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Tips Product List and Ranking from 189 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

Tips Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 恵命堂 Tokyo//Pharmaceuticals and Biotechnology
  2. 日研ツール 大阪営業所 Osaka//Other manufacturing
  3. ムネカタインダストリアルマシナリー Osaka//Industrial Machinery
  4. 4 片桐製作所 Yamagata//Machine elements and parts
  5. 5 ナツメ Aichi//Manufacturing and processing contract
Go to Company Ranking

Tips Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. Yakushima and Tanegashima produced gajutsu powder/dried chips (purple turmeric) 恵命堂
  2. Impulse Welder Welding Chip Standard Type ムネカタインダストリアルマシナリー
  3. Taiyu Corporation's water-soluble cutting fluid Haichip NC-21RA 三徳エネルギー
  4. 4 Aluminum chip prevention Non-ferrous cutting insert 'PCD Unicorn Chip' Ando Co.,Ltd.
  5. 5 Electromagnetic Wave Attenuation Chip 'NTE ECO CHIP' たけでん UVシステム G

Tips Product List

46～60 item / All 443 items

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VCSEL chip / high-power VCSEL (sensor applications)

VCSEL chip / high-power VCSEL (sensor applications)

Optowell Corporation in South Korea supplies high-performance VCSEL, RC-LED, and Pin-PD devices as a result of its research achievements.

■VCSELs for sensors with excellent interference in vertical/horizontal mode single, multi-type VCSELs for proximity and security sensors, and pulse VCSEL bare chips for gesture sensors and illumination. ■Wavelengths are 850nm / 940nm. *We apologize for the inconvenience, but some products are temporarily out of production.*

  • Laser Components

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GaAs PIN photodiode PIN-PD bare chip

GaAs PIN photodiode PIN-PD bare chip

GaAs PIN photodiode optimal for VCSEL optical communication.

■Supports up to 25Gbps ■Single chip / array chip (1×4 / 1×12)

  • Laser Components
  • Other electronic parts
  • Other semiconductors

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25G DFB laser chip (bare chip/TO-can)

25G DFB laser chip (bare chip/TO-can)

◆Low current ◆Operating temperature range: -40℃ to 85℃ ◆Telcordia GR-468 compliant ◆Non-sealed package available

The DL-DFBXXX06D-25-I series is a 25Gbps single-mode edge-emitting CWDM DFB light source with a wavelength range of 1270 to 1370nm. This product features an InGaAIAs multi-quantum (quantum well) design, with an integrated waveguide and a short cavity length. - Standard lineup - ・CWDM4 (1270-1330nm) ・CWDM6 (1270-1370nm) ・MWDM (1270-1370nm) ・LWDM (1270-1310nm) Denselight is a photonic company that manufactures and sells InP and GaAs-based optoelectronic devices and integrated circuits, as well as wafers made using these technologies. Particularly in the fields of SLEDs and narrow bandwidth light sources, it possesses excellent technology and a standard lineup, and is applied in a wide range of applications including communications, medical, processing, and maintenance.

  • Other optical parts
  • Other physicochemical equipment

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56Gbaud PIN PD bare chip InGaAs/InP

56Gbaud PIN PD bare chip InGaAs/InP

◆Backside lens equipped InGaAs PIN-PD◆12μm active aperture◆GSG contact pads arranged on the same plane

◆Available with 250/750μm pitch 4ch array products ◆Operating range -40 to +85℃ Chip on carrier is also part of the standard lineup Low dark current WOORIRO, established in 1998, is a South Korean photonics company that has consistently advanced research and development of PLCs and InGaAs photodiodes (PDs) for high-speed optical communication. They have released mass-produced products such as optical communication splitters, AWGs, 10Gb/s PIN-PD/APDs, 25Gb/s PIN-PD APDs, 50Gb/s PIN-PD APDs, and ROSAs. Recently, due to the development of their own InGaAs APD technology, they have released single-photon detectors that can be considered the best performance in the industry.

  • Other optical parts
  • Other physicochemical equipment
  • Other measurement, recording and measuring instruments

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10Gbps PIN-PD・APD bare chip InGaAs/InP

10Gbps PIN-PD・APD bare chip InGaAs/InP

◆ 2.5 to 10 Gbps applications ◆ Light receiving surface: available in 32, 40, 50, 54 μm ◆ Low dark current ◆ Linear response

●Absolute Maximum Ratings (Tc=25℃) Parameter　　　　　　　　　　Symbol　　　　　 Rating　　　　　Unit Reverse voltage　　　　　　　　　VR　　　　　　　10　　　　　　V Reverse current　　　　　　　　　IR　　　　　　　　3　　　　　　mA Operating temperature range　　TOPR　　　　　40 to +85　　 　　℃ Storage temperature range　　　TSTG　　　　 　40 to +85　　　　 ℃ WOORIRO Co., Ltd. is a Korean photonics company that has consistently focused on the research and development of PLCs and InGaAs photodiodes (PDs) for high-speed optical communication since its founding in 1998. The company has released mass-produced products such as splitters, AWGs, 10Gb/s PIN-PD/APD, 25Gb/s PIN-PD APD, 50Gb/s PIN-PD APD, and ROSAs, and recently, due to the advancement of its own InGaAs APD technology, it has released a single-photon detector that can be considered the best performer in the industry.

  • Other optical parts
  • Other physicochemical equipment
  • Other measurement, recording and measuring instruments

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Wet etching metal film patterning processing service

Wet etching metal film patterning processing service

It supports patterning of chrome films, thin glass metal films, SiO2 films, and more!

We offer "metal film patterning processing services using wet etching." We accommodate patterning for metal film multilayer wiring, including chrome films, thin glass metal films, and SiO2 films. Please contact us when you need our services. 【Features】 ■ Patterning of metal film multilayer wiring - Transparent metal film: ITO film - White metal film: AL alloy film (W/10μm) *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Peptide cleanup C18 pipette tip

Peptide cleanup C18 pipette tip

ZORBAX SB-C18 silica-filled peptide cleanup pipette tip

The ZORBAX SB-C18 silica-filled "Peptide Cleanup Pipette Tip" purifies and concentrates peptide, protein digests, proteins, and oligonucleotide samples by passing them through the tip using pipetting operations. Common applications include sample pretreatment for analyses using ESI or MALDI-MS. This product is intended for general laboratory use and is not registered under the Pharmaceuticals and Medical Devices Act. *For more details, please refer to the PDF document or feel free to contact us.

  • Other physicochemical equipment

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Injection molded microchip

Injection molded microchip

Low cost, high precision! Introduction of resin microchips produced by injection molding.

Richelle's "Injection Molding Microchip" utilizes a substrate that has been etched on a silicon wafer as a mold stamper. By faithfully reproducing the unevenness of the silicon mold with advanced mold technology and using our original material with excellent transferability, we achieve high-precision molding. Additionally, by producing through injection molding, we enable mass production of chips and significant cost reductions. We accept custom production of injection-molded microchips tailored to your needs, in addition to our standard chips with five commonly requested flow patterns. 【Features】 ■ Significant cost reduction through advanced mold and molding technology ・High precision / mass production / low cost ■ Faithful transfer of uneven shapes with a height of 1.0μm ・Transferability / transparency / heat resistance ■ Realization of multi-layered three-dimensional flow paths through bonding technology *For more details, please refer to the catalog or feel free to contact us.

  • Resin mold

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Resin-made microchip "Joining Technology"

Resin-made microchip "Joining Technology"

Our unique bonding technology has made it possible to achieve multilayer 3D flow paths!

The features of our injection molding materials include the ability to bond multiple structures to create excellent bonded structures and micro parts. The bonding surfaces are pressure-resistant, preventing liquid leakage and seepage, which allows for the creation of superior microstructures and micro parts. Channels can be produced with widths and depths ranging from approximately 1 to 200 μm, but they are particularly effective for three-dimensional channels around 1 to 50 μm. 【Features】 ■ Realization of multilayer three-dimensional channels ■ No adhesive required ■ High adhesion bonding ■ Can be manufactured from 1 μm wide channels ■ Patent Pat.No.4000401 <Bonded Structures> *For more details, please refer to the catalog or feel free to contact us.

  • Resin mold

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Ultra-fine processing and mass production using resin injection molding.

Ultra-fine processing and mass production using resin injection molding.

Through microfabrication using injection molding, we have achieved mass production of resin-based microchips and devices, significantly reducing costs with advanced mold and molding technologies.

Our injection molding materials are resin compositions made from polypropylene-based resins and elastomers. The main feature is their excellent precision transferability, allowing for faithful reproduction of surface patterns with a stamper ranging from 0.3 to 100 μm. As a mold stamper, we use substrates that have been etched on silicon wafers, achieving high-precision mass production of flow path molded products by accurately reproducing the unevenness of silicon molds. As a material characteristic, it is possible to join multiple structures without the use of adhesives, enabling the creation of bonded structures and micro components. 《Examples of Resin Microchip Production》 - Well chips - Microfluidic chips - Micro-layer fluid chips - Micro-pillar chips *Please download the PDF to view the technical introduction and production examples.

  • others

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"Contract manufacturing service for resin microchips" *Materials with case studies available.

"Contract manufacturing service for resin microchips" *Materials with case studies available.

Starting with medical devices, for various tests. Mass production is possible with injection molding in channels of uniform depth!

Our company offers a contract manufacturing service for resin-based microchips that are active in fields such as biosciences. We use original resin materials made from polypropylene-based and elastomer-based resins, allowing for micro-order processing from 0.3 to 100 μm. Furthermore, we achieve uniform depth in the flow channels. Our service supports mass production through injection molding, enabling low-cost production. 【Flow of Contract Manufacturing Service (Example)】 1. Customer Inquiry 2. Technical Explanation and Specification Meeting 3. Prototype Cost Estimate 4. Prototype Production and Modifications 5. Mass Production Meeting 6. Mass Production 【ISO13485, Medical Device Manufacturing Certification】 We ensure strict quality control at our factory equipped with a clean room (Class 10,000). *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • Contract manufacturing

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Ultrasonic Homogenizer UX-600 Model Parts Flange Type Chip

Ultrasonic Homogenizer UX-600 Model Parts Flange Type Chip

Flanged chip for the ultrasonic homogenizer UX-600 series.

This is a flange-type tip for the ultrasonic homogenizer UX-600 series. It is used with various holders and cup horns. The lineup includes φ20, φ26, φ36, φ36 zirconia, and φ50, among many others. The φ36 tip is available with a zirconia tip material. For more details, please contact us or download the catalog.

  • Homogenizer

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Small! This is eco-friendly! Arc welding electrode "Mame Con Chip"

Small! This is eco-friendly! Arc welding electrode "Mame Con Chip"

A tip exchange method for environmentally friendly arc welding electrodes! Compared to traditional integrated types, it allows for cost reduction, waste reduction, and resource conservation.

The arc welding electrode "Mamecon Chip" is a resource-saving, split-type chip that is environmentally friendly and designed with economic efficiency in mind. It features a lineup of highly wear-resistant Super Mamecon Chip Zirconium-Chromium Copper and Ultra Mamecon Chip Beryllium Copper. Additionally, Mamecon adapters are available in Panasonic specifications (45L), Daihen specifications (40.5L), and Long specifications (69.5L). 【Features】 ■ Tip exchange method at the tip! ■ Compared to conventional integrated types, it reduces resource consumption, waste volume, and costs. ■ Mamecon Chips are available in three types of materials to suit your working environment. *Free samples are available, so please contact us if you are interested. *For more details about the product, you can download the PDF materials.

  • Welding Machine

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[Analysis Case] Evaluation of Carrier Concentration Distribution in Si-IGBT Chips

[Analysis Case] Evaluation of Carrier Concentration Distribution in Si-IGBT Chips

SRA evaluation of field stop layers and lifetime killers.

SRA can analyze the depth profile of carrier concentration distribution over a wide range from shallow regions (a few hundred nm) to deep regions (a few hundred μm). It is also possible to evaluate the in-plane distribution of resistance values at the sample surface or at specified depths. As an example, we will introduce a case where the depth profile of carrier concentration distribution for a commercially available Si-IGBT chip was evaluated, including the entire chip, the field stop layer, and the lifetime killer, as well as the in-plane distribution of resistance values at the irradiation depth of the lifetime killer using SRA.

  • Contract Analysis

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Audio signal processing DSP + stereo CODEC integrated SoC

Audio signal processing DSP + stereo CODEC integrated SoC

We offer a lineup of SoC products that incorporate high-quality audio codecs and USB drivers, featuring high-performance DSP and low power management functions!

The SNC8600/8600A, a product of SOUNDEC, is a system-on-chip (SoC) that incorporates a high-quality audio codec and USB driver, featuring high-performance DSP and low power management capabilities. It offers high integration and is suitable for low-cost product applications. Product Overview 1. Powerful computing unit: Cadence Tensilica HiFi3 high-performance DSP, processing speed: 200MHz 2. High-performance CODEC: 24-bit stereo ADC and DAC with 2 channels each, dynamic ranges of 106dB and 100dB respectively, supporting a wide range of sampling rates from 8kHz to 192kHz, with 2-channel PCM signal input and 8-channel PDM signal input. 3. Rich peripheral interfaces: USB2.0 (FS/HS), I2C, I2S, UART, GPIO 4. Excellent power management: Operates with an external voltage of 3.3V to 5.5V, with internal IP communication at 1.8V excluding USB. 5. Low power consumption

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  • Dedicated IC

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