ED1512762 N123F202460003GF
ED1512762 N123F202460003GF
Sandvik SV N123F202460003GF CoroCut 2 Parting and Grooving Insert 1125 606-9827 [Non-cancellable]
- Company:イーデンキ
- Price:10,000 yen-100,000 yen
Last Updated: Aggregation Period:Dec 10, 2025~Jan 06, 2026
This ranking is based on the number of page views on our site.
Last Updated: Aggregation Period:Dec 10, 2025~Jan 06, 2026
This ranking is based on the number of page views on our site.
Last Updated: Aggregation Period:Dec 10, 2025~Jan 06, 2026
This ranking is based on the number of page views on our site.
16~30 item / All 439 items
ED1512762 N123F202460003GF
Sandvik SV N123F202460003GF CoroCut 2 Parting and Grooving Insert 1125 606-9827 [Non-cancellable]
Just by adding it to your air conditioner, it enhances heat exchange performance, instantly deodorizes any odor, and the ability to eliminate smells is proof of its performance!
The truth about deodorization is just one: regardless of whether a smell is good or bad, it is meaningless if it cannot eliminate any odor. Dynamic Flow stops the growth of mold and prevents unpleasant odors from occurring. Regular maintenance of air conditioners is sufficient by simply rinsing with DIY air conditioner cleaning spray (about 500 yen) sold at home improvement stores. The mold removal and deodorization effect of disassembly cleaning lasts only one season; if mold grows again, it will return to square one. We aim to build an eco-friendly, healthy, and sustainable lifestyle. Aromatic deodorants (aromas) cannot eliminate odors even with air purifiers, which is equivalent to proving that the high-performance filters included with air conditioning units lack the ability to remove odor components. If you claim to deodorize, it should naturally be able to remove odor components based on personal preferences, but that is the limitation of the removal method using filters.
We also sell heater chips (welding chips) for impulse welders individually. If you are having trouble with burrs, stringing, or chip replacement, please contact us!
We manufacture special heaters that optimize thermal efficiency and heat generation points tailored to each customer, in addition to standard specifications. You can choose from two types: cutting type and press processing type. We accommodate a wide range of needs with sales formats suitable for small to large lots, including multi-point irregular shapes and uniform shapes. *For more details, please refer to the external link page or feel free to contact us.
Test chip for ultra-fine pitch wire bonding evaluation.
Super Fine Pitch Wire Bonding Evaluation Test Chip ■Wafer Size: 8-inch wafer ■Base Chip Size: 3.0mm × 3.0mm ■Pad Pitch: 30, 35, 40, 45, 50, 55, 60μm from the chip inner peripheral pads ■Number of Pads: 120, 136, 144, 152, 152, 160, 160 pads from the chip inner peripheral pads ■Compatible Bump Process: None ■Compatible Substrate: None ■Options: Dicing processing / Back grinding processing ■Main Applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.
Test Chip 【Multi-Type】
Fine pitch wire bonding, gold-plated bumps, gold stud bumps, and multi-purpose test chip ■ Wafer size: 6-inch wafer ■ Base chip size: 2.11mm × 2.11mm ■ Pad pitch: 45, 50, 60μm from the chip inner peripheral pads ■ Number of pads: 92, 92, 100 pads from the chip inner peripheral pads ■ Compatible bump processes: Gold-plated bumps (select one type from pads with 45, 50, 60μm pitch) / Gold stud bumps ■ Compatible substrates: None ■ Options: Dicing processing / Back grinding processing ■ Main applications Material development, equipment development, substrate development Process startup/development, promotional data acquisition, etc.
Test chip for evaluating LCD driver implementation.
Liquid Crystal Driver Implementation Evaluation Test Chip □ Product Names ... JTEG Phase6_50/JTEG Phase6_35 JTEG Phase6_30/JTEG Phase6_25 JTEG Phase6_15S/JTEG Phase6_20 JTEG Phase6_40/JTEG Phase6_25E JTEG Phase6_60 ■ Main Applications Material development, equipment development, substrate development, process startup/development, promotional data acquisition, etc.
Test chip 【Ultra-small chip size 0.55mm】
Ultra-small chip size 0.55mm□ test chip ■ Wafer size ... 6-inch wafer ■ Base chip size ... 0.55mm × 0.55mm□ ■ Pad pitch ... 110μm ■ Number of pads ... 8 pads ■ Compatible bump processes ... Gold-plated bump / Gold stud bump ■ Options ... Bump mounting / Dicing processing / Back grinding processing / Surface polyimide film formation (excluding gold-plated bump products) ■ Main applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.
Test chip [Large general-purpose]
General-purpose test chip with a larger chip size than JTEG Phase 0 ■ Wafer size ... 8-inch wafer ■ Base chip size ... 3.5mm × 3.5mm ■ Pad pitch ... 120μm ■ Number of pads ... 96 bumps (the inner pads do not have aluminum pads opened) ■ Compatible bump process ... gold stud bump ■ Compatible substrate ... none ■ Options ... bump mounting / dicing processing / back grinding processing ■ Main applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.
Test chip for ultra-fine pitch WB/FC mounting evaluation.
Ultra Fine Pitch WB・FC Implementation Evaluation Test Chip ■Wafer Size ... 8-inch wafer ■Base Chip Size ... 6.0mm × 2.3mm ■Pad Pitch ... 300μm ■Number of Pads ... 16 bumps ■Compatible Bump Process ... None ■Compatible Substrate ... None ■Options ... Dicing processing / Back grinding processing ■Main Applications Material development, promotional data acquisition, etc.
It reduces excavation resistance by half, has excellent wear resistance, and features a robust structure with reinforced thickness for strength!
"Flat Chips" is a product developed by incorporating the voices of operators who use it directly on-site. It is designed to be overall thick, with larger radii at the four corners to enhance its resistance to impact. The corners on the left and right are areas where wear cannot be completely prevented due to the forces applied, but measures have been taken to slow down the rate of wear by reinforcing the thickness. Additionally, the gaps in the base edge of this product prevent soil and sand from getting stuck, making it harder for the soil inside the bucket to fall out. [Features] - Measures have been taken to slow down the rate of wear by reinforcing the thickness. - Overall designed to be thick, with larger radii at the four corners. - A structure that is particularly resistant to impact. - Makes it harder for soil and sand inside the bucket to fall out. - Reduces excavation resistance, excels in wear resistance, and has a robust structure due to thickness reinforcement, etc. *For more details, please refer to the PDF document or feel free to contact us.*
Achieving stable machining accuracy and surface quality even with difficult-to-cut materials! A system capable of comprehensive support from surface treatment to cleaning and inspection.
This product is a high-precision medical catheter tip that is compatible with difficult-to-machine materials such as SUS316 and SUS304. It achieves a machining precision of ±0.01mm within an outer diameter range of φ1 to 5mm and can accommodate a surface roughness of Ra0.8. The fine processing of the tip shape ensures both insertability and safety within body cavities and blood vessels. Our in-house integrated system enables short delivery times and high quality, with a proven track record and reliability in the medical device field. 【Features】 ■ High-precision machining of small-diameter precision parts from φ1 to φ5 using NC automatic lathes ■ Stable maintenance of dimensional accuracy of ±0.01mm even with difficult-to-machine materials like SUS316 and SUS304 ■ Surface roughness and dimensional measurement system using image measuring instruments ■ Consistent support from prototype to mass production, achieving short delivery times and stable quality ■ ISO9001 certification obtained, establishing a quality assurance system from order to delivery ■ In-house integrated support available for surface treatment, cleaning, and inspection *For more details, please feel free to contact us.
By integrating processes from machining to inspection and cleaning through an in-house consistent system, we can provide products with short delivery times and high quality!
We would like to introduce a case study that achieves both high-precision processing and quality stabilization of SUS316 catheter tips. The SUS316 tips used as the tip components of medical catheters faced challenges with variations in dimensional accuracy and surface roughness. By combining high-precision cutting technology using NC automatic lathes with a measurement system utilizing image measurement devices, we have realized stable processing of SUS316. The variations in dimensional accuracy and surface roughness have been significantly improved. 【Case Overview】 ■Challenges - During the mass production process, we were unable to ensure processing stability of the difficult-to-cut material SUS316, leading to issues with quality variations and an increase in the rejection rate during inspection processes. ■Results and Effects - Mass production of the difficult-to-cut material SUS316 has become possible, leading to successful product commercialization. - The rejection rate during inspection processes has decreased, achieving quality stabilization. - This has resulted in increased reliability from medical device manufacturers and continued orders. *For more details, please download the PDF or feel free to contact us.
Corrode the surface of the glass with chemicals such as hydrofluoric acid!
"Glass etching" is a processing technique that involves corroding the surface of glass with chemicals such as hydrofluoric acid to create grooves and relief patterns. Quartz and borosilicate glass such as BK7 are used as substrate materials. Additionally, a metal thin film patterned by photolithography is used as a mask, allowing for the formation of high-precision patterns. [Features] - Uses quartz and borosilicate glass such as BK7 as substrate materials - Utilizes a metal thin film patterned by photolithography as a mask - Capable of forming high-precision patterns - Allows for dimensional control in the depth direction - The surface is relatively smooth finished *For more details, please refer to the catalog or feel free to contact us.
It is equipped with various operation modes! It also supports a 4X21 segment LCD display.
The A3513 is a BLE SoC (Bluetooth 5.0) with an LCD driver. It supports 2.4GHz FSK/GFSK with high performance and low cost, ranging from 5Kbps to 2Mbps. It is a Bluetooth Smart device that integrates an 8051 MCU, 64KB flash memory, 8KB SRAM, and a 2.4GHz FSK/GFSK RF transceiver. Additionally, it has various operating modes, making it suitable for systems that require ultra-low power consumption. It also includes a low-noise 24-bit ADC converter, supporting a 4X21 segment LCD display. 【Features】 ■ High performance and low cost 2.4GHz FSK/GFSK ■ Supports 5Kbps to 2Mbps ■ Equipped with various operating modes ■ Ideal for systems requiring ultra-low power consumption ■ Built-in low-noise 24-bit ADC converter *For more details, please download the PDF or feel free to contact us.