【Features】 ■ An ultra-thin sensor sheet with a thickness of 0.1mm that has a simple structure, is reusable, and is inexpensive ■ Up to approximately 2,000 sensing points ■ Capable of high-density pressure distribution measurement ■ Sensitivity of the sensors can be adjusted on the software side according to the measurement pressure ■ Real-time measurement possible with a maximum sampling rate of 100Hz *For more details, please refer to the PDF document or feel free to contact us.

  • Sensors

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Ultra-precision grinding technology

Ultra-precision grinding technology

Flatter, smoother, thinner, more beautiful. Leading the world with ultra-precision polishing technology.

Our company provides unparalleled precision and quality using unique processing technologies for each material. Since our establishment in 1961, we have repeatedly engaged in independent research and development based on years of experience in polishing processing, achieving high-level technical capabilities in handling various single crystal materials. We support research and development with our five super polishing technologies (super smoothing, super flattening, super thinning, super distortion-free, and super cleaning). 【Features】 ■ Surface roughness at the nanometer (nm) level ■ Flatness and thickness variation at the micrometer (μm) level ■ Thickness and film thickness from a few μm to several tens of μm ■ Elimination of surface distortion layers ■ Removal of atomic-level metal contamination ■ Removal of submicron-level particles *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements

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【Grinding Process Material】Composite Material Grinding Process

【Grinding Process Material】Composite Material Grinding Process

Our company is capable of polishing compound semiconductor crystals. We can accommodate a wide range of processing, from small quantities to mass production, not limited to standard products.

In the case of compounds, unlike silicon oxides, they are very soft materials, and it is said to be difficult to thin them out. However, at Japan Exceed, we have made it possible to finish thinned compound wafers that have already been patterned, and we can accommodate delivery methods for our customers. We obtained a patent in 1996 for the "development of mirror polishing using abrasives that do not contain bromine." We cater to a wide range of needs, from small quantities to mass production, not limited to standard products. We perform ultra-smooth polishing of SiC single crystals used in power devices, as well as GaN single crystals used in laser diodes and high electron mobility transistors (HEMT) to achieve high recording density. We also process the backside of patterned wafers to thin them out. 【Processing Details】 ■ Processing Materials - SiC - GaN - GaP - GaAs - GaSb - ZnS - ZnSe - ZnTe - Backside processing of patterned wafers, etc. ■ Finished Thickness: 20μm and above ■ Surface Roughness Performance Value: GaP Surface Roughness: 0.1nm *For more details, please download the materials or contact us.

  • Wafer
  • diode
  • Contract manufacturing

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Abrasive processing material: oxide materials for abrasive processing

Abrasive processing material: oxide materials for abrasive processing

It is possible to polish various oxide semiconductor crystals.

Our company possesses the capability to handle processing technology for mass production. Additionally, we also perform polishing processes for substrates used in blue light-emitting diodes and laser diodes. We carry out lapping and polishing processes on a mass production basis to meet the processing specifications required for various applications. 【Processing Details】 ■ Material Names: LiTaO3 (LT), LiNbO3 (LN), ZnO, Quartz, Sapphire, Sapphire Reclaimed, etc. ■ Processing Materials: LiNbO3 (LN), LiTaO3 (LT), ZnO, Quartz, Al2O3 (Sapphire) Backside processing of patterned wafers, reclamation processing, etc. ■ Supported Sizes ・Φ63mm to Φ150mm ・3mm×3mm to 100mm×100mm ■ Finished Thickness: 20μm and above ■ Flatness: TTV: 5μm or less *For more details, please download the materials or contact us.

  • Wafer
  • diode
  • Processing Contract

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Film thickness control processing

Film thickness control processing

It is possible to control the thickness of the formed film in units of several tens of nanometers.

- Thickness control of films such as SiO2 and SiN - Thickness variation after processing: less than 50 nm

  • Circuit board design and manufacturing
  • others

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Introduction to the Polishing and Cleaning Processes of Japan Exceed Co., Ltd.

Introduction to the Polishing and Cleaning Processes of Japan Exceed Co., Ltd.

Achieving a super-smooth surface without haze! Introducing the polishing process.

We would like to introduce the polishing and cleaning processes of Japan Exceed, which performs precision polishing and cleaning of semiconductor materials and metal materials. In the polishing process, we achieve an ultra-smooth surface without haze by dividing the polishing into three stages: primary polishing, secondary polishing, and tertiary polishing. In the cleaning process, we maintain cleanliness by performing cleaning without human intervention, removing contaminants such as particles. 【Polishing Process】 ■ Incoming Inspection ■ Adhesive Application Process ■ Primary Polishing Process ■ Secondary and Tertiary Polishing Processes ■ Cleaning Process ■ Measurement Process ■ Inspection Process *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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[Technology Introduction] Smoothing Technology

[Technology Introduction] Smoothing Technology

Surface roughness at the semiconductor level! Precision polishing using smoothing technology.

Nihon Exceed conducts precision polishing processing using smoothing technology. In addition, we possess microstructure measurement techniques using laser microscopes, such as fine structure measurement with laser confocal functionality. Our company meets the polishing needs of various processing materials. 【Features】 ■ Precision polishing processing using smoothing technology ■ Surface roughness at the semiconductor level ■ Cu: Ra 0.16nm ■ Al: Ra 0.20nm ■ Nb: Ra 0.74nm *For more details, please refer to the PDF materials or feel free to contact us.

  • Processing Contract

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