General-purpose epoxy resin for encapsulating electrical and electronic components. Suitable for encapsulating motors, coils, and more.
"TE-7130" is a general-purpose, two-component, heat-curing epoxy resin for the encapsulation of electrical and electronic components.
With a mixing ratio of 100:20, it is easy to handle, and after curing, it becomes an encapsulant that combines high strength and high insulation properties. Its greatest feature is the realization of a low coefficient of linear expansion of 27 ppm/K.
This reduces expansion and contraction due to temperature changes, thereby lowering the risk of crack formation. It is resistant to thermal cycling, ensuring long-term reliability for power devices and electronic components.
[Features]
- Two-component heat-curing epoxy resin (mixing ratio 100/20)
- Low coefficient of linear expansion: 27 ppm/K → strong against thermal cycling, crack suppression
- High insulation properties (dielectric breakdown strength 33 kV/mm, volume resistivity 1×10^16 Ω·cm)
- High strength (flexural strength 141 MPa, flexural modulus 10,000 MPa)
- Low water absorption rate of 0.1% ensures long-term stability
*For more details, the product specification sheet is available for download as a PDF from the link below, or please contact us.
*Samples are also available, so please contact us if needed.