Tips Product List and Ranking from 189 Manufacturers, Suppliers and Companies

Last Updated：Nov 19, 2025 Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

Tips Manufacturer, Suppliers and Company Rankings

Last Updated：Nov 19, 2025 Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

恵命堂 Tokyo//Pharmaceuticals and Biotechnology
日研ツール大阪営業所 Osaka//Other manufacturing
ムネカタインダストリアルマシナリー Osaka//Industrial Machinery
4 片桐製作所 Yamagata//Machine elements and parts
5 ナツメ Aichi//Manufacturing and processing contract

Go to Company Ranking

Tips Product ranking

Last Updated：Nov 19, 2025 Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

Yakushima and Tanegashima produced gajutsu powder/dried chips (purple turmeric) 恵命堂
Impulse Welder Welding Chip Standard Type ムネカタインダストリアルマシナリー
Taiyu Corporation's water-soluble cutting fluid Haichip NC-21RA 三徳エネルギー
4 Aluminum chip prevention Non-ferrous cutting insert 'PCD Unicorn Chip' Ando Co.,Ltd.
5 Electromagnetic Wave Attenuation Chip 'NTE ECO CHIP' たけでん UVシステム G

Tips Product List

16～30 item / All 443 items

Displayed results

Chip "Throwaway Chip"

We also accept processing of special chips tailored to your needs!

The "Throwaway Chip" is a special chip from Tateno Co., Ltd. that can be processed into various shapes such as inner diameter turning, parting, and grooving. In accordance with customer requests, we offer high-performance special chip processing with short delivery times and low prices, including chip material types, procurement of materials equivalent to manufacturer products, and design of coatings and brazed chips. Please feel free to consult with us. 【Features】 ■ Special chips can be produced in a short delivery time ■ Low prices ■ Design of coatings and brazed chips is possible ■ Consultation on chip material types is available *For more details, please refer to the catalog or feel free to contact us.

Company：タテノ
Price：Other

Other contract manufacturing
Other contract services
Other Machine Parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

ED1512762 N123F202460003GF

Sandvik SV N123F202460003GF CoroCut 2 Parting and Grooving Insert 1125 606-9827 [Non-cancellable]

Company：イーデンキ
Price：10,000 yen-100,000 yen

Other work tools

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Permanent deodorization with an air conditioner retrofit chip - Dynamic Flow

Just by adding it to your air conditioner, it enhances heat exchange performance, instantly deodorizes any odor, and the ability to eliminate smells is proof of its performance!

The truth about deodorization is just one: regardless of whether a smell is good or bad, it is meaningless if it cannot eliminate any odor. Dynamic Flow stops the growth of mold and prevents unpleasant odors from occurring. Regular maintenance of air conditioners is sufficient by simply rinsing with DIY air conditioner cleaning spray (about 500 yen) sold at home improvement stores. The mold removal and deodorization effect of disassembly cleaning lasts only one season; if mold grows again, it will return to square one. We aim to build an eco-friendly, healthy, and sustainable lifestyle. Aromatic deodorants (aromas) cannot eliminate odors even with air purifiers, which is equivalent to proving that the high-performance filters included with air conditioning units lack the ability to remove odor components. If you claim to deodorize, it should naturally be able to remove odor components based on personal preferences, but that is the limitation of the removal method using filters.

Company：東亜システムクリエイト営業部
Price：Less than 10,000 yen

Other air conditioning equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Impulse welder, welding chip, heater chip

We also sell heater chips (welding chips) for impulse welders individually. If you are having trouble with burrs, stringing, or chip replacement, please contact us!

We manufacture special heaters that optimize thermal efficiency and heat generation points tailored to each customer, in addition to standard specifications. You can choose from two types: cutting type and press processing type. We accommodate a wide range of needs with sales formats suitable for small to large lots, including multi-point irregular shapes and uniform shapes. *For more details, please refer to the external link page or feel free to contact us.

Welding Machine

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Reduce wear and maintain the performance of the spray nozzle! Carbide nozzle tip.

Is the rapid wear of spray nozzles causing you trouble and affecting performance? We can solve this with carbide nozzles. *Case study collection available.

When continuously spraying mixed liquids such as fiberglass, alumina powder, slurries, and paint, the nozzle orifice may wear, leading to increased flow rates or abnormalities in the pattern. By using a nozzle tip made of wear-resistant carbide, we can suppress wear and maintain stable flow rates and patterns, achieving wear countermeasures and performance improvements for single-fluid nozzles! In addition to wear countermeasures, we also offer consultations for improving nozzle performance, such as adjusting flow rates, angles, and distributions of the nozzles you are currently using. If you have any concerns about your nozzles, please feel free to contact us.

Company：共立合金製作所 / 総代理店　エバーロイ商事株式会社
Price：Other

nozzle

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Test chip for ultra-fine pitch wire bonding evaluation.

Super Fine Pitch Wire Bonding Evaluation Test Chip ■Wafer Size: 8-inch wafer ■Base Chip Size: 3.0mm × 3.0mm ■Pad Pitch: 30, 35, 40, 45, 50, 55, 60μm from the chip inner peripheral pads ■Number of Pads: 120, 136, 144, 152, 152, 160, 160 pads from the chip inner peripheral pads ■Compatible Bump Process: None ■Compatible Substrate: None ■Options: Dicing processing / Back grinding processing ■Main Applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.

Company：ウェル
Price：Other

Other electronic parts
others
Processing Contract

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Test Chip 【Multi-Type】

Fine pitch wire bonding, gold-plated bumps, gold stud bumps, and multi-purpose test chip ■ Wafer size: 6-inch wafer ■ Base chip size: 2.11mm × 2.11mm ■ Pad pitch: 45, 50, 60μm from the chip inner peripheral pads ■ Number of pads: 92, 92, 100 pads from the chip inner peripheral pads ■ Compatible bump processes: Gold-plated bumps (select one type from pads with 45, 50, 60μm pitch) / Gold stud bumps ■ Compatible substrates: None ■ Options: Dicing processing / Back grinding processing ■ Main applications Material development, equipment development, substrate development Process startup/development, promotional data acquisition, etc.

Company：ウェル
Price：Other

Other electronic parts
others
Processing Contract

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Test chip for LCD driver implementation evaluation.

Test chip for evaluating LCD driver implementation.

Liquid Crystal Driver Implementation Evaluation Test Chip □ Product Names ... JTEG Phase6_50/JTEG Phase6_35 JTEG Phase6_30/JTEG Phase6_25 JTEG Phase6_15S/JTEG Phase6_20 JTEG Phase6_40/JTEG Phase6_25E JTEG Phase6_60 ■ Main Applications Material development, equipment development, substrate development, process startup/development, promotional data acquisition, etc.

Company：ウェル
Price：Other

Other electronic parts
others
Processing Contract

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Test chip 【Ultra-small chip size 0.55mm】

Ultra-small chip size 0.55mm□ test chip ■ Wafer size ... 6-inch wafer ■ Base chip size ... 0.55mm × 0.55mm□ ■ Pad pitch ... 110μm ■ Number of pads ... 8 pads ■ Compatible bump processes ... Gold-plated bump / Gold stud bump ■ Options ... Bump mounting / Dicing processing / Back grinding processing / Surface polyimide film formation (excluding gold-plated bump products) ■ Main applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.

Company：ウェル
Price：Other

Other electronic parts
others
Processing Contract

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Test chip [Large general-purpose]

General-purpose test chip with a larger chip size than JTEG Phase 0 ■ Wafer size ... 8-inch wafer ■ Base chip size ... 3.5mm × 3.5mm ■ Pad pitch ... 120μm ■ Number of pads ... 96 bumps (the inner pads do not have aluminum pads opened) ■ Compatible bump process ... gold stud bump ■ Compatible substrate ... none ■ Options ... bump mounting / dicing processing / back grinding processing ■ Main applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.

Company：ウェル
Price：Other

Other electronic parts
others
Processing Contract

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Test chip [for ultra fine pitch WB/FC mounting evaluation]

Test chip for ultra-fine pitch WB/FC mounting evaluation.

Ultra Fine Pitch WB・FC Implementation Evaluation Test Chip ■Wafer Size ... 8-inch wafer ■Base Chip Size ... 6.0mm × 2.3mm ■Pad Pitch ... 300μm ■Number of Pads ... 16 bumps ■Compatible Bump Process ... None ■Compatible Substrate ... None ■Options ... Dicing processing / Back grinding processing ■Main Applications Material development, promotional data acquisition, etc.

Company：ウェル
Price：Other

Other electronic parts
others
Processing Contract

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Flat chips

It reduces excavation resistance by half, has excellent wear resistance, and features a robust structure with reinforced thickness for strength!

"Flat Chips" is a product developed by incorporating the voices of operators who use it directly on-site. It is designed to be overall thick, with larger radii at the four corners to enhance its resistance to impact. The corners on the left and right are areas where wear cannot be completely prevented due to the forces applied, but measures have been taken to slow down the rate of wear by reinforcing the thickness. Additionally, the gaps in the base edge of this product prevent soil and sand from getting stuck, making it harder for the soil inside the bucket to fall out. [Features] - Measures have been taken to slow down the rate of wear by reinforcing the thickness. - Overall designed to be thick, with larger radii at the four corners. - A structure that is particularly resistant to impact. - Makes it harder for soil and sand inside the bucket to fall out. - Reduces excavation resistance, excels in wear resistance, and has a robust structure due to thickness reinforcement, etc. *For more details, please refer to the PDF document or feel free to contact us.*

Company：マクシスコーポレーション
Price：Other

Other machine elements

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Introduction to Glass Etching Processing Technology

Corrode the surface of the glass with chemicals such as hydrofluoric acid!

"Glass etching" is a processing technique that involves corroding the surface of glass with chemicals such as hydrofluoric acid to create grooves and relief patterns. Quartz and borosilicate glass such as BK7 are used as substrate materials. Additionally, a metal thin film patterned by photolithography is used as a mask, allowing for the formation of high-precision patterns. [Features] - Uses quartz and borosilicate glass such as BK7 as substrate materials - Utilizes a metal thin film patterned by photolithography as a mask - Capable of forming high-precision patterns - Allows for dimensional control in the depth direction - The surface is relatively smooth finished *For more details, please refer to the catalog or feel free to contact us.

Company：フォトプレシジョン
Price：Other

Technology Development

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

LCD driver equipped BLE SoC 'A3513'

It is equipped with various operation modes! It also supports a 4X21 segment LCD display.

The A3513 is a BLE SoC (Bluetooth 5.0) with an LCD driver. It supports 2.4GHz FSK/GFSK with high performance and low cost, ranging from 5Kbps to 2Mbps. It is a Bluetooth Smart device that integrates an 8051 MCU, 64KB flash memory, 8KB SRAM, and a 2.4GHz FSK/GFSK RF transceiver. Additionally, it has various operating modes, making it suitable for systems that require ultra-low power consumption. It also includes a low-noise 24-bit ADC converter, supporting a 4X21 segment LCD display. 【Features】 ■ High performance and low cost 2.4GHz FSK/GFSK ■ Supports 5Kbps to 2Mbps ■ Equipped with various operating modes ■ Ideal for systems requiring ultra-low power consumption ■ Built-in low-noise 24-bit ADC converter *For more details, please download the PDF or feel free to contact us.

Company：アスニクス
Price：Other

IC tag
RFID/IC tags
Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

ESI spray chip

"Achieving extremely tight tolerances" ESI spray chips enable stable and reproducible spraying with strict tolerances at the micro level.

【The Sharp Singularity Emitter】 To achieve a stable and reproducible spray, extremely strict tolerances at the micro level during production are required. The ESI spray chip "The Sharp Singularity Emitter" from Fossiliontech features: ◆ An extremely sharp chip tip ◆ A consistent inner diameter up to the chip tip (minimum 10μm) ◆ Very strict tolerances 【LOTUS Sharp Singularity Emitter】 The "LOTUS Sharp Singularity Emitter" has a hydrophobic treatment on its surface, which means the meniscus is fixed only at the inner diameter. This results in good ionization efficiency at low voltage and achieves a stable spray. Compared to The Sharp Singularity Emitter: ◆ The number of peptide IDs increases by 3.3%. ◆ The variation in peptide IDs is reduced by 5.5 times.