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Reflow Equipment Product List and Ranking from 15 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Mar 18, 2026～Apr 14, 2026
This ranking is based on the number of page views on our site.

Reflow Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Mar 18, 2026～Apr 14, 2026
This ranking is based on the number of page views on our site.

  1. アントム Kanagawa//Electronic Components and Semiconductors
  2. ユニテンプジャパン Tokyo//Electronic Components and Semiconductors
  3. アユミ工業 Hyogo//Electronic Components and Semiconductors
  4. 4 エイテックテクトロン Tokyo//Industrial Machinery
  5. 4 日精 本社 Tokyo//Machine elements and parts
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Reflow Equipment Product ranking

Last Updated： Aggregation Period:Mar 18, 2026～Apr 14, 2026
This ranking is based on the number of page views on our site.

  1. Reflow device "SOLSYS-6310IRTP" アントム
  2. Reflow device "SOLSYS-8310IRTP" アントム
  3. [Comprehensive Catalog] Fluxless Reflow Equipment RF Series アユミ工業
  4. 4 Reflow device "UNI-6116H" アントム
  5. 4 N2 Reflow Device "RN152 Series" *Low power consumption considering the environment エイテックテクトロン

Reflow Equipment Product List

31～56 item / All 56 items

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Atmospheric Dedicated Furnace Reflow Device "UNI-5016F"

Atmospheric Dedicated Furnace Reflow Device "UNI-5016F"

Compact lead-free compatible machine. Suitable not only for mass production but also for cell production, evaluation, and research and development purposes!

The UNI-Series is a reflow device that thoroughly pursues miniaturization, with some models having a length of 780mm while still being compatible with nitrogen. Most of the delivered devices are used in clean environments. It features a heating method that combines hot air circulation and far-infrared radiation, and it is a lead-free type that is energy-efficient. 【Features】 ○ Heating method using upper hot air circulation and upper and lower far-infrared radiation ○ Suitable not only for mass production but also for cell production, development, and evaluation purposes For more details, please contact us or download the catalog.

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Reflow device "SOLSYS-8460IRTP"

Reflow device "SOLSYS-8460IRTP"

Compact lead-free compatible machine. Number of heating zones: 8. Equipment length: 3,650mm.

The SOLSYS-Series is a medium-sized reflow oven that employs a heating method using upper hot air circulation combined with upper and lower far-infrared radiation. It is an effective reflow oven with a "floor heating effect" that helps suppress the temperature rise of components on the upper side. The series has added the nitrogen-compatible model SOLSYS-6250IRTP to its lineup, contributing to space-saving solutions. It is an energy-efficient, lead-free compatible model. 【Features】 ○ Heating method using upper hot air circulation and upper and lower far-infrared radiation ○ Effective "floor heating method" for suppressing temperature rise of upper components ○ Compatible with a substrate effective width of up to 460mm For more details, please contact us or download the catalog.

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Nitrogen-Compatible Reflow Device 'SOL-6125'

Nitrogen-Compatible Reflow Device 'SOL-6125'

Compact lead-free compatible machine. Number of heating zones: 6. Equipment length: 3,250mm.

The SOL-6125 is a medium-sized reflow oven that employs a heating method using upper hot air circulation and upper and lower far infrared rays. It is an effective reflow oven with a "floor heating effect" that helps suppress the temperature rise of components on the upper side. It is an energy-saving, lead-free compatible model. 【Features】 ○ Ideal nitrogen-compatible furnace for space-saving mass production ○ Heating method using upper hot air circulation and upper and lower far infrared rays ○ Effective "floor heating method" for suppressing temperature rise of upper components ○ Standard equipped with an easy maintenance flux recovery system ○ Supports effective substrate width up to 250mm For more details, please contact us or download the catalog.

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<Nitrogen-Compatible Furnace> Reflow Device "SOL-8130"

<Nitrogen-Compatible Furnace> Reflow Device "SOL-8130"

Compact lead-free compatible device. Ideal for mass production of consumer electronics, industrial equipment, and EMS applications in diverse manufacturing environments!

The SOL-8130 is a medium-sized reflow device that employs a heating method using upper hot air circulation and upper and lower far-infrared radiation. It is an effective reflow device that has a "floor heating effect," which is useful when you want to suppress the temperature rise of the components on the upper surface. It is an energy-saving, lead-free compatible machine. 【Features】 〇 Heating method that combines upper hot air circulation and upper and lower far-infrared radiation 〇 Suitable for various production sites, including mass-produced consumer electronics, industrial equipment, and EMS 〇 Standard equipped with a flux recovery device 〇 Supports effective substrate width up to 300mm *For more details, please contact us or download the catalog.

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Free distribution of the handbook "Characteristics of Far Infrared Reflow" is currently available!!

Free distribution of the handbook "Characteristics of Far Infrared Reflow" is currently available!!

Attention implementation engineers!! "Characteristics of far-infrared reflow" is available for free!!

This is a permanent edition created under the supervision of implementation advisor Kazuo Kawai, covering the principles of soldering and void countermeasures! Please take a look. Contents: 1. Principles of soldering 2. Characteristics of reflow ovens and temperature profiles 3. Effectiveness of void countermeasures 4. Reflow compatibility for fine parts

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Small Reflow Device "UNI-6116α"

Small Reflow Device "UNI-6116α"

A high-performance eco machine that pursues the coexistence of reflow performance and eco-friendliness. *Free handbook "Characteristics of Far Infrared Reflow" available now!

The UNI-6116α is a reflow device that thoroughly pursues eco-performance. It adopts a heating method that combines hot air circulation and far-infrared radiation. It is an energy-saving, lead-free compatible model. 【Features】 ○ All heating zones can be set to 350℃ ○ High-output heaters are used in the reflow zone ○ Suitable for high melting point solder and AuSn bonding ○ Significantly reduces power consumption ○ Nitrogen-compatible furnace ○ Achieves an oxygen concentration of 100ppm at a usage rate of 100L/min while minimizing N2 consumption For more details, please contact us or download the catalog.

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Reflow device "ERSA HOTFLOW 3 Series"

Reflow device "ERSA HOTFLOW 3 Series"

Germany's ERSA company presents the world-recognized high-quality reflow equipment 'HOTFLOW 3 Series' that maximizes cost-effectiveness to the limit.

The "ERSA HOTFLOW 3 series" is a high-quality reflow system that features high heating capacity, high processing capability, minimal ΔT, maximum operating time, high energy efficiency, excellent condition maintenance performance, minimal maintenance time, and high traceability compatibility.

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Vacuum Reflow Device "RNV162 Series"

Vacuum Reflow Device "RNV162 Series"

The combination of top and bottom hot air circulation heating and vacuum pressure enables high-quality, highly reliable soldering!

The "RNV162 Series" is a high-performance vacuum reflow device that excels in usability. Thanks to the combined effect of hot air circulation heating and vacuum suction, it significantly reduces void generation even with large areas of solder, achieving a void area of less than 1% when used in combination with solder paste. Additionally, compared to hot plate heating methods, it has a smaller temperature variation (Δt) and allows for a reduction in reflow time. 【Features】 ■ Significantly reduces void generation even with large areas of solder ■ Incredible flux recovery system ■ Suitable for mass production with inline transport ■ Greatly reduces flux adhesion dripping issues ■ Upper and lower hot air circulation heating method *For more details, please refer to the PDF document or feel free to contact us.

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Vacuum Reflow Equipment "RNV152/RSV152 Series"

Vacuum Reflow Equipment "RNV152/RSV152 Series"

Continuous inline transport suitable for mass production! High-performance vacuum reflow device with excellent usability.

The "RNV152/RSV152 series" is a high-performance vacuum reflow device that is user-friendly and offered at a low price. By combining upper and lower hot air circulation heating with vacuum pressure, it enables high-quality and highly reliable soldering that surpasses the conventional concept of temperature profiles, even in a limited heating zone. The design features lightweight construction of the furnace body, the use of low thermal conductivity insulation materials, double insulation, and resin covers for insulation, achieving ultra-low power consumption through high insulation specifications. 【Features】 ■ High-performance vacuum reflow device with excellent usability ■ Upper and lower hot air circulation heating method ■ Ultra-low power consumption and high insulation specifications (approximately 40% energy saving) ■ Continuous inline transport suitable for mass production ■ Can also be used as an N2 reflow furnace *For more details, please refer to the PDF document or feel free to contact us.

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Tabletop Vacuum Solder Reflow Device 'VSS-450-300'

Tabletop Vacuum Solder Reflow Device 'VSS-450-300'

Implementation without flux is possible through formic acid reduction. There is the advantage of not having to worry about future risks associated with the use of flux.

The main point of this device is that it enables flux-free implementation through formic acid reduction. Since flux is not used at all, there are advantages such as "no need for cleaning processes and their inspection processes" and "no need to worry about flux residues and re-corrosion caused by residues." Additionally, since flux is also a factor for voids, and formic acid weakens the surface tension of solder, it improves the removal of voids and contributes to being void-free. Furthermore, unlike conventional hydrogen reduction, formic acid reduction has a lower starting temperature for the reduction reaction than hydrogen, allowing for the removal of oxide films from substrates and electronic components without causing thermal damage.

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Reflow device

Reflow device

Introducing wafer bump reflow, vacuum reflow equipment, and tabletop reflow equipment.

We would like to introduce the "Reflow Equipment" handled by Dai Nichi Shoji Co., Ltd. The "N2 Compact Size Reflow" is a product that achieves a compact size with a total length of 2.5m and 6 zones, compatible with packages such as BGA/CSP. The "φ6-8 Inch Wafer BUMP Reflow" can be used as a wet back device for bump formation after solder plating, while the "φ8-12 Inch Wafer BUMP Reflow" is suitable for reflow after ball mounting and bump printing. Additionally, we also handle "Vacuum Reflow Equipment" and "Desktop Reflow Equipment." [N2 Compact Size Reflow Features] ■ Max 350℃ (±2.5℃) ■ Compatible Size: Max 250×230mm ■ Oxygen Concentration in Oven: 50ppm and above ■ 3-phase 200V 20kW ■ Combination of hot air circulation and far infrared radiation is possible *For more details, please refer to the PDF materials or feel free to contact us.

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Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device RSO-200

Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device RSO-200

A super high-speed heating model capable of a maximum heating rate of 600 K/min, suitable for metal sintering. Manufactured by Unitemp Japan.

The "RSO-200" is a desktop vacuum solder reflow device that enables a void-free rate of up to 0.01%, making it suitable for solving challenges related to no-clean and lead-free soldering. In addition to "hydrogen reduction" for removing oxide films from the metal surfaces to be joined, it also supports "formic acid reduction." The powerful reducing effect of formic acid enhances wettability even without flux. Moreover, despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to accommodate a wide range of prototype development. With its diverse reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace development. 【Features】 ■ Ultra-fast heating rate of 10°C per second, significantly reducing takt time with water cooling ■ Supports maximum temperature of 650°C ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly achieves the set temperature profile as is, with high repeatability and almost zero overshoot ■ The in-plane temperature difference on the heating plate is nearly zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF document or feel free to contact us.

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Formic Acid and Hydrogen Reduction Compatible Vacuum Solder Reflow Device RSS-210-S

Formic Acid and Hydrogen Reduction Compatible Vacuum Solder Reflow Device RSS-210-S

Standard model that achieves high-reliability mounting such as fluxless, void-free, and lead-free. Made by Unitec Japan.

The "RSS-210-S" is a desktop vacuum solder reflow device that is suitable for solving challenges related to no-clean flux, void removal, and lead-free processes. It supports traditional "flux," "hydrogen reduction," and reduction using "formic acid." With the powerful reducing effect of formic acid, it effectively removes the oxide film on metal surfaces such as substrates, achieving improved wettability even without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting that meets the standards required for power devices and aerospace applications. 【Features】 ■ Rapid heating at 4°C per second, significantly reducing takt time due to water cooling ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Almost perfectly realizes the set temperature profile, with high repeatability and nearly zero overshoot ■ The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

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Reflow Equipment Product Catalog

Reflow Equipment Product Catalog

Supports both formic acid reduction and hydrogen reduction! A compact tabletop reflow device that achieves flux-free and void-free results is featured in many listings.

This catalog introduces the vacuum solder reflow devices handled by Unitec Japan Co., Ltd. Starting with the "VSS-450-300," which allows for easy temperature profile settings and is suitable for both small-batch production and mass production, we also feature models like the "RSS-210-S" and "RSS-160-S," which come standard with a viewing window and are perfect for research and development or prototyping. [Contents (excerpt)] ■ VSS Series ■ RSS Series ■ RSO Series *If you would like a copy of the catalog, please feel free to contact us.

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Formic acid reduction compatible tabletop vacuum reflow device 'VSS-450-300'

Formic acid reduction compatible tabletop vacuum reflow device 'VSS-450-300'

Presenting case studies on problem-solving! Achieving high-reliability implementation with zero voids and zero flux residue through formic acid reduction. Suitable for mass production with rapid heating and cooling!

The "VSS-450-300" is a tabletop vacuum solder reflow device that flexibly accommodates various applications, including solder reflow, oxidation-reduction processing, and paste sintering. With an effective heating area of 300×300×50mm, it can easily handle the mounting of tall components. 【Features】 - Compatible with both fluxless solder (reduction method) and flux-containing solder - Achieves a maximum temperature of 450°C despite its tabletop size - Standard support for atmospheric reflow, nitrogen gas purge reflow, and vacuum reflow - Optional support for formic acid reduction reflow and forming gas (hydrogen + nitrogen) reflow - Supports rapid cooling through a water cooling system *For more details, please refer to the PDF document or feel free to contact us.

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Solder Reflow Device "RSO-300/200"

Solder Reflow Device "RSO-300/200"

Supports both formic acid gas and hydrogen gas reduction! Achieves lead-free, voidless, and flux-free!

The "RSO-300/200" is a multifunctional solder reflow device that can handle various reflow processes such as atmospheric, nitrogen, vacuum, formic acid, and hydrogen with a single unit, equipped with a touch panel. By equipping the bottom of the hot plate with a cross arrangement of 12 vertical and 12 horizontal high-speed infrared (IR) heaters, it achieves stable heating and rapid temperature rise that is less affected by the heat capacity of the target object. In addition to standard reflow, it is also suitable for sintering metal nanopaste and other materials. 【Features】 ■ High-purity quartz chamber: Optional ■ Cross arrangement: Equipped with high-speed infrared (IR) heaters ■ Standard 7-inch touch panel ■ Cooling by nitrogen purge ■ Capable of setting various reflow environments, including vacuum, formic acid, and hydrogen *For more details, please refer to the PDF document or feel free to contact us.

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Solder Reflow Device "RSS-110"

Solder Reflow Device "RSS-110"

Compatible with 100V power supply! A compact model that is among the smallest in the industry, compatible with Φ4 inch and 100mm square!

The "RSS-110" is a solder reflow device that achieves lead-free, void-free, and flux-free soldering. Equipped with a multifunctional touch panel, it can handle various reflow processes such as air, nitrogen, vacuum, formic acid, and hydrogen with a single unit. The device dimensions are 260×420×220mm (W×D×H), and the weight is approximately 10kg. 【Standard Hardware Specifications (Partial)】 ■ Effective object size (W×D×H): 105mm×105mm×35mm ■ Maximum reachable temperature: 400℃ ■ Maximum heating rate: 120K/min (2K/sec) ■ Heating method: Cartridge heater ■ Maximum cooling rate: 180K/min (T=400℃＞200℃) *For more details, please refer to the PDF document or feel free to contact us.

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Solder Reflow Device "RSS-160"

Solder Reflow Device "RSS-160"

Dual support for formic acid gas and hydrogen gas reduction! A multifunctional solder reflow device equipped with a touch panel!

The "RSS-160" is a solder reflow device capable of heating at a rate of 100K/min using a cartridge heater. It supports Φ6 inch and 150mm square sizes, achieving lead-free, voidless, and fluxless soldering. It can handle various reflow environments including atmosphere, nitrogen, vacuum, formic acid, and hydrogen with a single unit. 【Standard Hardware Specifications (Partial)】 ■ Effective object size (W×D×H): 155mm×155mm×35mm ■ Maximum reachable temperature: 400℃ ■ Maximum heating rate: 100K/min (approximately 1.7K/sec) ■ Heating method: Cartridge heater ■ Maximum cooling rate: 100K/min (T=400℃＞200℃) *For more details, please refer to the PDF document or feel free to contact us.

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Formic Acid Reduction Reflow 【Case Study: Voids Trapped Inside Solder】

Formic Acid Reduction Reflow 【Case Study: Voids Trapped Inside Solder】

Solve it with the Unitemp reflow device! Vacuum (decompression) is possible even when the chamber is at high temperature after reaching the melting point!

When X-raying the state after the solder has solidified, there are cases where something resembling bubbles appears within the solder, which is referred to as "voids." If the solder solidifies with these voids remaining, the joint strength and electrical characteristics deteriorate. It is essential to ensure that voids are removed during the process. Our reflow equipment can accommodate a vacuum (reduced pressure) environment of up to 10^-3 hPa, allowing for the evacuation of voids. It is possible to create a profile that allows for the solder to be heated to its melting point after establishing a vacuum state, and also to perform vacuum evacuation while the solder is in a molten state. [Case Overview] ■ Issue - If the solder solidifies with voids remaining, the joint strength and electrical characteristics deteriorate. ■ Solution - By performing vacuum evacuation (reduced pressure) while the solder is molten, voids can be actively removed from the molten solder. *For more details, please refer to the PDF document or feel free to contact us.

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Formic Acid Reduction Reflux Device [Case Study: Flux Residue]

Formic Acid Reduction Reflux Device [Case Study: Flux Residue]

Solve it with the Unitemp reflow device! Reducing gas works by reacting with the oxygen on the metal surface to restore it to its original state without an oxide film!

Until now, we have been using flux to remove the oxide film, but if it remains on the substrate (flux residue), it eventually corrodes and causes failures such as loss of electrical conductivity and soldered components detaching. Recently, as structures have become more complex, there has been a concern about whether the cleaning solution reaches all areas, making it impossible to eliminate the risk of flux residue. Our company supports solder reflow using a "reduction method" with formic acid and hydrogen. This allows for the removal of the oxide film without using flux, thus preventing flux residue and, of course, eliminating the need for a cleaning process. [Case Summary] ■Issue - Flux was used, but if it remains on the substrate (flux residue), it causes failures. ■Solution - Ensured solder wettability without using flux through reduction method reflow. - Choosing formic acid reduction allows for easy equipment and running costs, achieving flux-free and cleaning-free solder reflow. *For more details, please refer to the PDF document or feel free to contact us.

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N2 Reflow Device "RN152 Series"

N2 Reflow Device "RN152 Series"

Simple height adjustment for the labyrinth! Low-power N2 reflow device designed with consideration for the environment and your wallet.

We would like to introduce the N2 reflow device 'RN152 series' manufactured by ETC Corporation, handled by Masu Shoji. The new nozzle improves temperature uniformity. It has an astonishing flux recovery performance, significantly reducing the issue of flux dripping. 【Features】 ■ Astonishing flux recovery performance ■ Dramatically reduces the issue of flux dripping ■ Improved temperature uniformity with the new nozzle ■ Easy height adjustment of the labyrinth ■ Low power consumption considerate of the environment and your wallet ■ Reduced time for changing the set temperature (high to low) *For more details, please refer to the related links or feel free to contact us.

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N2 reflow device "NJ0611 series"

N2 reflow device "NJ0611 series"

High-capacity, high-efficiency flux recovery! N2 reflow equipment with precise and high-quality heating performance.

We would like to introduce the N2 reflow device 'NJ0611 series' manufactured by ETC Corporation, which is handled by Masu Shoji. It features precise and high-quality heating performance with low power consumption. The design is insulated, taking into consideration the working environment. The power supply is AC200V 3Φ, and the lineup includes models such as 'NJ0611M-82', 'NJ0611M-102', and 'NJ1611L-82'. 【Features】 ■ Precise and high-quality heating performance ■ Low power consumption ■ Large capacity, high-efficiency flux recovery ■ Insulated design considering the working environment *For more details, please refer to the related links or feel free to contact us.

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N2 Reflow Device "NJ08 Series"

N2 Reflow Device "NJ08 Series"

Standard equipped with a large air-cooled cooling recovery unit! Ultra-low power consumption N2 reflow device.

We would like to introduce the N2 reflow device 'NJ08 Series' manufactured by ETC, handled by Masu Shoji. Equipped with a large air-cooled cooling recovery unit as standard, it allows for high-capacity and high-efficiency flux recovery. It features an insulated design that takes the working environment into consideration, and includes models such as 'NJ08S-82', 'NJ08M-82', and 'NJ08M-102' in its lineup. 【Features】 ■ Ultra-low power consumption ■ High-capacity, high-efficiency flux recovery ■ Insulated design that considers the working environment *For more details, please refer to the related links or feel free to contact us.

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Airflow device "AJ08M Series"

Airflow device "AJ08M Series"

High insulation for low-temperature coverage! Low-cost, low-power air flow device.

We would like to introduce the Airflow device 'AJ08M Series' manufactured by ETC Corporation, handled by Masu Shoji. It is lightweight, compact, and low-cost. The circuit board has a width of 50 to 400 mm and a length of 70 to 500 mm. The power supply is AC200V 3Φ, and we offer a lineup including 'AJ08M-8', 'AJ08M-10', and 'AJ08M-12'. 【Features】 ■ Low cost ■ Low power consumption ■ Low-temperature cover due to high insulation ■ Lightweight and compact *For more details, please refer to the related links or feel free to contact us.

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Lead-free solder compatible nitrogen reflow system 'NRY-626S-8Z'

Lead-free solder compatible nitrogen reflow system 'NRY-626S-8Z'

M size (W260) PCB compatible lead-free nitrogen reflow oven

The "NRY-626S-8Z" is a nitrogen reflow device compatible with lead-free solder, which achieves a stable temperature profile even during continuous operation through forced convection heating with twin fans. It comes standard with an in-furnace flux recovery system. By using a combination of a water-cooled trap and a high-density filter, the flux recovery efficiency is improved without compromising the oxygen concentration in the furnace. 【Specifications (excerpt)】 ■ Temperature adjustment range: max. 350℃ ■ Number of zones: 10 zones (8 heating, 2 cooling) ■ Flow direction: right to left, left to right ■ Conveyor transport reference: front reference or rear reference ■ Board overhang: 4mm or 5mm *For more details, please download the PDF or contact us.

  • Reflow Equipment
  • Reflow Equipment

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Single-chamber vacuum reflow device 'NRY-703WSZ/VA'

Single-chamber vacuum reflow device 'NRY-703WSZ/VA'

Void processing for power module metal substrate reflow is possible!

The "NRY-703WSZ/VA" is a single-chamber (1 zone) vacuum reflow device capable of preheating, heating, and cooling in a single chamber. Thanks to the floating gas extraction heating (Patent No. 5576577), thermal processing can be performed without the influence of warping or bending. Additionally, by injecting nitrogen, reflow soldering and bump formation can be achieved with an oxygen concentration of less than 10 ppm. 【Features】 ■ Void treatment during the formation of solder bumps on wafers ■ By reducing the chamber pressure during solder melting, void removal is possible ■ Supports automatic inline integration by connecting with the entrance conveyor (standard equipment) *For more details, please download the PDF or contact us.

  • Reflow Equipment
  • Reflow Equipment

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