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Resin(100) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Aug 12, 2026～Sep 08, 2026
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Resin Product List

241～270 item / All 310 items

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TE-7820FR3 for semiconductors

TE-7820FR3 for semiconductors

High Tg, flame retardant, improved copper adhesion! Ideal for power device encapsulation.

In the semiconductor industry, particularly in fields that require high reliability, the performance of encapsulation materials for power devices is crucial. To withstand temperature changes and vibrations, and to ensure long-term reliability, excellent heat resistance, flame retardancy, and high adhesion to substrates are essential. TE-7820FR3 has been developed to address these challenges and enhance the performance and reliability of power devices. 【Application Scenarios】 - Power modules - Semiconductor packages 【Benefits of Implementation】 - Improved thermal, electrical, and mechanical performance - Assurance of long-term product reliability

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[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

General-purpose epoxy resin for encapsulating electrical and electronic components. Suitable for encapsulating motors, coils, and more.

"TE-7130" is a general-purpose, two-component, heat-curing epoxy resin for the encapsulation of electrical and electronic components. With a mixing ratio of 100:20, it is easy to handle, and after curing, it becomes an encapsulant that combines high strength and high insulation properties. Its greatest feature is the realization of a low coefficient of linear expansion of 27 ppm/K. This reduces expansion and contraction due to temperature changes, thereby lowering the risk of crack formation. It is resistant to thermal cycling, ensuring long-term reliability for power devices and electronic components. [Features] - Two-component heat-curing epoxy resin (mixing ratio 100/20) - Low coefficient of linear expansion: 27 ppm/K → strong against thermal cycling, crack suppression - High insulation properties (dielectric breakdown strength 33 kV/mm, volume resistivity 1×10^16 Ω·cm) - High strength (flexural strength 141 MPa, flexural modulus 10,000 MPa) - Low water absorption rate of 0.1% ensures long-term stability *For more details, the product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

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TE-7814V for semiconductor packaging

TE-7814V for semiconductor packaging

Improving the reliability of semiconductor devices with high thermal conductivity and high Tg.

In the semiconductor industry, as devices become smaller and more high-performance, ensuring thermal management and long-term reliability has become an important challenge. Encapsulation materials require high thermal conductivity and heat resistance, and it is essential to maximize the performance of the devices. TE-7814V was developed to address these challenges. 【Application Scenes】 - Power modules - Electronic devices - Heat dissipation encapsulation for electronic components that generate heat 【Benefits of Implementation】 - Achieves effective heat dissipation with a thermal conductivity of 2.5W/mK - Ensures reliability in high-temperature environments with a high Tg of 185°C - Low viscosity design allows for compatibility with complex component shapes

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Two-component heat-curing epoxy resin for automotive use TE-7814V

Two-component heat-curing epoxy resin for automotive use TE-7814V

High thermal conductivity 2.5 W/mK × high Tg 185°C high-reliability low-viscosity epoxy resin

In the automotive industry, reliable adhesion of components is essential to achieve both safety and durability. Particularly in areas exposed to high temperatures and vibrations, such as the engine compartment and vehicle structure, the performance of adhesives is crucial. Improper adhesion can lead to component detachment or performance degradation. TE-7814V offers high reliability in the adhesion of automotive parts, featuring high thermal conductivity and excellent heat resistance. 【Application Scenarios】 - Adhesion of engine components - Adhesion of vehicle structural components - Fixing of electronic components 【Benefits of Implementation】 - High adhesive strength - Excellent heat resistance - Assurance of long-term reliability

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Two-component heat-curing epoxy resin for electronic devices TE-7814V

Two-component heat-curing epoxy resin for electronic devices TE-7814V

High thermal conductivity 2.5W/mK × high Tg 185°C high-reliability low-viscosity epoxy resin

In the electronics industry, high insulation is required to ensure the long-term reliability of products. Particularly for electronic components exposed to temperature changes and vibrations, maintaining insulation performance is essential for preserving product performance. Inadequate insulation can lead to component failure or performance degradation. TE-7814V has high insulation properties, ensuring the long-term reliability of electronic devices. 【Usage Scenarios】 - Insulation of electronic devices - Insulation of power modules 【Benefits of Implementation】 - Improved long-term reliability of electronic devices - Maintenance of product performance - Reduced risk of component failure

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High Durability Epoxy Resin for Home Appliances TE-7814V

High Durability Epoxy Resin for Home Appliances TE-7814V

Achieving long-term reliability of home appliances with high thermal conductivity and high Tg.

In the home appliance industry, long-term reliability of products is required, and protecting electronic components, especially those exposed to heat and vibration, is crucial. The TE-7814V addresses these challenges with its high thermal conductivity and high Tg, contributing to the durability of home appliances. 【Usage Scenarios】 - Heat dissipation measures for electronic components prone to heating, such as motors and coils - Protection of electronic devices used in high-temperature environments - Extending the lifespan of products 【Effects of Implementation】 - Suppression of component degradation due to heat - Reduction of product failure risks - Improvement of long-term product reliability

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Two-component heat-curing epoxy resin for home appliances TE-7820FR3

Two-component heat-curing epoxy resin for home appliances TE-7820FR3

High Tg and flame retardant to improve the safety of electrical appliances.

In the home appliance industry, the safety and reliability of products are of utmost importance. Especially for products used in high-temperature environments, flame-retardant materials are essential. In the event of a fire, it is necessary to prevent the spread of flames and protect consumer safety. The TE-7820FR3 is equipped with flame retardancy equivalent to UL94 V-0, enhancing the safety of home appliances. 【Application Scenarios】 - Power units - Motors - Heaters 【Benefits of Implementation】 - Improved safety due to high flame retardancy - Increased product reliability - Enhanced customer satisfaction

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TE-7820FR3 for electronic devices

TE-7820FR3 for electronic devices

High Tg, flame retardant, improved copper adhesion! Enhancing the reliability of small electronic devices.

In the electronics industry, as products become smaller, the high-density mounting of components is advancing, leading to increased thermal and electrical stress. As a result, encapsulants are required to have high heat resistance, flame retardancy, and strong adhesion to copper substrates. TE-7820FR3 addresses these challenges and contributes to the reliability improvement of compact electronic devices. 【Application Scenarios】 - Power modules - Semiconductor packages - High-density mounting boards 【Benefits of Implementation】 - Improved product lifespan due to high heat resistance - Enhanced safety due to flame retardancy - Long-term reliability ensured by improved copper adhesion

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Room temperature short-term curing epoxy resin TE-6011K

Room temperature short-term curing epoxy resin TE-6011K

A two-component epoxy resin that cures in 4 hours at room temperature! The reduction in curing time leads to cost savings.

TE-6011K 2-component fast-curing epoxy resin Features: Cures in 4 hours at room temperature Applications: Insulation and protection of electrical and electronic components 【Specifications (excerpt)】 ■Mixing viscosity: 19,500 (mPa·s) at 25℃ ■Glass transition temperature: 40℃ ■Cured density: 1.65 (water displacement method) ■Mixing ratio R/H: 100/38 ■Curing conditions: 25℃ x 4h

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Impregnating sealant "Resinol 90C"

Impregnating sealant "Resinol 90C"

Leave it to us for gaps of 10μm to 100μm. We seal voids and cavities in powder metallurgy and die casting!

"Resinol 90C" is a sealing agent suitable for filling voids in powder metallurgy and pits in castings and die castings. Due to these voids and pits, powder metallurgy and die casting cannot undergo surface treatment and cannot be used for pressure applications, leading to usage restrictions. By using our impregnation sealing agent, "Resinol 90C," these issues will be resolved. 【Basic Properties】 ■ Material Acrylic resin ■ Heat Resistance -40℃ to 150℃ 【Target Materials】 ■ Powder metallurgy ■ Castings ■ Die castings ■ MIM ■ Pressed powders

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Special synthetic resin "Toughurea"

Special synthetic resin "Toughurea"

Forms a film of over 1mm with a single spray! A special synthetic resin that allows the use of sprayed products in 6 hours.

Tafurea is a special resin that excels in impact resistance, abrasion resistance, weather resistance, chemical resistance, waterproofing, and rust prevention. It can be coated over various materials, including metals, plastics, concrete, and wood. 【Features】 ■ Absorbs shocks due to high elasticity ■ Prevents scratches on products caused by friction ■ Usable with common chemical substances ■ Withstands harsh outdoor environments ■ Prevents moisture intrusion and rust ■ Reduces work time through spray application ■ 0% VOC (volatile organic compounds) content *For more details, please download the catalog or feel free to contact us.

  • Engineering Plastics
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PBT Natural

PBT Natural

Features: A resin material with excellent electrical insulation properties over a wide temperature range, as well as high chemical resistance and abrasion resistance.

"PBT Natural" has excellent electrical properties and insulation over a wide temperature range, making it suitable for electronic device connectors, housings, and more. It has low water absorption and excellent dimensional stability. It is used in EV components, pulley parts, fan parts, and components related to electric vehicle development. 【Features】 ■ Polybutylene Terephthalate resin ■ Excellent electrical properties and chemical resistance ■ High strength and excellent dimensional stability ■ Weak against strong alkalis *Please feel free to contact us for more details about the material.

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Selection Table: Teflon Fluororesin PTFE

Selection Table: Teflon Fluororesin PTFE

Total production from design and manufacturing to construction and service! Introduction of the selection table.

At Nippon Sakas Co., Ltd., the Platech Division conducts a comprehensive operation from the manufacturing of precision plastic parts to bonding, welding, and assembly. This is a selection table for "Teflon Fluororesin PTFE," which excels in chemical resistance, heat resistance, and self-lubrication. It is used in a wide range of applications. 【Features】 ■ Chemical resistance and heat resistance ■ Self-lubrication ■ Used in a wide range of applications ■ Non-absorbent *For more details, please refer to the catalog or feel free to contact us.

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General-purpose potting resin TE-3106 low viscosity/high strength product

General-purpose potting resin TE-3106 low viscosity/high strength product

It is a low viscosity, high strength general-purpose potting resin. Due to the anhydride curing, it is characterized by a long usable time after mixing the two components (approximately 6 to 8 hours).

TE-3106 Two-component heating curing epoxy resin Features: Acid anhydride curing, low viscosity, high strength, crack resistance Applications: Potting for various electronic components ■ Mixing viscosity: 1,800 at 25℃ ■ Flexural strength: 150 (MPa) ■ Recommended curing conditions: 80℃ for 2 hours + 100℃ for 4 hours *For more details, please download the PDF below or feel free to contact us.

  • スクリーンショット 2021-06-16 143946.jpg
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Polystyrene resin "PSJ-Polystyrene G9001"

Polystyrene resin "PSJ-Polystyrene G9001"

Like regular GPPS, it can be molded by injection and extrusion! It is a heat-resistant grade product.

"PSJ-Polystyrene G9001" is a transparent heat-resistant styrene-based copolymer with a Vicat softening temperature approximately 15°C higher compared to high heat-resistant GPPS. Like regular GPPS, it can be processed by injection and extrusion molding. It is recommended for applications that require heat resistance, such as microwave containers. For more details about other products, please contact us. 【Features】 ■ Heat-resistant grade ■ Has heat resistance between GPPS and polycarbonate ■ Approximately 15°C higher Vicat softening temperature compared to high heat-resistant GPPS *For more details, please refer to the PDF document or feel free to contact us.

  • Composite Materials
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[Business Introduction] Processing and Frozen Food Import and Export Business (Export and Consulting)

[Business Introduction] Processing and Frozen Food Import and Export Business (Export and Consulting)

Aiming to be a company that contributes to the local community, we are launching a new business! Assisting with exports to Southeast Asia.

In the small town of Seihin, we assist in exporting excellent food products hidden in the countryside, known as the "JAPAN brand," to Southeast Asia and in the development of new products. Japan has many products that possess the three strengths of the Japan Brand established by our predecessors: "Tasty," "Functional," and "High value." We have a desire to send these excellent Japanese products, which can effectively target overseas markets, to the rapidly growing Southeast Asia, with the aim of producing "100-year companies." 【Export Business Support Service Menu】 ■ Support for developing overseas sales channels ■ Overseas sales agency ■ Trade operations agency ■ Support for creating sales and promotional tools ■ Overseas sales channel development support package *For more details, please refer to the PDF document or feel free to contact us.

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Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Suitable for super engineering plastics with good dielectric properties in a wide frequency range and materials for next-generation (5G) communication devices.

Due to its excellent dielectric properties and high temperature and humidity resistance, "Therplim" can be used in 5G-related materials (copper-clad laminates), CFRP raw materials, and audio equipment components. [Features] ■ Good dielectric characteristics across a wide frequency range, including the millimeter wave region (10GHz 2.7) ■ High heat resistance (Tm323℃/Tg185℃) ■ Good chemical resistance, insoluble in solvents ■ Can be processed from films below 25 μm to large components with a thickness of 100 mm * For more details, please refer to the PDF document or feel free to contact us.

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[New Development] Two-component Heat-Curing Epoxy Resin TE-7000

[New Development] Two-component Heat-Curing Epoxy Resin TE-7000

Fills in detail with low viscosity! A highly reliable epoxy resin that can also be considered as a varnish alternative. Flexible response to work plans with a usable time of 24 hours.

The "TE-7000" is a two-component, heat-curing epoxy resin suitable for sealing applications in electrical and electronic components. Its low viscosity design allows for excellent filling of details and can accommodate complex part shapes. This product has a long pot life of 24 hours (at 60°C), ensuring stable sealing operations while providing ample time for work processes. Additionally, it has a proven track record of passing high-temperature tests at 180 degrees and thermal tests at -40°C and 180°C. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:60) ■ Excellent filling properties and workability due to low viscosity ■ Long pot life of 24 hours (at 60°C) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity > 1×10^16Ω·cm) ■ Flexural strength of 81MPa and flexural modulus of 2,400MPa ■ Low water absorption rate of 0.3% for improved reliability *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

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TE-7172K3 for electronic devices: Balancing insulation and heat dissipation.

TE-7172K3 for electronic devices: Balancing insulation and heat dissipation.

Insulating epoxy resin with room temperature curing, high thermal conductivity, and flexibility.

In the electronics industry, as product miniaturization and high performance progress, ensuring insulation performance while addressing heat dissipation has become an important challenge. In particular, densely mounted electronic components have a high risk of performance degradation and failure due to heat generation, necessitating reliable insulating materials. TE-7172K3 achieves both high insulation and thermal conductivity, addressing these challenges. 【Application Scenarios】 - Insulation of electronic components - Electronic devices requiring heat dissipation measures - Areas where stress relief is needed 【Benefits of Implementation】 - Reduction of failure risk due to insulation defects - Extension of product lifespan through improved heat dissipation performance - Prevention of cracks in substrates and modules

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Stability confirmation test of the electrical property modification of composite olefin resin.

Stability confirmation test of the electrical property modification of composite olefin resin.

This is the test result confirming the stability of the electrical properties modification of composite olefin resin.

Olefin resins, which are non-polar plastics made only from carbon and hydrogen, are represented by polyethylene (PE) and polypropylene (PP), both of which are produced in large quantities as materials through addition polymerization and are utilized in various molded products that benefit our daily lives. PE is adjusted for density and undergoes post-processing stretching treatments to change its crystallinity for different applications; generally, it is soft and commonly known for low-temperature injection molded products and packaging films. In contrast, PP, with a melting point of 165°C and a density of 0.9, has high crystallinity and excellent chemical resistance, as well as toughness that allows it to withstand long-term use under conditions of over 100°C with applied pressure. A wide variety of durable products are made from it, ranging from injection molded items like large containers to extruded products such as various industrial functional films and bags, as well as hollow molded products like bottles. For more details, please contact us or refer to the catalog.

  • Static electricity eliminator
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Results of stability confirmation tests on the electrical property modification of composite olefin resins.

Results of stability confirmation tests on the electrical property modification of composite olefin resins.

Results of stability confirmation tests for the electrical property modification of composite olefin resins.

Olefin resins, which are non-polar plastics made only from carbon and hydrogen, are represented by polyethylene (PE) and polypropylene (PP). Both are produced in large quantities as materials through addition polymerization and are used in various molded products that benefit our daily lives. PE is adjusted for density and undergoes stretching treatment in post-processing to change its crystallinity for different applications; generally, it is soft and commonly known for low-temperature injection molded products and packaging films. In contrast, PP, with a melting point of 165°C and a density of 0.9, has high crystallinity and excellent chemical resistance. It is not only tough enough to withstand prolonged use at temperatures above 100°C under pressure but also produces a wide variety of durable products, ranging from injection molded items like large containers to extruded functional films and bags for various industries, as well as hollow molded products like bottles. For more details, please contact us or refer to our catalog.

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Injection molding of high-performance resins such as PEEK, recycled resins, and biodegradable resins on a tabletop.

Injection molding of high-performance resins such as PEEK, recycled resins, and biodegradable resins on a tabletop.

Wide-ranging injection molding of resins, including thick-walled molding of PEEK, is possible.

We accommodate a variety of thermoplastic resins, including general-purpose resins, high-performance resins, eco-plastics, and special resins such as CIM, CFRTP, and GFRTP. We lower the barriers for prototyping and accelerate research and development. Additionally, we enable the recycling and utilization of plastic waste, contributing to resource circulation. For more details about the resins we offer, please refer to our catalog and website. Related link - https://www.centinno.co.jp/

  • Injection Molding Machine
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Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0220FR

Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0220FR

UV-curable epoxy acrylate that balances transparency and high strength. Suitable for applications requiring reliability equivalent to UL94 V-0.

"TRU-0220FR" is a one-component UV-curable epoxy acrylate resin developed for the coating of electronic components. It allows for rapid curing under UV irradiation from a metal halide lamp (1,500mJ/cm²), contributing to improved productivity in mass production processes. This product features low viscosity (2,100mPa·s), making it easy to work with and suitable for filling and coating complex part shapes. It is flame-retardant (equivalent to UL94 V-0 at 5mm thickness) and can be adapted for use in fields where safety is a concern. It balances transparency and high hardness, with a low water absorption rate of 0.3%, providing excellent moisture and heat resistance. Suitable applications include electronic component coatings, transparent protective materials, and areas requiring heat resistance and flame retardancy. 【Features】 ■ One-component UV-curable epoxy acrylate resin ■ High reactivity with rapid curing (UV: 1,500mJ/cm²) ■ Excellent workability due to low viscosity *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

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300℃ High Heat Resistant Resin TE-2107

300℃ High Heat Resistant Resin TE-2107

It is a heat-curing acrylic resin with high solder heat resistance of over 300℃.

TE-2107 is a heat-curable acrylic resin with high heat resistance. 【Features】 ■ High peel strength ■ High solder heat resistance (over 300℃) ■ High toughness resin ■ Non-silicone, non-fluorine type 【Applications】 ■ Adhesive for bonding sheets for FPC (Flexible Printed Circuit Boards) ■ Components requiring high heat resistance *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
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Impregnating sealant "5100"

Impregnating sealant "5100"

Seal the gaps inside the electric wires and wire harnesses. A new sealing method to replace O-rings and potting.

"5100" is a sealant suitable for sealing gaps inside electric wires, wire harnesses, and similar applications. It maintains flexibility even after curing, making it suitable for sealing gaps in molded parts of connectors and sensors. Have you ever experienced oil or humid air leaking through gaps inside a wire harness? Or have you encountered situations where the insulation was damaged during use, allowing water to enter? In such scenarios, our impregnating liquid "5100" demonstrates high reliability. Additionally, "5100" retains high flexibility even after curing. Due to the differences in thermal expansion coefficients between resin and metal molded products, gaps can significantly shift when subjected to thermal shock. Even in such cases, "5100" moves with the shifting gaps, helping to minimize their occurrence. 【Basic Properties】 ■Material Acrylic resin ■Heat Resistance -40℃ to 150℃ 【Target Materials】 ■Fluoropolymer wires ■Cross-linked polyethylene wires ■Super engineering plastics such as PPS and PEEK ■Engineering plastics such as PA6, PA66, POM, and PBT

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Epoxy Resin Hardener Q&A Course for Learning from the Basics

Epoxy Resin Hardener Q&A Course for Learning from the Basics

Epoxy Resin Hardener Q&A Course for Beginners

8. Characteristics of Polyamide Amine Curing Agents 9. Others 10. Amine Curing Agents Applicable to Various Uses of Epoxy Resins 10-1 Lining 10-2 Coatings 10-3 Reinforcement for Civil Engineering and Construction Structures 10-4 Adhesives 10-5 Electrical Insulation Materials 10-6 Tooling 11. Q&A on Epoxy Curing Agents Q1: Estimated Demand for Curing Agents for Epoxy Resins by Application Q2: Estimated Demand for Epoxy Resin Curing Agents Q3: Selection Method for Curing Agents by Performance Q3-1 Adhesives Q3-2 Chemical Resistance Q3-3 Heat Resistance Q3-4 Electrical Insulation Q3-5 Heat Resistance Q3-6 Moisture and Water Resistance Q3-7 Flexibility Q3-8 Impact Resistance Q4: Causes of Various Troubles Q4-1 Causes of Insufficient Curing Q4-2 Method for Determining Insufficiently Cured Areas Q4-3 Causes of Bubble Formation Q4-4 Causes of Resin Cracking After (or During) Curing Q4-5 Causes of Delamination After (or During) Curing 12. Examples of Epoxy Resin Performance: Photos

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UV-curable resin, high glass transition temperature type TRU-0251

UV-curable resin, high glass transition temperature type TRU-0251

It is a cationic UV-curable resin. It has a Tg of 150°C and excellent heat resistance.

TRU-0251 Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 10,500 (mPa·s) at 25°C ■ Glass transition temperature: 150°C ■ Shear adhesion strength: Substrate failure GL/GL at 25°C Substrate failure GL/GL after 1,000 hours at 85°C/85% RH ■ Recommended curing conditions: UV metal halide lamp 3,000 mJ/cm²

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Water-absorbing resin "Aqua Keep"

Water-absorbing resin "Aqua Keep"

A resin that absorbs 1000 times its own weight in water! It is used in diapers, various hygiene products, and industrial products.

"Aqua Keep" is a highly absorbent resin that our company has been researching and developing for many years. By adding meticulous design tailored to user requirements to a resin that absorbs water up to 1000 times its own weight, we have incorporated various functions. Utilizing this functionality, it is used in products such as disposable diapers, various hygiene products, and industrial products, receiving high quality evaluations from users. [Features] - A resin that absorbs water up to 1000 times its own weight - Various functions added through meticulous design tailored to user requirements - High quality evaluations from users - Produced in Japan, Singapore, France, and South Korea, and used worldwide *For more details, please refer to the related link page or feel free to contact us.

  • Other polymer materials
  • Resin

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UV-curable resin, high thixotropic type TRU-0250K

UV-curable resin, high thixotropic type TRU-0250K

Cationic UV-curable resin, providing high thixotropy.

TRU-0250K Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 25℃ 158,000 (mPa·s) ■ Glass transition temperature: 125℃ ■ Shear adhesion strength: Substrate failure GL/GL 25℃ Substrate failure GL/GL 85℃/85℃RH after 1000h ■ Recommended curing conditions: UV metal halide lamp 3,000mJ/cm²

  • Other polymer materials
  • Other electronic parts
  • Resin

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