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Reflow Equipment Product List and Ranking from 15 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

Reflow Equipment Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. アントム Kanagawa//Electronic Components and Semiconductors
  2. ユニテンプジャパン Tokyo//Electronic Components and Semiconductors
  3. テクノアルファ Tokyo//Electronic Components and Semiconductors
  4. 4 エイテックテクトロン Tokyo//Industrial Machinery
  5. 4 アユミ工業 Hyogo//Electronic Components and Semiconductors

Reflow Equipment Product ranking

Last Updated: Aggregation Period:Sep 17, 2025~Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Reflow device "SOLSYS-6310IRTP" アントム
  2. Atmospheric Dedicated Furnace Reflow Device "UNI-5016F" アントム
  3. Reflow device "UNI-6116H" アントム
  4. Reflow device "SOLSYS-8310IRTP" アントム
  5. 4 [Limited to 5 units] High-performance compact reflow device for atmospheric use UNI-5016A アントム

Reflow Equipment Product List

31~45 item / All 61 items

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VPS Reflow Device

Achieve a stable temperature process! Capable of 3D implementation and accommodating three-dimensional structures!

At Techno Alpha, we handle the 'VPS Reflow Equipment' manufactured by IBL and R&D Vaportech. In the VPS method, products are immersed in a saturated vapor atmosphere obtained by heating a fluorinated inert heat transfer liquid (Garden), allowing the vapor that comes into contact with the product to release latent heat of vaporization and condense, enabling efficient and uniform heating of the product. This method is also effective for substrates with three-dimensional components, thick large substrates, and 3D mounting. 【Features】 ■ The vapor temperature is determined by the boiling point of the liquid used, allowing for uniform application of a constant temperature to the product. ■ Since the boiling point temperature of the liquid is utilized, the product is not exposed to temperatures above the specified temperature (= boiling point temperature), minimizing damage. ■ Because it uses vapor, it has higher thermal efficiency compared to hot air and infrared methods, improving mass production through reduced process time. *For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment
  • Soldering Equipment

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Techno Alpha's "Reflow Oven"

We handle a variety of reflow devices that can achieve stable temperature processes.

We would like to introduce our company's "Reflow Equipment." We handle various products, including the SST Corporation's "Vacuum and Pressure Reflow Equipment," which is suitable for process development and small-scale production of microelectronics packages, as well as the "Model 5100," which can automatically control precise heating and cooling settings, and the "VPS Reflow Equipment," which can accommodate 3D mounting and three-dimensional structures. 【Products We Handle】 ■ SST Corporation's Vacuum and Pressure Reflow Equipment ■ IBL Corporation's VPS Reflow Equipment *For more details, please refer to the PDF materials or feel free to contact us.

  • Reflow Equipment
  • Vacuum Equipment

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Reflow device compatible with high heat capacity and large devices.

A reflow device with high uniformity and low running costs.

The vapor phase reflow equipment manufactured by Germany's IBL has completely overcome the disadvantages of conventional vapor phase reflow devices and has been reborn in a completely new form. It is suitable not only for conventional SMT substrates but also for three-dimensional formed substrates such as power modules and 3D-MID, featuring excellent uniform heating and thermal capacity without causing overheating. It accommodates a wide range of production, from small-batch production of various types to mass production.

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  • Reflow Equipment

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Atmospheric Dedicated Furnace Reflow Device "UNI-5016F"

Compact lead-free compatible machine. Suitable not only for mass production but also for cell production, evaluation, and research and development purposes!

The UNI-Series is a reflow device that thoroughly pursues miniaturization, with some models having a length of 780mm while still being compatible with nitrogen. Most of the delivered devices are used in clean environments. It features a heating method that combines hot air circulation and far-infrared radiation, and it is a lead-free type that is energy-efficient. 【Features】 ○ Heating method using upper hot air circulation and upper and lower far-infrared radiation ○ Suitable not only for mass production but also for cell production, development, and evaluation purposes For more details, please contact us or download the catalog.

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Reflow device "SOLSYS-8460IRTP"

Compact lead-free compatible machine. Number of heating zones: 8. Equipment length: 3,650mm.

The SOLSYS-Series is a medium-sized reflow oven that employs a heating method using upper hot air circulation combined with upper and lower far-infrared radiation. It is an effective reflow oven with a "floor heating effect" that helps suppress the temperature rise of components on the upper side. The series has added the nitrogen-compatible model SOLSYS-6250IRTP to its lineup, contributing to space-saving solutions. It is an energy-efficient, lead-free compatible model. 【Features】 ○ Heating method using upper hot air circulation and upper and lower far-infrared radiation ○ Effective "floor heating method" for suppressing temperature rise of upper components ○ Compatible with a substrate effective width of up to 460mm For more details, please contact us or download the catalog.

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Nitrogen-Compatible Reflow Device 'SOL-6125'

Compact lead-free compatible machine. Number of heating zones: 6. Equipment length: 3,250mm.

The SOL-6125 is a medium-sized reflow oven that employs a heating method using upper hot air circulation and upper and lower far infrared rays. It is an effective reflow oven with a "floor heating effect" that helps suppress the temperature rise of components on the upper side. It is an energy-saving, lead-free compatible model. 【Features】 ○ Ideal nitrogen-compatible furnace for space-saving mass production ○ Heating method using upper hot air circulation and upper and lower far infrared rays ○ Effective "floor heating method" for suppressing temperature rise of upper components ○ Standard equipped with an easy maintenance flux recovery system ○ Supports effective substrate width up to 250mm For more details, please contact us or download the catalog.

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<Nitrogen-Compatible Furnace> Reflow Device "SOL-8130"

Compact lead-free compatible device. Ideal for mass production of consumer electronics, industrial equipment, and EMS applications in diverse manufacturing environments!

The SOL-8130 is a medium-sized reflow device that employs a heating method using upper hot air circulation and upper and lower far-infrared radiation. It is an effective reflow device that has a "floor heating effect," which is useful when you want to suppress the temperature rise of the components on the upper surface. It is an energy-saving, lead-free compatible machine. 【Features】 〇 Heating method that combines upper hot air circulation and upper and lower far-infrared radiation 〇 Suitable for various production sites, including mass-produced consumer electronics, industrial equipment, and EMS 〇 Standard equipped with a flux recovery device 〇 Supports effective substrate width up to 300mm *For more details, please contact us or download the catalog.

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Free distribution of the handbook "Characteristics of Far Infrared Reflow" is currently available!!

Attention implementation engineers!! "Characteristics of far-infrared reflow" is available for free!!

This is a permanent edition created under the supervision of implementation advisor Kazuo Kawai, covering the principles of soldering and void countermeasures! Please take a look. Contents: 1. Principles of soldering 2. Characteristics of reflow ovens and temperature profiles 3. Effectiveness of void countermeasures 4. Reflow compatibility for fine parts

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Small Reflow Device "UNI-6116α"

A high-performance eco machine that pursues the coexistence of reflow performance and eco-friendliness. *Free handbook "Characteristics of Far Infrared Reflow" available now!

The UNI-6116α is a reflow device that thoroughly pursues eco-performance. It adopts a heating method that combines hot air circulation and far-infrared radiation. It is an energy-saving, lead-free compatible model. 【Features】 ○ All heating zones can be set to 350℃ ○ High-output heaters are used in the reflow zone ○ Suitable for high melting point solder and AuSn bonding ○ Significantly reduces power consumption ○ Nitrogen-compatible furnace ○ Achieves an oxygen concentration of 100ppm at a usage rate of 100L/min while minimizing N2 consumption For more details, please contact us or download the catalog.

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Solving your soldering problems! ~Implementation Technology Case Studies~ Free distribution now available!

"I want to know the recent profile trends!" "I want to see examples of solder evaluation!" We will directly solve your problems related to soldering!

We have compiled a handbook of implementation technology-related case studies for engineers struggling with defect improvement in mass production sites. Supervised by Mr. Kazuo Kawai, who has achieved defect improvements in many sites as an implementation advisor. As implementation technology advances with the miniaturization and complexity of products, we present various recent case studies (with photos) on trends in profiles and soldering evaluations, reflecting the era that demands serious technical responses. This handbook is available for free to all engineers involved in implementation sites! 【Contents】 1. Recent trends in profiles 2. Creating temperature profiles 3. Evaluation of solder 4. Company overview *For more details, please download the PDF or feel free to contact us.

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Reflow device "ERSA HOTFLOW 3 Series"

Germany's ERSA company presents the world-recognized high-quality reflow equipment 'HOTFLOW 3 Series' that maximizes cost-effectiveness to the limit.

The "ERSA HOTFLOW 3 series" is a high-quality reflow system that features high heating capacity, high processing capability, minimal ΔT, maximum operating time, high energy efficiency, excellent condition maintenance performance, minimal maintenance time, and high traceability compatibility.

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Vacuum Reflow Device "RNV162 Series"

The combination of top and bottom hot air circulation heating and vacuum pressure enables high-quality, highly reliable soldering!

The "RNV162 Series" is a high-performance vacuum reflow device that excels in usability. Thanks to the combined effect of hot air circulation heating and vacuum suction, it significantly reduces void generation even with large areas of solder, achieving a void area of less than 1% when used in combination with solder paste. Additionally, compared to hot plate heating methods, it has a smaller temperature variation (Δt) and allows for a reduction in reflow time. 【Features】 ■ Significantly reduces void generation even with large areas of solder ■ Incredible flux recovery system ■ Suitable for mass production with inline transport ■ Greatly reduces flux adhesion dripping issues ■ Upper and lower hot air circulation heating method *For more details, please refer to the PDF document or feel free to contact us.

  • Other mounting machines
  • Soldering Equipment

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Vacuum Reflow Equipment "RNV152/RSV152 Series"

Continuous inline transport suitable for mass production! High-performance vacuum reflow device with excellent usability.

The "RNV152/RSV152 series" is a high-performance vacuum reflow device that is user-friendly and offered at a low price. By combining upper and lower hot air circulation heating with vacuum pressure, it enables high-quality and highly reliable soldering that surpasses the conventional concept of temperature profiles, even in a limited heating zone. The design features lightweight construction of the furnace body, the use of low thermal conductivity insulation materials, double insulation, and resin covers for insulation, achieving ultra-low power consumption through high insulation specifications. 【Features】 ■ High-performance vacuum reflow device with excellent usability ■ Upper and lower hot air circulation heating method ■ Ultra-low power consumption and high insulation specifications (approximately 40% energy saving) ■ Continuous inline transport suitable for mass production ■ Can also be used as an N2 reflow furnace *For more details, please refer to the PDF document or feel free to contact us.

  • Other mounting machines
  • Soldering Equipment

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Tabletop Vacuum Solder Reflow Device 'VSS-450-300'

Implementation without flux is possible through formic acid reduction. There is the advantage of not having to worry about future risks associated with the use of flux.

The main point of this device is that it enables flux-free implementation through formic acid reduction. Since flux is not used at all, there are advantages such as "no need for cleaning processes and their inspection processes" and "no need to worry about flux residues and re-corrosion caused by residues." Additionally, since flux is also a factor for voids, and formic acid weakens the surface tension of solder, it improves the removal of voids and contributes to being void-free. Furthermore, unlike conventional hydrogen reduction, formic acid reduction has a lower starting temperature for the reduction reaction than hydrogen, allowing for the removal of oxide films from substrates and electronic components without causing thermal damage.

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Reflow device

Introducing wafer bump reflow, vacuum reflow equipment, and tabletop reflow equipment.

We would like to introduce the "Reflow Equipment" handled by Dai Nichi Shoji Co., Ltd. The "N2 Compact Size Reflow" is a product that achieves a compact size with a total length of 2.5m and 6 zones, compatible with packages such as BGA/CSP. The "φ6-8 Inch Wafer BUMP Reflow" can be used as a wet back device for bump formation after solder plating, while the "φ8-12 Inch Wafer BUMP Reflow" is suitable for reflow after ball mounting and bump printing. Additionally, we also handle "Vacuum Reflow Equipment" and "Desktop Reflow Equipment." [N2 Compact Size Reflow Features] ■ Max 350℃ (±2.5℃) ■ Compatible Size: Max 250×230mm ■ Oxygen Concentration in Oven: 50ppm and above ■ 3-phase 200V 20kW ■ Combination of hot air circulation and far infrared radiation is possible *For more details, please refer to the PDF materials or feel free to contact us.

  • Other inspection equipment and devices

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