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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Other semiconductor manufacturing equipment
  6. Wafer Transfer Device "Sic Holder Transfer Machine"

Wafer Transfer Device "Sic Holder Transfer Machine"

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last updated:Jul 19, 2018

ECP
ECP
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Compact small-diameter thin wafer transfer device

The "Sic Holder Transfer Machine" is a device for transferring wafers from a horizontal oxidation/diffusion furnace wafer boat to a process cassette. We will provide it within 3 months after order and 3 days for startup adjustment. Please feel free to contact us if you have any requests. *For more details, please download the PDF or contact us.

    Other semiconductor manufacturing equipment
キャプチャ.PNG

Wafer Transfer Device "Sic Holder Transfer Machine"

キャプチャ.PNG
キャプチャ.PNG
  • Related Link - http://www.eqclpr.com/service/index.html

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【Specifications】 ■Wafer Specification: 5 inches, 210–600μm ■Cassette: 50 pieces, Pitch: 2.38mm, PFA ■Cassette Charge: 4 cassettes / 8 cassettes ■Holder: 200–220 slots, Pitch: 2.38mm ■Charge Quantity: 200 pieces ■Throughput: 15 minutes / 200 pieces *For more details, please download the PDF or contact us.

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Wafer Transfer Device "Sic Holder Transfer Machine"

Wafer Transfer Device "Sic Holder Transfer Machine"

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ECP

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Industrial Electrical Equipment

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Since its establishment in 1977, our company has pursued advanced technology as a manufacturer of semiconductor cleaning equipment, designing and producing cleaning devices for ultra-LSI that boast high performance and high reliability through mechatronics and clean technology, even in the rapidly innovating semiconductor industry, and providing them to semiconductor manufacturers both domestically and internationally. In recent years, we have also been providing precision parts cleaning equipment that leverages our know-how in semiconductor cleaning equipment.

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