Rework Equipment Product List and Ranking from 17 Manufacturers, Suppliers and Companies

Last Updated：Oct 22, 2025 Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Rework Equipment Manufacturer, Suppliers and Company Rankings

Last Updated：Oct 22, 2025 Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

デンオン機器 Tokyo//Industrial Electrical Equipment
ビオラ Fukushima//Electronic Components and Semiconductors
ケイ・オール Tokyo//Manufacturing and processing contract
4 メイショウ Tokyo//Industrial Machinery
5 ダイナテックプラス Chiba//Industrial Machinery

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Rework Equipment Product ranking

Last Updated：Oct 22, 2025 Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

"BGA Rework / BGA Reballing" *Available from just one unit! ビオラ
Rework System "RD-500S III" デンオン機器
Skill-less rework device MS9000SE II Series メイショウ
4 Technical Document "Underfill BGA Rework Technology" ケイ・オール
5 LGA implementation and rework ケイ・オール

Rework Equipment Product List

16～30 item / All 49 items

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Rework System "SD-3000II"

With the rework system for parts repair/repair/re-implementation! No failures with easy operation! SMT rework system using spot air method.

For rework systems, choose Denon equipment. The "SD-3000II" can handle the removal of various shapes such as QFP, SOP, BGA, and connector DIP without changing the nozzle head, and since it uses a non-contact method, there are no troubles. It has a built-in timer, allowing anyone to use it with confidence. The trace width of the nozzle in the X-Y direction can be set arbitrarily within the range of 0 to 50mm. 【Features】 ○ Supports all SMT up to 50mm square without changing the nozzle head ○ Can also remove connectors and other components ○ Employs a timer to prevent damage to the board and surrounding areas due to overheating ○ Automation with a microprocessor enables rework operations without failures ○ Lightweight and compact For more details, please contact us or download the catalog.

Company：デンオン機器
Price：Other

Circuit board processing machine
Other processing machines

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Free on-site demo of the rework device/rework system 'RD-500SV'!

Compact model of rework equipment/rework system. All-in-one type rework system for all SMT components with this one device!

For rework systems, choose Denon Equipment. The 'RD-500SV' is a compact model of a rework system equipped with a variety of functions and highly flexible profiling capabilities. Advanced rework can be flexibly addressed with individual settings. One-click settings can be made according to the device. Supports QFN, CSP, BGA, SMT, and 0402! ★ Currently, we are offering free on-site demonstrations! ★ If you are interested, please apply below. We can accommodate nationwide. 【Features】 ■ Automatically creates profiles based on three reference points, including the surface of the board, to avoid defects and warping (can also be automatically created with just one bump point). ■ Equipped with an easy select mode that allows for one-click settings for special configurations for POP, QFN, QFP, etc. ■ Wide compatibility from large industrial boards to small boards, including 0402/0603 components. ■ Login mode separates work permissions to reduce accidents caused by operational errors. 【Parts Repair/Rework/Re-implementation】 Available. *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

Company：デンオン機器
Price：Other

Circuit board processing machine
Other processing machines

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Substrate Market Product Introduction

We offer a variety of products, including an all-in-one type rework system.

We would like to introduce the "Circuit Board Market Products" handled by Okuda Trading Co., Ltd. We offer a wide range of products, including Denon equipment's rework devices "RD-500SV/RD-500V," large industrial circuit boards, small circuit boards, and 0402 components, as well as various products such as "connectors" and "thermocouples." You can choose according to your needs. 【Product Lineup】 ■ Denon Equipment Rework Devices 　・ RD-500SV 　・ RD-500V ■ Connectors ■ Thermocouples *For more details, please refer to the PDF document or feel free to contact us.

Company：奥田貿易
Price：Other

Other Connectors

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[Work Example] WLCSP Rework

Supporting everything from tiny components to large BGAs! Introducing our achievements in WLCSP (Wafer Level Chip Size Package) rework.

Here is an introduction to a case where we received a request for WLCSP rework. WLCSP (Wafer Level Chip Size Package) is a package size equivalent to a bare chip called a die, and is considered one of the smallest levels in semiconductors. The requested component also has an outer dimension of 1.5mm and a pitch of 0.4mm. This time, we replaced the part that had been coated with a preservative, ensuring that there were no remnants left behind during the work. [Case Overview] ■ Content: Replacement of the part coated with a preservative ■ Outer Dimension: 1.5mm ■ Pitch: 0.4mm *For more details, please download the PDF or feel free to contact us.

Company：ヒガシ電子工業
Price：Other

Chip type LED

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BGA Rework [Printed Circuit Board]

We will accommodate from one piece!

"BGA rework" requires high-precision equipment and advanced technology, and our company has established that environment. ★ We can handle from one piece, one point. ★ Please consult us before giving up. ★ We will assist in solving your company's problems. * Please rest assured that we conduct X-ray inspections for all units. * For more details, please refer to the PDF materials or feel free to contact us.

Company：シライ電子工業 P板開発サービス統括部
Price：Other

Visual Inspection Equipment
Printed Circuit Board
Other electronic parts

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BGA rework of Aion Electronics

We will assist you with work related to components that cannot be soldered with a soldering iron [BGA, LGA, QFN].

At Aion Electronics, we offer "BGA Rework" services. We generally complete work the day after the board is provided (shipping and delivery). In urgent cases, same-day service is also available. With over 10 years of experience, we have a proven track record and have received high evaluations from our customers. If you have any work related to "BGA, LGA, QFN" such as assembly, replacement, or reballing, please feel free to contact us. 【Features】 ■ Extensive experience ■ Quick turnaround ■ No initial costs required ■ Free use of stock metal masks ■ Assistance with cost reduction and schedule shortening during design changes *For more details, please refer to the PDF document or feel free to contact us.

Company：アイオン電子
Price：Other

Other contract services

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Infrastructure large board compatible rework device MS9000XL

【Support for Large Multi-Layer Weight Boards】 This is a rework device with a proven track record for large boards used in servers and base stations aimed at the next generation Beyond 5G.

Based on the matured mechanisms developed in the current model MS9000SE, we are introducing the new Quattro Views, which will accommodate larger and multi-layered substrates as well as large components. 1. Support for large multi-layer substrates and large components - Supported substrate size and weight: from 400x500mm, maximum 5kg to 650x700mm, maximum 10kg - Supported component size: from maximum 50mm square to 150mm square 2. New introduction of Quattro Views functionality - When mounting and removing large components, the screen for aligning the substrate pattern with the bump positions of the components now allows for easy verification by enlarging and displaying the four corners of the component on a single screen (four-split screen). 3. Even more user-friendly - The child positioning alignment function (Visual Move) realized in the MS9000SE will remain, and we plan to incorporate an evolved and advanced automatic pattern matching function in the future. We will gradually expand and develop the system to achieve an automatic rework system in the future.

Company：メイショウ
Price：Other

Other mounting machines

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Rework Device SUMMIT Series

Large substrate compatible rework device SUMMIT. It minimizes substrate warping with advanced temperature control.

A high-performance SMD/BGA rework station that minimizes thermal stress on the implemented components and achieves a highly reproducible heating profile. It demonstrates its true value particularly in the rework of large substrates, high thermal dissipation substrates that are difficult to heat, and high-value-added assembly substrates.

Company：シンアペックス
Price：Other

Other mounting machines

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Technical Document "Underfill BGA Rework Technology"

Can also cooperate in criminal investigations!

We can collaborate using underfill BGA rework technology. We can handle everything from the removal of underfill and coated components (such as BGA and CSP) to reballing, replacement, and reinstallation. The cured underfill material seals the BGA, significantly improving its strength compared to standard BGAs, and while its effectiveness is tremendous, the rework tasks such as removal or component replacement are more challenging than typical rework processes. At K-All, we have worked on methods and technical research to ensure that rework can be performed even on devices with various underfill materials applied. We can handle everything from component removal to reballing and replacement reinstallation. Rework and reballing are also possible for BGAs and CSPs that have undergone underfill and coating treatment. We can replace solder balls on BGAs and CSPs from lead-free to eutectic. We maintain over 5,000 types of masks for rework. ● For more details, please download the catalog or contact us.

Company：ケイ・オール
Price：Other

others

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High-Difficulty Implementation and Rework [Case Study Introduction]

Supports high-density, ultra-miniaturized components! Capable of handling high-difficulty assembly and rework.

At Kei All, we are capable of handling high-difficulty implementations and reworks. Recently, there has been a significant increase in components such as leads and thermal pads. These types of components can be very difficult to rework due to their shape and the configuration of the circuit board, as they tend to be less susceptible to heat. Rework technology is one of Kei All's proud strengths. We are continuously honing our skills to address high-difficulty components, which have been increasing in number due to the miniaturization and high density of parts. 【Features】 ○ Support for high-density, ultra-miniature components such as small camera modules and fine-pitch 0.3mm devices ○ Capability for high-difficulty implementations and reworks ○ Continuous technical training and skill development For more details, please contact us or download the catalog.

Company：ケイ・オール
Price：Other

Other contract services

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[Exchange/Installation/Removal] High-quality BGA rework

BGA exchange, installation, and removal services available! We have received voices of joy.

"BGA rework" refers to the process of partially heating BGA devices on completed circuit boards using specialized rework machines, tailored to specific needs. At K-All, we can handle both eutectic and lead-free soldering, and we have received positive feedback from many customers. We can perform work tailored to customer requests and the condition and symptoms of the circuit board. 【Features】 ■ Stable cleaning operations for circuit boards and removed devices ■ Cream solder supply (printing and coating) technology ■ Support for 0402 chips and micro-sized packages ■ Compatibility with large and multilayer circuit boards ■ Ability to accommodate a wide range of pitches, including special pitches *For more details, please refer to the PDF materials or feel free to contact us.

Company：ケイ・オール
Price：Other

Contract manufacturing

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High difficulty implementation and rework.

Supports high-density and ultra-miniaturized components such as fine pitch 0.3mm devices!

Rework technology is a point of pride for K-Oll. We are continuously honing our skills to handle high-difficulty components, which have seen an increase in implementation due to the miniaturization and high density of parts in recent years. This service is aimed at those who have concerns such as "I want to remove it, but the difficulty is high, and I am looking for a company that can rework high-difficulty components." 【Examples】 ■ I selected a BGA with a narrow pitch but am struggling to implement it. ■ A prototype board for SMT products with shield terminals (CN/LGA) is not functioning at all, and I want to replace the CN and reuse the LGA. *For more details, please refer to the PDF document or feel free to contact us.

Company：ケイ・オール
Price：Other

Contract manufacturing

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BGA, CSP implementation, rework

Stable quality through process management

With over 15 years of experience, we handle printing inspection, full ball inspection, and X-ray inspection. Additionally, we replace components using rework machines without causing any damage. For more details, please contact us or download the catalog.

Company：レシップ電子
Price：Other

Technical and Reference Books

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Biola Corporation - Introduction of Main Equipment

Possesses lead-free compatible dynamic IR rework systems, among others.

We would like to introduce our company's "main equipment" that performs general electronic device repairs as well as BGA repair and rework. The "HR600" is equipped with a super high-efficiency hybrid heater, which is an evolution of the IR heater, and features an automatic component placement function through image processing, enabling fully automated rework operations. The modular type IR rework system "IR650A" supports safe rework operations in a lead-free environment and can handle a wide range of applications from large lead-free boards with high thermal capacity to delicate mobile phone boards and small PC boards, allowing for safe rework operations with simple operating procedures. Additionally, we possess lead-free compatible rework systems like the "IR550A," which guarantees uniform heating that was difficult with traditional hot air methods, and the X-ray observation device "FX-300tRX" with CT functionality. 【Main Equipment】 ■ HR600 Fully Automated Rework System ■ IR650A Rework System ■ IR550A Rework System ■ Hybrid Rework System ■ X-ray Observation Device FX-300tRX with CT Functionality *For more details, please refer to the PDF document or feel free to contact us.

Company：ビオラ
Price：Other

X-ray inspection equipment
Printed Circuit Board
Circuit board design and manufacturing

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BGA rework

If it's about BGA rework, leave it to us! We will introduce the work process.

Our company performs "BGA Rework and Reballing" using IPC-recommended IR rework equipment (7 units). "BGA Rework" refers to the process of removing a BGA mounted on a circuit board and installing a new BGA. The process involves removing the BGA from the circuit board, cleaning the solder left on the pads (lands) of the circuit board, applying flux or solder paste, placing the BGA, heating it with an IR heater, and joining the solder balls. Finally, the soldering condition is checked using an X-ray inspection machine. If you need BGA rework, please leave it to us. We have a track record of reworking over 100,000 units of BGA with pitches ranging from 0.3 to 1.27 mm. We are here to assist in rescuing discarded circuit boards. 【Process】 ■ Removal: Remove the BGA from the circuit board ■ Cleaning: Remove the solder left on the pads (lands) of the circuit board ■ Placement: Apply flux or solder paste, then place the BGA ■ Heating: Heat with an IR heater to join the solder ■ X-ray Inspection: Check the soldering condition with an X-ray inspection machine *For more details, please refer to the PDF document or feel free to contact us.

Company：ビオラ
Price：Less than 10,000 yen

Circuit board design and manufacturing
Contract manufacturing

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