We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Tips.
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Tips Product List and Ranking from 34 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

Tips Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. ムネカタインダストリアルマシナリー Osaka//Industrial Machinery
  2. null/null
  3. オーエスジーダイヤモンドツール Shiga//Other manufacturing
  4. 4 null/null
  5. 5 null/null
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Tips Product ranking

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. Impulse Welder Welding Chip Standard Type ムネカタインダストリアルマシナリー
  2. Taiyu Corporation's water-soluble cutting fluid Haichip NC-21RA
  3. Single crystal diamond insert chip オーエスジーダイヤモンドツール
  4. 4 Yangjie Electronic Technology リバウンドエレクトロニクス 本社
  5. 4 Aluminum chip prevention Non-ferrous cutting insert 'PCD Unicorn Chip'

Tips Product List

16～30 item / All 413 items

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Diamond Throwaway Chip

Diamond Throwaway Chip

Diamond Throwaway Chip

We are offering diamond throwaway tips at a low price. For standard products, we will inform you of the discount rate. For custom products, please let us know whether you will provide carbide tips and supply the drawings. We offer prices that will satisfy end users and trading companies that handle large quantities, so please inquire about the prices. All CBN tips are custom-made. If you would like to discuss various coatings, feel free to consult with us. Range of diamond tips: standard stock items to custom-made products and regrinding. *For standard stock items, we will send you a catalog, so please feel free to inquire. Due to popular demand, we are offering special prices. (We also provide to companies in the machine tool industry.)

  • Other cutting tools

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Test chip for ultra-fine pitch wire bonding evaluation.

Test chip for ultra-fine pitch wire bonding evaluation.

Test chip for ultra-fine pitch wire bonding evaluation.

Super Fine Pitch Wire Bonding Evaluation Test Chip ■Wafer Size: 8-inch wafer ■Base Chip Size: 3.0mm × 3.0mm ■Pad Pitch: 30, 35, 40, 45, 50, 55, 60μm from the chip inner peripheral pads ■Number of Pads: 120, 136, 144, 152, 152, 160, 160 pads from the chip inner peripheral pads ■Compatible Bump Process: None ■Compatible Substrate: None ■Options: Dicing processing / Back grinding processing ■Main Applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.

  • Other electronic parts
  • others
  • Processing Contract

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Test Chip 【Multi-Type】

Test Chip 【Multi-Type】

Test Chip 【Multi-Type】

Fine pitch wire bonding, gold-plated bumps, gold stud bumps, and multi-purpose test chip ■ Wafer size: 6-inch wafer ■ Base chip size: 2.11mm × 2.11mm ■ Pad pitch: 45, 50, 60μm from the chip inner peripheral pads ■ Number of pads: 92, 92, 100 pads from the chip inner peripheral pads ■ Compatible bump processes: Gold-plated bumps (select one type from pads with 45, 50, 60μm pitch) / Gold stud bumps ■ Compatible substrates: None ■ Options: Dicing processing / Back grinding processing ■ Main applications Material development, equipment development, substrate development Process startup/development, promotional data acquisition, etc.

  • Other electronic parts
  • others
  • Processing Contract

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Test chip for LCD driver implementation evaluation.

Test chip for LCD driver implementation evaluation.

Test chip for evaluating LCD driver implementation.

Liquid Crystal Driver Implementation Evaluation Test Chip □ Product Names ... JTEG Phase6_50/JTEG Phase6_35 JTEG Phase6_30/JTEG Phase6_25 JTEG Phase6_15S/JTEG Phase6_20 JTEG Phase6_40/JTEG Phase6_25E JTEG Phase6_60 ■ Main Applications Material development, equipment development, substrate development, process startup/development, promotional data acquisition, etc.

  • Other electronic parts
  • others
  • Processing Contract

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Test chip 【Ultra-small chip size 0.55mm】

Test chip 【Ultra-small chip size 0.55mm】

Test chip 【Ultra-small chip size 0.55mm】

Ultra-small chip size 0.55mm□ test chip ■ Wafer size ... 6-inch wafer ■ Base chip size ... 0.55mm × 0.55mm□ ■ Pad pitch ... 110μm ■ Number of pads ... 8 pads ■ Compatible bump processes ... Gold-plated bump / Gold stud bump ■ Options ... Bump mounting / Dicing processing / Back grinding processing / Surface polyimide film formation (excluding gold-plated bump products) ■ Main applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.

  • Other electronic parts
  • others
  • Processing Contract

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Test chip [Large general-purpose]

Test chip [Large general-purpose]

Test chip [Large general-purpose]

General-purpose test chip with a larger chip size than JTEG Phase 0 ■ Wafer size ... 8-inch wafer ■ Base chip size ... 3.5mm × 3.5mm ■ Pad pitch ... 120μm ■ Number of pads ... 96 bumps (the inner pads do not have aluminum pads opened) ■ Compatible bump process ... gold stud bump ■ Compatible substrate ... none ■ Options ... bump mounting / dicing processing / back grinding processing ■ Main applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.

  • Other electronic parts
  • others
  • Processing Contract

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Test chip [for ultra fine pitch WB/FC mounting evaluation]

Test chip [for ultra fine pitch WB/FC mounting evaluation]

Test chip for ultra-fine pitch WB/FC mounting evaluation.

Ultra Fine Pitch WB・FC Implementation Evaluation Test Chip ■Wafer Size ... 8-inch wafer ■Base Chip Size ... 6.0mm × 2.3mm ■Pad Pitch ... 300μm ■Number of Pads ... 16 bumps ■Compatible Bump Process ... None ■Compatible Substrate ... None ■Options ... Dicing processing / Back grinding processing ■Main Applications Material development, promotional data acquisition, etc.

  • Other electronic parts
  • others
  • Processing Contract

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Flat chips

Flat chips

It reduces excavation resistance by half, has excellent wear resistance, and features a robust structure with reinforced thickness for strength!

"Flat Chips" is a product developed by incorporating the voices of operators who use it directly on-site. It is designed to be overall thick, with larger radii at the four corners to enhance its resistance to impact. The corners on the left and right are areas where wear cannot be completely prevented due to the forces applied, but measures have been taken to slow down the rate of wear by reinforcing the thickness. Additionally, the gaps in the base edge of this product prevent soil and sand from getting stuck, making it harder for the soil inside the bucket to fall out. [Features] - Measures have been taken to slow down the rate of wear by reinforcing the thickness. - Overall designed to be thick, with larger radii at the four corners. - A structure that is particularly resistant to impact. - Makes it harder for soil and sand inside the bucket to fall out. - Reduces excavation resistance, excels in wear resistance, and has a robust structure due to thickness reinforcement, etc. *For more details, please refer to the PDF document or feel free to contact us.*

  • Other machine elements

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TEG chip

TEG chip

TEG chip

We can offer standard and custom options to fit your budget. We also accommodate various bump processing. We will respond to your specifications for wiring materials, insulation materials, etc. Additionally, we can create from just one piece, so please feel free to consult with us.

  • Bonding Equipment
  • Other semiconductors
  • Processing Contract

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TEG chip

TEG chip

Creation of TEG chips for implementation evaluation using techniques such as film formation, photo-etching, and plating.

At Toyowa Sangyo Co., Ltd., we create TEG chips for implementation evaluation using technologies such as film formation, photo-etching, and plating. We offer options for standard and custom products tailored to our customers' budgets and specifications. We can also accommodate small quantities. Please feel free to consult with us. Additionally, we provide back grinding processing for wafers and can handle processing for evaluation implementation boards. For more details, please contact us or refer to our catalog.

  • Other electronic parts
  • Contract manufacturing

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