analysis Product List and Ranking from 41 Manufacturers, Suppliers and Companies

Last Updated：Oct 01, 2025 Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

analysis Manufacturer, Suppliers and Company Rankings

Last Updated：Oct 01, 2025 Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

ユーロフィンFQL Kanagawa//Service Industry
The Japan Steel Works, Ltd. Plastics Machinery Business Tokyo//Industrial Machinery
有限会社エムティプレシジョン Tokyo//Optical Instruments
4 Bühler K.K. Kanagawa//Food Machinery
5 ヒューリンクス Tokyo//software

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analysis Product ranking

Last Updated：Oct 01, 2025 Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

Yearly increasing battery fire incidents. Free distribution of safety evaluation guidebook! ユーロフィンFQL
Food-grade twin-screw extruder "TEX-F" The Japan Steel Works, Ltd. Plastics Machinery Business
Food-grade twin-screw extruder 'TEX-F' The Japan Steel Works, Ltd. Plastics Machinery Business
4 Positioning control with a laser distance sensor that can be retrofitted to a ceiling crane. 有限会社エムティプレシジョン
5 Graph Creation and Data Analysis for Researchers: KaleidaGraph ヒューリンクス

analysis Product List

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Fluororesin Injection Molding Technology | Preventing Troubles with Resin Flow Analysis

Cost reduction through pre-verification in the product design stage! We simulate injection molding of fluororesin materials such as PFA and engineering plastics.

In flow analysis, you can visually confirm the flow and filling of resin inside the mold, which cannot be seen in reality, in 3D. Through resin flow analysis, it is possible to predict flow patterns, resin pressure distribution, resin temperature distribution, and the occurrence position of weld lines. By conducting 3D simulations, you can anticipate issues before manufacturing the mold, allowing for effective countermeasures to be implemented in a short period and at low cost. 【Features】 ★ It can prevent issues before mold creation. ★ It can reduce the number of prototypes and keep costs down. ★ It can contribute to quality improvement. 【Types of Analysis】 - Filling analysis - Holding pressure cooling analysis - Fiber orientation analysis - Warpage deformation analysis - Insert analysis, etc. * To perform insert analysis, the results of the above filling analysis, holding pressure cooling analysis, (fiber orientation analysis), and warpage deformation analysis are required.

Company：MEIKO KOGYO CO., LTD.
Price：Other

Analysis Services

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Power Dock: Service for Identifying Issues Related to Board Power Supply

This is a service that investigates the causes of power supply issues in electronic circuit boards experiencing malfunctions and proposes countermeasures.

Due to issues with power supply design, there has been an increase in failures where devices do not operate during mass production and prototype evaluation. However, identifying the root cause of these failures requires technical know-how related to power supplies and circuit boards. Our company has been supporting analog products for many years and has investigated and addressed many causes of failures. This service leverages that expertise, with veteran engineers analyzing your circuit boards to provide the causes of failures and countermeasures.

Company：マクニカ
Price：Other

power supply
Circuit board design and manufacturing
Other contract services

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Ultra-small extruder "Micro Treader" [Minimum discharge 10g/h]

Ideal for research and development! Ultra-compact extruder achieving a low discharge rate of 10g/h.

RANDCASTLE's "Micro Treader" is a compact vertical micro-extruder that achieves low discharge extrusion (from 10g/hour). Its unique vertical design significantly outperforms horizontal small extruders in terms of screw strength, feed efficiency, and installation space. It is ideal for research and development that uses valuable samples. 【Features】 ◆ Minimum discharge of 10g/h! Capable of stable and small-volume extrusion ◆ High mixing comparable to a twin-screw extruder with a single screw ◆ Compact design allows for research in various locations ◆ Vertical orientation enhances resin feed efficiency 【For more details, please download the catalog or feel free to contact us】

Company：ユニテック・ジャパン
Price：Other

Extrusion Machine

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[Case Study] Western Japan Manufacturing Industry

A must-see for administrators!! Is it really this easy? Leave the expansion data migration to PowerScale | Introducing how that company utilizes PowerScale.

**Customer Challenges** - There are multiple file servers. - The implementation times are varied, and we want to consolidate them according to each update. - We want to simplify data migration and expansion. - We want to perform replacements without impacting operations over narrow network bandwidth between locations. **What PowerScale Solved** - Achieved file server integration and expansion with consideration for operations through a scale-out architecture and a single file system. - Enabled data migration across locations without impacting business operations through replication functionality. ↓↓ Please check the video at the bottom of the page for more details ↓↓

Company：デル・テクノロジーズ株式会社／Dell Technologies
Price：Other

Other information systems
Storage Backup
Other core systems

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Three-dimensional dynamic nonlinear analysis

Responding to customer requests, we have been renewed! Introducing 3D dynamic nonlinear analysis from Forum 8. ■□■Features■□■ ■ Eigenvalue analysis considering geometric stiffness ■ Added vertical and horizontal division options to the mesh division method for fiber element cross-sections ■ With the addition of important features related to analysis functions, it is now possible to analyze structures that were previously postponed for the application of UC-win/FRAME(3D) For other features and details, please download the catalog or contact us.

Company：フォーラムエイト
Price：Other

Image analysis software

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Thermal Fluid Analysis SOLIDWORKS Flow Simulation

Achieving seamless design and analysis! Add-in thermal fluid analysis software equipped with a variety of result evaluation features.

"SOLIDWORKS Flow Simulation" is a thermal fluid analysis software developed for all designers working with SOLIDWORKS. With complete integration into SOLIDWORKS, it achieves seamless design and analysis. Thanks to its diverse result evaluation features, it visualizes the flow paths of fluids with lines and arrows, and results can also be saved as animations. 【Features】 ■ Complete integration with SOLIDWORKS ■ Diverse result evaluation features - Streamlines: Visualize the flow paths of fluids with lines and arrows - Contours, Probes: Display calculation results on arbitrary sections or surfaces - XY Plot: Output calculation results on arbitrary sketches - Acoustic Evaluation: Generate graphs of frequency and sound pressure levels for arbitrary times and coordinates *For more details, please refer to the PDF materials or feel free to contact us.

Company：エービーケーエスエス本社
Price：Other

simulator
Thermo-fluid analysis
Structural Analysis

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Analysis of electronic components and materials using TEM.

TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and material evaluation.

TEM can perform not only high-magnification observation but also elemental analysis using EDS and EELS, as well as analysis of crystal structure, surface orientation, lattice constants, and more through electron diffraction.

Company：アイテス
Price：Other

Contract Analysis
Other semiconductors
Other contract services

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Analysis of the assembly joints of the implemented components

By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

Company：アイテス
Price：Other

Contract Analysis
Other contract services
Contract measurement

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EL/PL Imaging Device PVX1000+POPLI-Octa

The wafers in the solar cell manufacturing process can be evaluated using photoluminescence.

The PVX1000+POPLI-Octa can evaluate wafers during the solar cell manufacturing process using photoluminescence. It is capable of assessing the passivation effects of the PN junction layer after thermal diffusion, the AR layer deposition, surface contamination, as well as the protective effects of the rear insulation layer and the evaluation of Local-BSF. Additionally, by using a DC power supply for EL observation of the module, it is possible to pinpoint the locations of defects. By applying reverse bias to the module and observing LEAK points, defects that have caused PID can be easily identified.

Company：アイテス
Price：Other

Image Processing Equipment

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Microscopic EL/PL imaging device PVX1000+POPLI-μ

Microscopic PL observation of the fine structure of wafers in the solar cell manufacturing process.

The PVX1000+POPLI-μ allows for photoluminescence observation of the fine structure of wafers during the solar cell manufacturing process using a microscope. In the case of PERC, it is possible to evaluate individual Local-BSFs based on PL intensity and assess the damage to the passivation layer around the laser contact holes. Additionally, defect location identification is possible through EL observation of the module using a DC power supply.

Company：アイテス
Price：Other

Image Processing Equipment
Defect Inspection Equipment
Contract measurement

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EBSD analysis

Changes in crystal orientation and crystal grain size can be analyzed! We introduce the EBSD (Electron Backscatter Diffraction) method.

The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution by calculating the crystal orientation of patterns continuously captured based on the information of the crystal structure of the sample. Materials with a crystalline structure, such as metals and ceramics, are thought to be composed of numerous crystal lattices like cubic ones, and this analytical method examines the orientation of these lattices (crystal orientation). Various maps are used, including IQ maps (Image Quality Maps), IPF maps, GROD maps, and pole figures. 【Features】 ■ The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution. ■ Uses the TSL Solutions OIM7.0 crystal orientation analysis device. ■ Analyzes the orientation of the crystal lattice (crystal orientation). ■ Changes in crystal orientation and grain size due to different processing conditions (such as rolling and extrusion) can be analyzed. *For more details, please refer to the PDF document or feel free to contact us.

Company：アイテス
Price：Other

Analytical Equipment and Devices
Analysis Services

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IC failure analysis

By combining various methods suitable for failure modes, we can consistently address everything from the identification of defective nodes to physical analysis.

We would like to introduce Aites Inc.'s "Defect Analysis of ICs." Our company provides a comprehensive approach to ICs by combining methods suitable for various defect modes, from identifying defective nodes to physical analysis. We offer various analysis techniques, including "Light Emission Analysis/OBIRCH Analysis," which allows layout verification using a Layout Viewer, as well as "Layer Delamination/Sample Processing," "PVC Analysis," "Diffusion Layer Etching," and "sMIM Analysis." 【Methods】 ■ Light Emission Analysis/OBIRCH Analysis ■ Layer Delamination/Sample Processing ■ Microprobe ■ PVC Analysis ■ EBAC Analysis ■ Physical Analysis (FIB-SEM, TEM) *For more details, please refer to the PDF document or feel free to contact us.

Company：アイテス
Price：Other

Other analyses
Contract Analysis
Analysis Services

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OBIRCH analysis of SiC devices using short-wavelength lasers.

Since semiconductors have different physical properties, new methods are required for failure analysis!

Our company conducts OBIRCH analysis of SiC devices using short-wavelength lasers. SiC is a power device with less energy loss compared to conventional Si semiconductors and is attracting attention. However, since its physical properties differ from those of Si semiconductors, new methods are required for failure analysis. In the backside OBIRCH analysis of SiC-SBD using short-wavelength lasers, localized melting damage was induced in the SiC Schottky barrier diode, resulting in the generation of pseudo-leaks. Locations of pseudo-leaks that could not be confirmed in the IR-OBIRCH analysis were clearly observed in the GL-OBIRCH analysis. *For more details, please refer to the PDF materials or feel free to contact us.