Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
1～15 item / All 39 items
LEX Zero Thermal Expansion Material CTE = 0 (Zero)
Providing Materials and fabrication services Both Casted and Forged materials available 3D Additive Manufacturing service A variety of product line up from Zero expansion. Temperature range: -269 to 350 degree Celsius (selectable from product lineup)
We provide custom structure MBE/MOCVD epitaxial growth on compound semiconductor epitaxial InP substrates.
We provide custom structure MOCVD epitaxial growth on GaAs substrates ranging from 2 inches to 6 inches. We offer comprehensive services for GaAs epitaxial substrates to companies, universities, and scientific research institutions, including epitaxial structure design, epitaxial materials, and testing analysis.
For selective soldering equipment! Detecting ground connection pins that require preheating time.
"Freedom" is a program creation system that generates soldering programs based on CAD data standards, automatically optimizing preheating/spray time and soldering paths. It automatically selects nozzle diameter and operation from the board layout information. It can automatically check for interference based on the clearance between the nozzle and surrounding components. 【Features】 ■ Soldering path optimization ■ Profile creation ■ Component interference check ■ Component library function *For more details, please refer to the PDF document or feel free to contact us.
64-Channel Latching or Momentary Relay Board with Built-in-Test
The VME-2210 provides 64 One Form C (SPDT) contacts to the user via two 96-pin DIN connectors. These relays are the magnetic latching type which means that, once a contact is set it will remain set (even if power is removed from the relay) until it is reset.
![Development board for module [SOM-DB5830]](https://image.mono.ipros.com/public/product/image/9af/2000391990/IPROS28344158871940003565.jpeg?w=280&h=280)
Development board for COMExpress R3.0 Type 6/10 module.
Development board for COMExpress R3.0 Type 6/10 modules ● Expansion: PCIe x16, PCIe x4 ● Display types: VGA, LVDS / eDP, HDMI / DP ● ATX form factor compatible with both ATX and AT power supplies ● Compatible with COM Express Basic / Compact / COM-Ultra modules ● Development board compliant with PICMG COM.0 R3.0 Type 6 pin-out
LTCC substrate
LTCC stands for Low Temperature Co-fired Ceramics, which refers to low-temperature sintered ceramics. The low firing temperature allows the use of metals with low resistance as conductors, making it ideal for high-frequency applications due to its low loss. Its ease of multilayering and flattening, along with minimal shrinkage variation, enables high-precision and high-density mounting. By using DPC (Direct Plating Copper), it can also be utilized in applications that require high thermal conductivity and excellent heat dissipation. Thus, LTCC is expected to be used in various fields such as circuit boards and semiconductor packages.
Optimize the soldering program based on CAD data! Software to control the equipment.
"Freedom" is a program creation system for selective soldering equipment. By setting the pins that connect to the ground layer, it automatically adjusts the nozzle's operation and speed considering the required heat amount. When soldering with multiple devices, it can automatically allocate tasks to ensure uniform takt time for each device. It is equipped with a check function and features aimed at reducing data creation time and processing time. Additionally, our company will be exhibiting at the 38th "Internepcon Japan Electronics Manufacturing and Assembly Exhibition" held at Tokyo Big Sight. We sincerely look forward to your visit. [Benefits] ■ Error checking of nearby components before processing is possible ■ Shortening of program creation time by accumulating component information ■ Automatic setting of optimal soldering routes to reduce processing time *For more details, please refer to the PDF materials or feel free to contact us.
Ion migration risk is reduced! Insulation substrate for power modules.
The "DBC substrate (Direct Bonded Copper)" is an insulating substrate for power modules that can reduce the risk of ion migration. In the manufacturing of thick copper insulating substrates, conventional technology uses Ag bonding materials containing active metals such as titanium for the bonding of copper and ceramics. However, when high voltage is applied in a high humidity environment after pattern formation, the silver contained in the bonding material can grow in spots or protrusions between the electrodes, posing a risk of short-circuiting due to ion migration. Our DBC substrate reduces the risk of ion migration by bonding copper and ceramics without silver, significantly improving the reliability as an insulating substrate for power modules. 【Features】 ■ Excellent heat dissipation and heat resistance ■ Excellent electrical insulation ■ High strength ■ Low thermal expansion ■ Excellent wetting and solderability *For more details, please refer to the PDF document or feel free to contact us.
You can freely choose the layer composition according to your needs! Customization is also possible for various specifications of the substrate!
"Metal substrates" are high thermal conductivity substrates designed to efficiently conduct and dissipate heat generated by LEDs and power semiconductors to enclosures or heat sinks. They utilize the thermal conductivity of the base or core metal. The layer composition can be freely selected depending on the application. It is also possible to customize various specifications of the substrate, such as the thickness and type of base metal, the thermal conductivity of the insulation layer, and the thickness of the pattern copper, according to the purpose. [Features] ■ The layer composition can be freely selected depending on the application - Metal base substrate - Multi-layer metal base substrate - Metal core substrate (Aluminum) - Metal core substrate (Copper) ■ Customization of various specifications of the substrate is possible *For more details, please refer to the PDF document or feel free to contact us.
"Hot melt molding," which is increasingly being adopted for waterproofing and insulating sealing of substrates and electronic components. We are offering a sample of an LED substrate sealed with hot melt molding for free.
We will provide a sample of a 20×20mm substrate (with LED) molded and sealed with amber/black polyamide-based hot melt free of charge. Please feel free to check the texture in person. Additionally, a movie of the production of this sample is currently available on the YouTube video below. If you would like a sample, please do not hesitate to contact us. What is "hot melt molding"? It is a sealing method that uses a solvent-free, one-component thermoplastic adhesive to insert mold electronic components within a mold. It excels in environmental resistance characteristics such as waterproofing, dustproofing, and insulation, and it solidifies in a short time of just a few seconds, leading to its expanding adoption as a sealing method alternative to potting. Furthermore, the materials used in this method are primarily derived from natural fatty acids sourced from grains, making it an environmentally sustainable method. Examples of applications: - Automotive electronic components (interior/exterior of vehicles) - Electronic components for power tools - Electronic components for industrial equipment - Various sensors, switches, etc. - Components for outdoor equipment (such as agricultural machinery)
Easy measurement just by connecting to the terminal block/thru-hole! Accelerate the creation of IoT devices!
The "ADRSZRE" is a rotary encoder expansion board exclusively for the Raspberry Pi Zero. By simply connecting a rotary encoder to the terminal block/thru-hole, measurement can be easily performed, accelerating the creation of IoT devices. Additionally, by conducting measurements with a PIC microcontroller, it prevents the loss of pulses from high-pulse rotary encoders. 【Features】 ■ Compact "pHAT" size ■ High-precision measurement ■ Built-in high-performance PIC microcontroller considering real-time capabilities ■ Equipped with LEDs to visualize operating status *For more details, please refer to the PDF document or feel free to contact us.
It is suitable for high-resolution, high-speed transmission modules.
The "iM1427" is a simplified signal generation board with eDP (embedded Display Port/5.4G) interface, compatible with modules for Ultra books and Tablets, and includes pattern editing software for eDP output. This board has two DisplayPort outputs, allowing for simultaneous lighting of two panels, thereby expanding the range of inspection and evaluation methods. 【Features】 ■ Includes software for editing lighting patterns and timing ■ Allows pattern creation and timing settings to match the testing environment conducted by the customer *For more details, please download the PDF (English version) or feel free to contact us.
128-bit High-Voltage Digital Input Board
VME-1129 128-bit High-Voltage Digital Input Board with Built-in-Test and Input Filter. This product complies with the VMEbus specification (ANSI/IEEE STD 1014-1987, IEC 821 and 297), with the following mnemonics: A24:A16: D32/D16/D08 (EO): Slave:39/3D: 29/2D Form Factor: 6U
