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Tips Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

Tips Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. ムネカタインダストリアルマシナリー Osaka//Industrial Machinery
  2. 三徳エネルギー Osaka//Petroleum and coal products
  3. ノア Tokyo//Machine elements and parts
  4. 4 ワトソン Tokyo//Resin/Plastic
  5. 5 ナツメ Aichi//Manufacturing and processing contract
Go to Company Ranking

Tips Product ranking

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. Taiyu Corporation's water-soluble cutting fluid Haichip NC-21RA 三徳エネルギー
  2. Impulse Welder Welding Chip Standard Type ムネカタインダストリアルマシナリー
  3. Syringe cap that can be used with both lure chips and lure locks. 大阪ケミカル
  4. 4 Yangjie Electronic Technology リバウンドエレクトロニクス 本社
  5. 5 Nozzle tip for a combustion burner that reduces fuel consumption. アトマックス

Tips Product List

16～30 item / All 413 items

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Impulse welder, welding chip, heater chip

Impulse welder, welding chip, heater chip

We also sell heater chips (welding chips) for impulse welders individually. If you are having trouble with burrs, stringing, or chip replacement, please contact us!

We manufacture special heaters that optimize thermal efficiency and heat generation points tailored to each customer, in addition to standard specifications. You can choose from two types: cutting type and press processing type. We accommodate a wide range of needs with sales formats suitable for small to large lots, including multi-point irregular shapes and uniform shapes. *For more details, please refer to the external link page or feel free to contact us.

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  • Welding Machine

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Reduce wear and maintain the performance of the spray nozzle! Carbide nozzle tip.

Reduce wear and maintain the performance of the spray nozzle! Carbide nozzle tip.

Is the rapid wear of spray nozzles causing you trouble and affecting performance? We can solve this with carbide nozzles. *Case study collection available.

When continuously spraying mixed liquids such as fiberglass, alumina powder, slurries, and paint, the nozzle orifice may wear, leading to increased flow rates or abnormalities in the pattern. By using a nozzle tip made of wear-resistant carbide, we can suppress wear and maintain stable flow rates and patterns, achieving wear countermeasures and performance improvements for single-fluid nozzles! In addition to wear countermeasures, we also offer consultations for improving nozzle performance, such as adjusting flow rates, angles, and distributions of the nozzles you are currently using. If you have any concerns about your nozzles, please feel free to contact us.

  • nozzle

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Diamond Throwaway Chip

Diamond Throwaway Chip

Diamond Throwaway Chip

We are offering diamond throwaway tips at a low price. For standard products, we will inform you of the discount rate. For custom products, please let us know whether you will provide carbide tips and supply the drawings. We offer prices that will satisfy end users and trading companies that handle large quantities, so please inquire about the prices. All CBN tips are custom-made. If you would like to discuss various coatings, feel free to consult with us. Range of diamond tips: standard stock items to custom-made products and regrinding. *For standard stock items, we will send you a catalog, so please feel free to inquire. Due to popular demand, we are offering special prices. (We also provide to companies in the machine tool industry.)

  • Other cutting tools

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Test chip for ultra-fine pitch wire bonding evaluation.

Test chip for ultra-fine pitch wire bonding evaluation.

Test chip for ultra-fine pitch wire bonding evaluation.

Super Fine Pitch Wire Bonding Evaluation Test Chip ■Wafer Size: 8-inch wafer ■Base Chip Size: 3.0mm × 3.0mm ■Pad Pitch: 30, 35, 40, 45, 50, 55, 60μm from the chip inner peripheral pads ■Number of Pads: 120, 136, 144, 152, 152, 160, 160 pads from the chip inner peripheral pads ■Compatible Bump Process: None ■Compatible Substrate: None ■Options: Dicing processing / Back grinding processing ■Main Applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.

  • Other electronic parts
  • others
  • Processing Contract

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Test Chip 【Multi-Type】

Test Chip 【Multi-Type】

Test Chip 【Multi-Type】

Fine pitch wire bonding, gold-plated bumps, gold stud bumps, and multi-purpose test chip ■ Wafer size: 6-inch wafer ■ Base chip size: 2.11mm × 2.11mm ■ Pad pitch: 45, 50, 60μm from the chip inner peripheral pads ■ Number of pads: 92, 92, 100 pads from the chip inner peripheral pads ■ Compatible bump processes: Gold-plated bumps (select one type from pads with 45, 50, 60μm pitch) / Gold stud bumps ■ Compatible substrates: None ■ Options: Dicing processing / Back grinding processing ■ Main applications Material development, equipment development, substrate development Process startup/development, promotional data acquisition, etc.

  • Other electronic parts
  • others
  • Processing Contract

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Test chip for LCD driver implementation evaluation.

Test chip for LCD driver implementation evaluation.

Test chip for evaluating LCD driver implementation.

Liquid Crystal Driver Implementation Evaluation Test Chip □ Product Names ... JTEG Phase6_50/JTEG Phase6_35 JTEG Phase6_30/JTEG Phase6_25 JTEG Phase6_15S/JTEG Phase6_20 JTEG Phase6_40/JTEG Phase6_25E JTEG Phase6_60 ■ Main Applications Material development, equipment development, substrate development, process startup/development, promotional data acquisition, etc.

  • Other electronic parts
  • others
  • Processing Contract

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Test chip 【Ultra-small chip size 0.55mm】

Test chip 【Ultra-small chip size 0.55mm】

Test chip 【Ultra-small chip size 0.55mm】

Ultra-small chip size 0.55mm□ test chip ■ Wafer size ... 6-inch wafer ■ Base chip size ... 0.55mm × 0.55mm□ ■ Pad pitch ... 110μm ■ Number of pads ... 8 pads ■ Compatible bump processes ... Gold-plated bump / Gold stud bump ■ Options ... Bump mounting / Dicing processing / Back grinding processing / Surface polyimide film formation (excluding gold-plated bump products) ■ Main applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.

  • Other electronic parts
  • others
  • Processing Contract

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Test chip [Large general-purpose]

Test chip [Large general-purpose]

Test chip [Large general-purpose]

General-purpose test chip with a larger chip size than JTEG Phase 0 ■ Wafer size ... 8-inch wafer ■ Base chip size ... 3.5mm × 3.5mm ■ Pad pitch ... 120μm ■ Number of pads ... 96 bumps (the inner pads do not have aluminum pads opened) ■ Compatible bump process ... gold stud bump ■ Compatible substrate ... none ■ Options ... bump mounting / dicing processing / back grinding processing ■ Main applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.

  • Other electronic parts
  • others
  • Processing Contract

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Test chip [for ultra fine pitch WB/FC mounting evaluation]

Test chip [for ultra fine pitch WB/FC mounting evaluation]

Test chip for ultra-fine pitch WB/FC mounting evaluation.

Ultra Fine Pitch WB・FC Implementation Evaluation Test Chip ■Wafer Size ... 8-inch wafer ■Base Chip Size ... 6.0mm × 2.3mm ■Pad Pitch ... 300μm ■Number of Pads ... 16 bumps ■Compatible Bump Process ... None ■Compatible Substrate ... None ■Options ... Dicing processing / Back grinding processing ■Main Applications Material development, promotional data acquisition, etc.

  • Other electronic parts
  • others
  • Processing Contract

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Flat chips

Flat chips

It reduces excavation resistance by half, has excellent wear resistance, and features a robust structure with reinforced thickness for strength!

"Flat Chips" is a product developed by incorporating the voices of operators who use it directly on-site. It is designed to be overall thick, with larger radii at the four corners to enhance its resistance to impact. The corners on the left and right are areas where wear cannot be completely prevented due to the forces applied, but measures have been taken to slow down the rate of wear by reinforcing the thickness. Additionally, the gaps in the base edge of this product prevent soil and sand from getting stuck, making it harder for the soil inside the bucket to fall out. [Features] - Measures have been taken to slow down the rate of wear by reinforcing the thickness. - Overall designed to be thick, with larger radii at the four corners. - A structure that is particularly resistant to impact. - Makes it harder for soil and sand inside the bucket to fall out. - Reduces excavation resistance, excels in wear resistance, and has a robust structure due to thickness reinforcement, etc. *For more details, please refer to the PDF document or feel free to contact us.*

  • Other machine elements

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Introduction to Glass Etching Processing Technology

Introduction to Glass Etching Processing Technology

Corrode the surface of the glass with chemicals such as hydrofluoric acid!

"Glass etching" is a processing technique that involves corroding the surface of glass with chemicals such as hydrofluoric acid to create grooves and relief patterns. Quartz and borosilicate glass such as BK7 are used as substrate materials. Additionally, a metal thin film patterned by photolithography is used as a mask, allowing for the formation of high-precision patterns. [Features] - Uses quartz and borosilicate glass such as BK7 as substrate materials - Utilizes a metal thin film patterned by photolithography as a mask - Capable of forming high-precision patterns - Allows for dimensional control in the depth direction - The surface is relatively smooth finished *For more details, please refer to the catalog or feel free to contact us.

  • Technology Development

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ESI spray chip

ESI spray chip

"Achieving extremely tight tolerances" ESI spray chips enable stable and reproducible spraying with strict tolerances at the micro level.

【The Sharp Singularity Emitter】 To achieve a stable and reproducible spray, extremely strict tolerances at the micro level during production are required. The ESI spray chip "The Sharp Singularity Emitter" from Fossiliontech features: ◆ An extremely sharp chip tip ◆ A consistent inner diameter up to the chip tip (minimum 10μm) ◆ Very strict tolerances 【LOTUS Sharp Singularity Emitter】 The "LOTUS Sharp Singularity Emitter" has a hydrophobic treatment on its surface, which means the meniscus is fixed only at the inner diameter. This results in good ionization efficiency at low voltage and achieves a stable spray. Compared to The Sharp Singularity Emitter: ◆ The number of peptide IDs increases by 3.3%. ◆ The variation in peptide IDs is reduced by 5.5 times.

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  • Other physicochemical equipment

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Semiconductor pressure sensor chip "SD Series"

Semiconductor pressure sensor chip "SD Series"

Customizable from design to mass production! Low cost, high precision, and highly reliable pressure sensor chips.

The "SD Series" is a semiconductor pressure sensor chip with a wide range of pressure specifications (10 kPa to 50 MPa). The chip size ranges from 1 mm to 3 mm. It features low cost, high precision, high reliability, and high breakdown pressure. There are two types available according to the application: absolute pressure and gauge pressure, and we offer custom solutions from design to mass production. 【Features】 ■ Chip size ranges from 1 mm to 3 mm ■ Two types available (absolute pressure and gauge pressure) according to application ■ Wide range of pressure specifications (10 kPa to 50 MPa) ■ Maximum load pressure: three times the rated pressure ■ Operating temperature range: -20 to +100°C *For more details, please refer to the PDF document or feel free to contact us.

  • Sensors
  • Other electronic parts
  • Other semiconductors

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TEG chip

TEG chip

TEG chip

We can offer standard and custom options to fit your budget. We also accommodate various bump processing. We will respond to your specifications for wiring materials, insulation materials, etc. Additionally, we can create from just one piece, so please feel free to consult with us.

  • Bonding Equipment
  • Other semiconductors
  • Processing Contract

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