Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Dec 24, 2025～Jan 20, 2026
This ranking is based on the number of page views on our site.
16～19 item / All 19 items
Compact small-diameter thin wafer transfer device
The "Sic Holder Transfer Machine" is a device for transferring wafers from a horizontal oxidation/diffusion furnace wafer boat to a process cassette. We will provide it within 3 months after order and 3 days for startup adjustment. Please feel free to contact us if you have any requests. *For more details, please download the PDF or contact us.
We introduce a device that can also handle inverted recording! It is compatible with 8-inch Taiko wafers.
This product is a device that can transfer wafers without contacting the grinding area in the center of the wafer, thanks to the edge grip hand. It is possible to flip the grinding surface from bottom to top or vice versa. The cassette is compatible with both standard pitch cassettes and double pitch cassettes, allowing for interchangeability between them. 【Features】 ■ Compatible with 8-inch Tyco wafers ■ Capable of flipping the grinding surface from bottom to top or vice versa ■ Supports both standard pitch cassettes and double pitch cassettes ■ Interchangeable between each other ■ Can transfer wafers without contacting the grinding area in the center of the wafer due to the edge grip hand *For more details, please refer to the PDF document or feel free to contact us.
Auto door FOSB, compatible with carriers such as FOUP! A system that automatically transfers single sheets.
This product is a system that automatically transfers φ300mm (12") quartz glass wafers one by one between carriers from Stage 1 to Stage 2. The takt time and transfer time is 6 minutes and 30 seconds for 25 wafers or less. Regarding the wafer transfer specifications, the basic setup is to remove from the bottom of the cassette and store in the upper section. [Specifications (excerpt)] ■ Stage 1 (Loader) - Stage on the left side of the front of the device - Compatible carriers: Auto Door FOSB (wafer storage pitch 10mm × 25 wafers) FOUP SEMI standard products (wafer storage pitch 10mm × 25 wafers) - Sensor function: A transmissive mapping sensor is installed to confirm the presence of wafers in the cassette. *For more details, please refer to the PDF document or feel free to contact us.
LD bar transfer device
- High-speed and high-precision positioning is possible due to the proprietary image processing unit. - Reliable separation is achieved through the uniquely developed bar separation mechanism. - Pickup load can be set arbitrarily and instantly on a PC. - Device size: 800W × 700D × 1600H.
