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Reflow Equipment Product List and Ranking from 15 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

Reflow Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. 日精 本社 Tokyo//Machine elements and parts
  2. アントム Kanagawa//Electronic Components and Semiconductors
  3. 大和製作所 Saitama//Industrial Machinery
  4. 4 アユミ工業 Hyogo//Electronic Components and Semiconductors
  5. 5 ユニテンプジャパン Tokyo//Electronic Components and Semiconductors
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Reflow Equipment Product ranking

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. 【Use Cases】Characteristics and Applications of Formic Acid Reduction Reflow 日精 本社
  2. Single-chamber vacuum reflow device 'NRY-703WSZ/VA' 大和製作所
  3. Reflow device "UNI-6116H" アントム
  4. 4 Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-110-S 日精 本社
  5. 5 [Comprehensive Catalog] Fluxless Reflow Equipment RF Series アユミ工業

Reflow Equipment Product List

46～58 item / All 58 items

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Reflow Equipment Product Catalog

Reflow Equipment Product Catalog

Supports both formic acid reduction and hydrogen reduction! A compact tabletop reflow device that achieves flux-free and void-free results is featured in many listings.

This catalog introduces the vacuum solder reflow devices handled by Unitec Japan Co., Ltd. Starting with the "VSS-450-300," which allows for easy temperature profile settings and is suitable for both small-batch production and mass production, we also feature models like the "RSS-210-S" and "RSS-160-S," which come standard with a viewing window and are perfect for research and development or prototyping. [Contents (excerpt)] ■ VSS Series ■ RSS Series ■ RSO Series *If you would like a copy of the catalog, please feel free to contact us.

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Formic acid reduction compatible tabletop vacuum reflow device 'VSS-450-300'

Formic acid reduction compatible tabletop vacuum reflow device 'VSS-450-300'

Presenting case studies on problem-solving! Achieving high-reliability implementation with zero voids and zero flux residue through formic acid reduction. Suitable for mass production with rapid heating and cooling!

The "VSS-450-300" is a tabletop vacuum solder reflow device that flexibly accommodates various applications, including solder reflow, oxidation-reduction processing, and paste sintering. With an effective heating area of 300×300×50mm, it can easily handle the mounting of tall components. 【Features】 - Compatible with both fluxless solder (reduction method) and flux-containing solder - Achieves a maximum temperature of 450°C despite its tabletop size - Standard support for atmospheric reflow, nitrogen gas purge reflow, and vacuum reflow - Optional support for formic acid reduction reflow and forming gas (hydrogen + nitrogen) reflow - Supports rapid cooling through a water cooling system *For more details, please refer to the PDF document or feel free to contact us.

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Solder Reflow Device "RSO-300/200"

Solder Reflow Device "RSO-300/200"

Supports both formic acid gas and hydrogen gas reduction! Achieves lead-free, voidless, and flux-free!

The "RSO-300/200" is a multifunctional solder reflow device that can handle various reflow processes such as atmospheric, nitrogen, vacuum, formic acid, and hydrogen with a single unit, equipped with a touch panel. By equipping the bottom of the hot plate with a cross arrangement of 12 vertical and 12 horizontal high-speed infrared (IR) heaters, it achieves stable heating and rapid temperature rise that is less affected by the heat capacity of the target object. In addition to standard reflow, it is also suitable for sintering metal nanopaste and other materials. 【Features】 ■ High-purity quartz chamber: Optional ■ Cross arrangement: Equipped with high-speed infrared (IR) heaters ■ Standard 7-inch touch panel ■ Cooling by nitrogen purge ■ Capable of setting various reflow environments, including vacuum, formic acid, and hydrogen *For more details, please refer to the PDF document or feel free to contact us.

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Solder Reflow Device "RSS-110"

Solder Reflow Device "RSS-110"

Compatible with 100V power supply! A compact model that is among the smallest in the industry, compatible with Φ4 inch and 100mm square!

The "RSS-110" is a solder reflow device that achieves lead-free, void-free, and flux-free soldering. Equipped with a multifunctional touch panel, it can handle various reflow processes such as air, nitrogen, vacuum, formic acid, and hydrogen with a single unit. The device dimensions are 260×420×220mm (W×D×H), and the weight is approximately 10kg. 【Standard Hardware Specifications (Partial)】 ■ Effective object size (W×D×H): 105mm×105mm×35mm ■ Maximum reachable temperature: 400℃ ■ Maximum heating rate: 120K/min (2K/sec) ■ Heating method: Cartridge heater ■ Maximum cooling rate: 180K/min (T=400℃＞200℃) *For more details, please refer to the PDF document or feel free to contact us.

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Solder Reflow Device "RSS-160"

Solder Reflow Device "RSS-160"

Dual support for formic acid gas and hydrogen gas reduction! A multifunctional solder reflow device equipped with a touch panel!

The "RSS-160" is a solder reflow device capable of heating at a rate of 100K/min using a cartridge heater. It supports Φ6 inch and 150mm square sizes, achieving lead-free, voidless, and fluxless soldering. It can handle various reflow environments including atmosphere, nitrogen, vacuum, formic acid, and hydrogen with a single unit. 【Standard Hardware Specifications (Partial)】 ■ Effective object size (W×D×H): 155mm×155mm×35mm ■ Maximum reachable temperature: 400℃ ■ Maximum heating rate: 100K/min (approximately 1.7K/sec) ■ Heating method: Cartridge heater ■ Maximum cooling rate: 100K/min (T=400℃＞200℃) *For more details, please refer to the PDF document or feel free to contact us.

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Formic Acid Reduction Reflow 【Case Study: Voids Trapped Inside Solder】

Formic Acid Reduction Reflow 【Case Study: Voids Trapped Inside Solder】

Solve it with the Unitemp reflow device! Vacuum (decompression) is possible even when the chamber is at high temperature after reaching the melting point!

When X-raying the state after the solder has solidified, there are cases where something resembling bubbles appears within the solder, which is referred to as "voids." If the solder solidifies with these voids remaining, the joint strength and electrical characteristics deteriorate. It is essential to ensure that voids are removed during the process. Our reflow equipment can accommodate a vacuum (reduced pressure) environment of up to 10^-3 hPa, allowing for the evacuation of voids. It is possible to create a profile that allows for the solder to be heated to its melting point after establishing a vacuum state, and also to perform vacuum evacuation while the solder is in a molten state. [Case Overview] ■ Issue - If the solder solidifies with voids remaining, the joint strength and electrical characteristics deteriorate. ■ Solution - By performing vacuum evacuation (reduced pressure) while the solder is molten, voids can be actively removed from the molten solder. *For more details, please refer to the PDF document or feel free to contact us.

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Formic Acid Reduction Reflux Device [Case Study: Flux Residue]

Formic Acid Reduction Reflux Device [Case Study: Flux Residue]

Solve it with the Unitemp reflow device! Reducing gas works by reacting with the oxygen on the metal surface to restore it to its original state without an oxide film!

Until now, we have been using flux to remove the oxide film, but if it remains on the substrate (flux residue), it eventually corrodes and causes failures such as loss of electrical conductivity and soldered components detaching. Recently, as structures have become more complex, there has been a concern about whether the cleaning solution reaches all areas, making it impossible to eliminate the risk of flux residue. Our company supports solder reflow using a "reduction method" with formic acid and hydrogen. This allows for the removal of the oxide film without using flux, thus preventing flux residue and, of course, eliminating the need for a cleaning process. [Case Summary] ■Issue - Flux was used, but if it remains on the substrate (flux residue), it causes failures. ■Solution - Ensured solder wettability without using flux through reduction method reflow. - Choosing formic acid reduction allows for easy equipment and running costs, achieving flux-free and cleaning-free solder reflow. *For more details, please refer to the PDF document or feel free to contact us.

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N2 Reflow Device "RN152 Series"

N2 Reflow Device "RN152 Series"

Simple height adjustment for the labyrinth! Low-power N2 reflow device designed with consideration for the environment and your wallet.

We would like to introduce the N2 reflow device 'RN152 series' manufactured by ETC Corporation, handled by Masu Shoji. The new nozzle improves temperature uniformity. It has an astonishing flux recovery performance, significantly reducing the issue of flux dripping. 【Features】 ■ Astonishing flux recovery performance ■ Dramatically reduces the issue of flux dripping ■ Improved temperature uniformity with the new nozzle ■ Easy height adjustment of the labyrinth ■ Low power consumption considerate of the environment and your wallet ■ Reduced time for changing the set temperature (high to low) *For more details, please refer to the related links or feel free to contact us.

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N2 reflow device "NJ0611 series"

N2 reflow device "NJ0611 series"

High-capacity, high-efficiency flux recovery! N2 reflow equipment with precise and high-quality heating performance.

We would like to introduce the N2 reflow device 'NJ0611 series' manufactured by ETC Corporation, which is handled by Masu Shoji. It features precise and high-quality heating performance with low power consumption. The design is insulated, taking into consideration the working environment. The power supply is AC200V 3Φ, and the lineup includes models such as 'NJ0611M-82', 'NJ0611M-102', and 'NJ1611L-82'. 【Features】 ■ Precise and high-quality heating performance ■ Low power consumption ■ Large capacity, high-efficiency flux recovery ■ Insulated design considering the working environment *For more details, please refer to the related links or feel free to contact us.

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N2 Reflow Device "NJ08 Series"

N2 Reflow Device "NJ08 Series"

Standard equipped with a large air-cooled cooling recovery unit! Ultra-low power consumption N2 reflow device.

We would like to introduce the N2 reflow device 'NJ08 Series' manufactured by ETC, handled by Masu Shoji. Equipped with a large air-cooled cooling recovery unit as standard, it allows for high-capacity and high-efficiency flux recovery. It features an insulated design that takes the working environment into consideration, and includes models such as 'NJ08S-82', 'NJ08M-82', and 'NJ08M-102' in its lineup. 【Features】 ■ Ultra-low power consumption ■ High-capacity, high-efficiency flux recovery ■ Insulated design that considers the working environment *For more details, please refer to the related links or feel free to contact us.

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Airflow device "AJ08M Series"

Airflow device "AJ08M Series"

High insulation for low-temperature coverage! Low-cost, low-power air flow device.

We would like to introduce the Airflow device 'AJ08M Series' manufactured by ETC Corporation, handled by Masu Shoji. It is lightweight, compact, and low-cost. The circuit board has a width of 50 to 400 mm and a length of 70 to 500 mm. The power supply is AC200V 3Φ, and we offer a lineup including 'AJ08M-8', 'AJ08M-10', and 'AJ08M-12'. 【Features】 ■ Low cost ■ Low power consumption ■ Low-temperature cover due to high insulation ■ Lightweight and compact *For more details, please refer to the related links or feel free to contact us.

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Lead-free solder compatible nitrogen reflow system 'NRY-626S-8Z'

Lead-free solder compatible nitrogen reflow system 'NRY-626S-8Z'

M size (W260) PCB compatible lead-free nitrogen reflow oven

The "NRY-626S-8Z" is a nitrogen reflow device compatible with lead-free solder, which achieves a stable temperature profile even during continuous operation through forced convection heating with twin fans. It comes standard with an in-furnace flux recovery system. By using a combination of a water-cooled trap and a high-density filter, the flux recovery efficiency is improved without compromising the oxygen concentration in the furnace. 【Specifications (excerpt)】 ■ Temperature adjustment range: max. 350℃ ■ Number of zones: 10 zones (8 heating, 2 cooling) ■ Flow direction: right to left, left to right ■ Conveyor transport reference: front reference or rear reference ■ Board overhang: 4mm or 5mm *For more details, please download the PDF or contact us.

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Single-chamber vacuum reflow device 'NRY-703WSZ/VA'

Single-chamber vacuum reflow device 'NRY-703WSZ/VA'

Void processing for power module metal substrate reflow is possible!

The "NRY-703WSZ/VA" is a single-chamber (1 zone) vacuum reflow device capable of preheating, heating, and cooling in a single chamber. Thanks to the floating gas extraction heating (Patent No. 5576577), thermal processing can be performed without the influence of warping or bending. Additionally, by injecting nitrogen, reflow soldering and bump formation can be achieved with an oxygen concentration of less than 10 ppm. 【Features】 ■ Void treatment during the formation of solder bumps on wafers ■ By reducing the chamber pressure during solder melting, void removal is possible ■ Supports automatic inline integration by connecting with the entrance conveyor (standard equipment) *For more details, please download the PDF or contact us.

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