Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
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We provide custom structure MBE/MOCVD epitaxial growth on compound semiconductor epitaxial InP substrates.
We provide custom structure MOCVD epitaxial growth on GaAs substrates ranging from 2 inches to 6 inches. We offer comprehensive services for GaAs epitaxial substrates to companies, universities, and scientific research institutions, including epitaxial structure design, epitaxial materials, and testing analysis.
64-Channel Latching or Momentary Relay Board with Built-in-Test
The VME-2210 provides 64 One Form C (SPDT) contacts to the user via two 96-pin DIN connectors. These relays are the magnetic latching type which means that, once a contact is set it will remain set (even if power is removed from the relay) until it is reset.
LTCC substrate
LTCC stands for Low Temperature Co-fired Ceramics, which refers to low-temperature sintered ceramics. The low firing temperature allows the use of metals with low resistance as conductors, making it ideal for high-frequency applications due to its low loss. Its ease of multilayering and flattening, along with minimal shrinkage variation, enables high-precision and high-density mounting. By using DPC (Direct Plating Copper), it can also be utilized in applications that require high thermal conductivity and excellent heat dissipation. Thus, LTCC is expected to be used in various fields such as circuit boards and semiconductor packages.
Ion migration risk is reduced! Insulation substrate for power modules.
The "DBC substrate (Direct Bonded Copper)" is an insulating substrate for power modules that can reduce the risk of ion migration. In the manufacturing of thick copper insulating substrates, conventional technology uses Ag bonding materials containing active metals such as titanium for the bonding of copper and ceramics. However, when high voltage is applied in a high humidity environment after pattern formation, the silver contained in the bonding material can grow in spots or protrusions between the electrodes, posing a risk of short-circuiting due to ion migration. Our DBC substrate reduces the risk of ion migration by bonding copper and ceramics without silver, significantly improving the reliability as an insulating substrate for power modules. 【Features】 ■ Excellent heat dissipation and heat resistance ■ Excellent electrical insulation ■ High strength ■ Low thermal expansion ■ Excellent wetting and solderability *For more details, please refer to the PDF document or feel free to contact us.
You can freely choose the layer composition according to your needs! Customization is also possible for various specifications of the substrate!
"Metal substrates" are high thermal conductivity substrates designed to efficiently conduct and dissipate heat generated by LEDs and power semiconductors to enclosures or heat sinks. They utilize the thermal conductivity of the base or core metal. The layer composition can be freely selected depending on the application. It is also possible to customize various specifications of the substrate, such as the thickness and type of base metal, the thermal conductivity of the insulation layer, and the thickness of the pattern copper, according to the purpose. [Features] ■ The layer composition can be freely selected depending on the application - Metal base substrate - Multi-layer metal base substrate - Metal core substrate (Aluminum) - Metal core substrate (Copper) ■ Customization of various specifications of the substrate is possible *For more details, please refer to the PDF document or feel free to contact us.
Easy measurement just by connecting to the terminal block/thru-hole! Accelerate the creation of IoT devices!
The "ADRSZRE" is a rotary encoder expansion board exclusively for the Raspberry Pi Zero. By simply connecting a rotary encoder to the terminal block/thru-hole, measurement can be easily performed, accelerating the creation of IoT devices. Additionally, by conducting measurements with a PIC microcontroller, it prevents the loss of pulses from high-pulse rotary encoders. 【Features】 ■ Compact "pHAT" size ■ High-precision measurement ■ Built-in high-performance PIC microcontroller considering real-time capabilities ■ Equipped with LEDs to visualize operating status *For more details, please refer to the PDF document or feel free to contact us.
It is suitable for high-resolution, high-speed transmission modules.
The "iM1427" is a simplified signal generation board with eDP (embedded Display Port/5.4G) interface, compatible with modules for Ultra books and Tablets, and includes pattern editing software for eDP output. This board has two DisplayPort outputs, allowing for simultaneous lighting of two panels, thereby expanding the range of inspection and evaluation methods. 【Features】 ■ Includes software for editing lighting patterns and timing ■ Allows pattern creation and timing settings to match the testing environment conducted by the customer *For more details, please download the PDF (English version) or feel free to contact us.
128-bit High-Voltage Digital Input Board
VME-1129 128-bit High-Voltage Digital Input Board with Built-in-Test and Input Filter. This product complies with the VMEbus specification (ANSI/IEEE STD 1014-1987, IEC 821 and 297), with the following mnemonics: A24:A16: D32/D16/D08 (EO): Slave:39/3D: 29/2D Form Factor: 6U
We consistently carry out everything from crystal growth of single crystal sapphire to cutting, grinding and polishing, PSS processing, GaN epitaxial growth, and special processing!
In the doujin industry, we mainly provide sapphire materials using the Kyropoulos method. Our sapphire substrates are produced in domestic factories as well as through contract manufacturing with reputable overseas manufacturers.
Over 10 years of manufacturing experience for substrates for thermoelectric modules (Peltier elements). For power devices, solid-state relays (SSR), and more!
This is an insulating substrate for heat dissipation, which has a copper circuit board bonded to an alumina ceramic substrate using the DCB (Direct Copper Bond) method. *DCB (Direct Copper Bond) method refers to the technique of bonding a copper circuit board to a ceramic substrate through eutectic reaction. **Features** - Over 10 years of manufacturing experience for substrates used in thermoelectric modules (Peltier elements). - Manufactured at a 100% wholly-owned subsidiary in China. - Options for alumina ceramic white boards from Japan, Germany, or China. - The ceramic substrate can flexibly accommodate various external dimensions through mold processing, laser processing, etc. - The ceramic white board and copper plate are bonded using in-house equipment, and copper plating processes such as etching are applied before shipment. - The surface of the copper circuit can be treated in various ways, including untreated, Ni plating, and Ni + Au plating. *For more details, please contact us or download the PDF.*
