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Substrate(IGBT) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
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Substrate Product List

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[Market Research Report] Global Market for Automotive IGBT and SiC; China Market

[Market Research Report] Global Market for Automotive IGBT and SiC; China Market

Global and China Automotive IGBT and SiC Research Report, 2022

According to a certain estimate, approximately 1.69 billion yuan worth of automotive SiC substrates will be needed in China in 2022. Due to the growth of the new energy vehicle market and the expansion of SiC product adoption, the market size for automotive SiC substrates in China is expected to reach 12.99 billion yuan by 2025, with a projected annual average growth rate of 97.2%. SiC substrates are increasingly replacing many Si-based IGBTs for automotive applications. Based on the cost structure of SiC devices, the market for SiC devices for new energy vehicles in China is forecasted to reach 28.24 billion yuan by 2025. This report investigates and analyzes the global and Chinese automotive IGBT and SiC markets, providing the latest information on the overview, market analysis, key companies, and more.

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Special Printed Circuit Board "Metal Substrate"

Special Printed Circuit Board "Metal Substrate"

Metal materials can be selected from aluminum and copper! Utilizing thermal conductivity to enhance thermal diffusion.

A "metal substrate" is a printed circuit board that enhances thermal diffusion by utilizing the thermal conductivity of metal. Metal materials can be selected from aluminum or copper, and when using a copper core substrate, through-hole conduction with the copper core is also possible, allowing for applications such as ground and thermal conduction through-holes. As a common heat dissipation method, metal base substrates dissipate heat through the base metal on the back via heat sinks or enclosures, while metal core substrates can be mounted on the circuit side of the board or machined to expose the base metal, allowing contact with heat sinks or enclosures for heat dissipation. 【Features】 ■ Enhances thermal diffusion by utilizing the thermal conductivity of metal ■ Two types: metal base substrate and metal core substrate ■ Metal materials can be selected from aluminum or copper ■ Through-hole conduction with the copper core is possible when using a copper core substrate *For more details, please refer to the PDF document or feel free to contact us.

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Printed circuit board, metal substrate

Printed circuit board, metal substrate

Metal core substrate with excellent heat dissipation and heat resistance.

By machining the substrate to expose the metal core and directly mounting heat dissipation components such as heat sinks, it is possible to efficiently release the heat from components that operate at high temperatures to the outside.

  • Printed Circuit Board

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Metal matrix composite substrate Baseplate

Metal matrix composite substrate Baseplate

High thermal conductivity, low expansion, high rigidity, strong bonding, good weldability.

AlSiC substrates are widely used in equipment equipped with high-power IGBT modules due to their excellent thermodynamic and mechanical properties.

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