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Reflow Equipment Product List and Ranking from 15 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Reflow Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. アントム Kanagawa//Electronic Components and Semiconductors
  2. ユニテンプジャパン Tokyo//Electronic Components and Semiconductors
  3. テクノアルファ Tokyo//Electronic Components and Semiconductors
  4. 4 エイテックテクトロン Tokyo//Industrial Machinery
  5. 4 アユミ工業 Hyogo//Electronic Components and Semiconductors
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Reflow Equipment Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Reflow device "SOLSYS-6310IRTP" アントム
  2. Atmospheric Dedicated Furnace Reflow Device "UNI-5016F" アントム
  3. Reflow device "UNI-6116H" アントム
  4. Reflow device "SOLSYS-8310IRTP" アントム
  5. 4 [Limited to 5 units] High-performance compact reflow device for atmospheric use UNI-5016A アントム

Reflow Equipment Product List

16～30 item / All 61 items

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Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-3×210-S

Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-3×210-S

The largest heating plate size in the series, 630mm x 200mm, suitable for large objects and simultaneous creation! Made by Unitec Japan.

The "RSS-3×210-S" is a desktop vacuum solder reflow device that enables a maximum void-free rate of 0.01%, making it suitable for solving challenges related to no-clean and lead-free soldering. It supports the removal of oxide films on the metal surfaces to be joined through "hydrogen reduction" and "formic acid reduction." The strong reducing effect of formic acid enhances wettability even without flux. Additionally, despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to accommodate a wide range of prototype development. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required in power devices and aerospace applications. **Features** - Rapid heating at a speed of 2°C per second, significantly reducing takt time due to water cooling - Near-zero in-plane temperature difference on the heating plate, allowing for uniform heating of large objects - Nearly exact realization of the set temperature profile, with high repeatability and almost zero overshoot - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen *We also accept requests for free demonstrations. Please feel free to contact us.* *For more details, please refer to the PDF document or feel free to reach out to us.*

  • Soldering Equipment
  • Reflow Equipment

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Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-160-S

Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-160-S

Standard model achieving high-reliability assembly such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.

The "RSS-160-S" is a desktop vacuum solder reflow device suitable for solving challenges related to no-clean flux, void removal, and lead-free processes. In addition to conventional "flux" and "hydrogen reduction," it also supports reduction using "formic acid." With the powerful reducing action of formic acid, it effectively removes oxide films from metal surfaces such as substrates, achieving improved wettability without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. Despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to support a wide range of prototype development. 【Features】 ■ Rapid heating at 100°C per minute, and with water cooling, significantly reduces takt time ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly achieves the set temperature profile as is, with high repeatability and almost zero overshoot ■ The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

  • Soldering Equipment
  • Reflow Equipment

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Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-110-S

Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-110-S

Standard model that achieves high-reliability implementation such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.

The "RSS-110-S" is a desktop vacuum solder reflow device suitable for solving challenges related to no-clean, void removal, and lead-free processes. It supports traditional "flux," "hydrogen reduction," and reduction using "formic acid." With the powerful reducing action of formic acid, it effectively removes oxide films from metal surfaces such as substrates, achieving improved wettability even without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace applications. 【Features】 ■ Rapid heating at 2°C per second, significantly reducing takt time due to water cooling ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly exact realization of the set temperature profile High repeatability with almost zero overshoot ■ Minimal in-plane temperature difference on the heating plate, allowing uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

  • Soldering Equipment
  • Reflow Equipment

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Solder Reflow Device 'RSS-3X210-S'

Solder Reflow Device 'RSS-3X210-S'

Multi-functional with a touch panel! One unit can handle various reflows such as air, nitrogen, vacuum, formic acid, and hydrogen!

The "RSS-3X210-S" is a solder reflow device that supports both formic gas and hydrogen gas reduction, with enhanced safety features. It can process up to 12 wafers with a diameter of 100mm at once, and is also suitable for reflowing elongated objects such as printer heads and LED lighting. Equipped with 18 high-speed infrared (IR) heaters under the hot plate, it maintains a uniform temperature even in a wide effective heating area, achieving stable heating that is less affected by the heat capacity of the objects. 【Features】 ■ Effective heating area: 630mm x 210mm ■ Equipped with high-speed infrared (IR) heaters ■ Standard 7-inch touch panel ■ Active water cooling system ■ Capable of setting various reflow environments, including vacuum, formic acid, and hydrogen *For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment

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Formic Acid Reduction Reflow Device [Case Study: Characteristics of Reflowed Solder]

Formic Acid Reduction Reflow Device [Case Study: Characteristics of Reflowed Solder]

Solved with the Unitemp reflow device! Significant high-speed cooling! A cooling rate of nearly 3°C per second from solder melting to solidification!

When molten solder takes too long to cool and solidify, it negatively affects the solder joint strength and electrical characteristics. It is a problem if the characteristics deteriorate due to cooling speed issues. Our reflow equipment is equipped with an active water cooling system using circulating cooling water as standard. This allows us to maximize the solder characteristics after reflow. [Case Summary] ■ Issue: If the molten solder takes too long to cool and solidify, it negatively impacts the solder joint strength and electrical characteristics. ■ Solution: - Standard equipped with an active water cooling system using circulating cooling water. - This not only improves the strength and electrical characteristics of the solder but also reduces the tact time. *For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment

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Formic Acid Reduction Reflow Device [Case Study: Temperature Variation within the Substrate]

Formic Acid Reduction Reflow Device [Case Study: Temperature Variation within the Substrate]

Solve it with the Unitemp reflow device! Achieve rapid heating! No more worries about damage from unexpected temperatures!

Recent circuit boards are equipped with a wide variety of components, including extremely small chip components, large components, as well as module boards and BGA packages. Since each component has a different thermal capacity, by the time the temperature of the larger components rises, it may exceed the heat resistance temperature of the smaller components, potentially causing defects. If such occurrences happen frequently, it could also affect the yield. Our reflow equipment can rapidly increase the temperature on the heating plate and is designed to avoid overshoot, thereby reducing thermal stress on printed circuit boards and mounted components. Additionally, the entire heating plate is automatically controlled to maintain a uniform temperature, which helps minimize temperature variations affecting the target objects, such as circuit boards. *For more details, please refer to the PDF document or feel free to contact us.*

  • Reflow Equipment

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[Equipment Introduction] Reflow Soldering + Nitrogen Generator

[Equipment Introduction] Reflow Soldering + Nitrogen Generator

Supports large substrates! Increases operational efficiency with a high-capacity flux recovery unit.

The "Reflow Soldering + Nitrogen Generator" is a reflow device with precise and high-quality heating performance. It has a wide substrate width range of 50×70 to 400×500 mm, making it capable of handling large substrates. 【Features】 ■ Precise and high-quality heating performance ■ Low power consumption structure ■ Large capacity, high-efficiency flux recovery ■ Insulation design considerate of the working environment *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment

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Airflow device "AJ06 Series"

Airflow device "AJ06 Series"

Ultra-low power consumption that promotes energy saving! Lightweight and compact air flow device.

We would like to introduce the Airflow Device 'AJ06 Series' manufactured by ETC Corporation, handled by Masu Shoji. The lineup includes "AJ06M-8" and "AJ06L-8." They feature a lightweight and compact design with high insulation that takes the working environment into consideration. The power supply is AC200V 3Φ, providing precise and high-quality heating performance. 【Features】 ■ Ultra-low power consumption that promotes energy savings ■ Precise and high-quality heating performance ■ High insulation design that considers the working environment ■ Lightweight and compact *For more details, please refer to the related links or feel free to contact us.

  • Reflow Equipment

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A new technology for non-contact heating implementation using electromagnetic induction: "IH Reflow Technology."

A new technology for non-contact heating implementation using electromagnetic induction: "IH Reflow Technology."

Prototyping is possible! Non-contact soldering that can mount electronic components on low heat-resistant substrates such as PET, fabric, and paper! Achieving damage-free and 100% yield mounting instantly.

"IH Reflow" is a mounting technology that applies IH (induction heating), enabling instant, non-contact mounting of only the necessary parts without physical stress, allowing for damage-free implementation. This technology makes it possible to mount electronic components that are not heat-resistant on low-heat-resistance substrates such as inexpensive, flexible, and stretchable PET, paper, and fabric. Additionally, by applying this technology, it can replace the conventional mounting processes on high-heat-dissipation substrates that typically use lasers or manual soldering, dramatically improving production throughput. Sales of IH Reflow devices, bonding experiments, prototype contracting, and unique contract mounting services based on the core technology "IH Reflow" are also available. 【Features】 - Damage-free component mounting technology for low-heat-resistance and high-heat-dissipation substrates - Heating and mounting using electromagnetic induction - Achieves instant, damage-free, non-contact mounting at specific locations with a yield of 100% - Heating method: Induction heating only at the mounting points (single point to multiple points) - Capable of mounting on low-heat-resistance substrates and high-heat-dissipation boards *For more details, please refer to the PDF materials or feel free to contact us.

  • Processing Contract

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Forced convection compact N2 reflow device 'NRY-520S-5Z'

Forced convection compact N2 reflow device 'NRY-520S-5Z'

Lead-free small-sized mounting board compatible compact N2 reflow device

The "NRY-520S-5Z" is a reflow device designed for electronic device manufacturers, aimed at improving temperature accuracy (in-plane temperature distribution) and soldering under low oxygen concentration. It is suitable for reflowing high-density mounted substrates through an independent upper and lower hot air circulation method that combines forced convection with a rectifying plate. 【Features】 - Clean room compatible, compact design, and energy-saving features - Equipped with five heating zones despite its small size - Capable of setting various temperature profiles - Can also be used for reflowing to form solder balls for BGA and CSP - Peripheral devices including loaders/unloaders and intermediate buffers are also available, etc. *For more details, please download the PDF or contact us.

  • Reflow Equipment

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Reflow device "NRY-101V6W/LU"

Reflow device "NRY-101V6W/LU"

N2 reflow system for solder bump formation compatible with 6.8-inch wafers

The "NRY-101V6W/LU" is an N2 reflow device for bump formation after solder ball mounting or printing. The heating method combines a hot plate and an upper infrared heater. This allows for uniform temperature distribution through direct heat conduction. 【Features】 ■ Integrated loader and unloader design ■ Designed to fit the customer's magazine cassette ■ Handling into the furnace is made easy with a 3-axis clean robot, enabling inline integration with upstream equipment ■ A low-cost type that uses belt conveyor transport without a robot can also be manufactured ■ In-furnace transport is achieved through tact feeding with a walking beam (PAT.P), among other methods *For more details, please download the PDF or contact us.

  • Reflow Equipment

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Reflow device "NRY-103V6W/LU"

Reflow device "NRY-103V6W/LU"

N2 reflow system for forming solder bumps compatible with 200-300mm wafers

The "NRY-103V6W/LU" is an N2 reflow device compatible with 200mm and 300mm printed bumps, which can also function as a wet back device after the plating bump process. The hot plate pins in the preheat zone utilize our unique liftable pins, enabling a two-stage heating temperature profile. (PAT.P) 【Features】 - Heating method combines hot plate and upper infrared heaters - The hot plate employs pin-based heating adapted to wafer warping - Excellent cleanliness within the furnace, and capable of low oxygen concentration (below 100ppm) - In-furnace transport uses our proprietary walking beam (PAT.) for tact feeding - Capable of high-precision transport with excellent cleanliness, among other features *For more details, please download the PDF or contact us.

  • Reflow Equipment

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N2 Reflow Device 'Nj0611M82-RLF'

N2 Reflow Device 'Nj0611M82-RLF'

Introducing the production equipment of VEMS Co., Ltd. compatible with a substrate size of L500×W400!

The "Nj0611M82-RLF" is an N2 reflow device compatible with a substrate size of L500×W400. It features 8 heating zones and 2 cooling zones. Please feel free to contact us when you need assistance. 【Production Process】 1. SMT Line Configuration 2. Assembly Inspection 3. Manual Soldering 4. Assembly and Electrical Testing *For more details, please refer to the PDF document or feel free to contact us.

  • Company：VEMS
  • Price：Other
  • Reflow Equipment

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Testing for the sheet-type plasma reflow device (fluxless reflow) is now open.

Testing for the sheet-type plasma reflow device (fluxless reflow) is now open.

Fluxless wafer bump reflow device. Achieves fine bump reflow without wet processes. Sample demo available. Reflow video posted.

Fluxless reflow in a strong reducing H2 radical atmosphere of damage-free downflow-type surface wave plasma, reducing flux application and cleaning processes, as well as application and cleaning equipment. A completely dry CtoC system. Achieving a short tact reflow process for fine pitch bumps.

  • Other semiconductor manufacturing equipment

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Model 1200 Vacuum and Pressure Reflow Device

Model 1200 Vacuum and Pressure Reflow Device

The Model 1200 tabletop reflow device is an ideal tabletop unit for process development and small-scale production of microelectronics packages.

SST is a global leader providing solutions and equipment for microelectronics assembly processes. We perform high-precision pressure management, including pressurization with vacuum and process gases, and offer solutions for processes such as voidless soldering, brazing, glass sealing, high-density sealing, moisture getter activation treatment, and wafer bonding.

  • SST_5100.jpg
  • SST_3130.jpg
  • SST_518.jpg
  • Bonding Equipment

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