Standard model that achieves high-reliability mounting such as fluxless, void-free, and lead-free. Made by Unitec Japan.
The "RSS-210-S" is a desktop vacuum solder reflow device that is suitable for solving challenges related to no-clean flux, void removal, and lead-free processes.
It supports traditional "flux," "hydrogen reduction," and reduction using "formic acid."
With the powerful reducing effect of formic acid, it effectively removes the oxide film on metal surfaces such as substrates, achieving improved wettability even without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results.
With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting that meets the standards required for power devices and aerospace applications.
【Features】
■ Rapid heating at 4°C per second, significantly reducing takt time due to water cooling
■ Maximum reachable temperature of 400°C (optional 500°C)
■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen
■ Almost perfectly realizes the set temperature profile, with high repeatability and nearly zero overshoot
■ The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces
*Requests for free demonstrations are also accepted. Please feel free to contact us.
*For more details, please refer to the PDF materials or feel free to contact us.
