We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for glue.
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glue Product List and Ranking from 273 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Oct 22, 2025~Nov 18, 2025
This ranking is based on the number of page views on our site.

glue Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Oct 22, 2025~Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 寺田 Tokyo//Electronic Components and Semiconductors
  2. null/null
  3. 理経 Tokyo//IT/Telecommunications
  4. 4 東亞合成 新製品開発事業部 機能性接着剤部 Tokyo//Chemical
  5. 5 積水フーラー Tokyo//Chemical

glue Product ranking

Last Updated: Aggregation Period:Oct 22, 2025~Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. One-component ultra-low temperature curing epoxy adhesive 'f·Stick 4410 series'
  2. Epoxy-based adhesive Araldite 2011 (TDS and SDS available) 寺田
  3. Epoxy adhesive Araldite RAPID 寺田
  4. 4 Comprehensive Catalog "Industrial Adhesives" ノガワケミカル
  5. 5 Epoxy adhesive Araldite AV138M-1/HV998-1 寺田

glue Product List

436~450 item / All 1143 items

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Can be bonded directly to nylon | Structural adhesive DP8910NS

If it is a nylon binder, it can be strongly bonded to nylon (polyamide) without surface treatments such as plasma or frame processing.

Typically, when bonding nylon components, heat resistance is often required for the adhesive joint, and surface treatment is also necessary for bonding. This is a new adhesive that enables structural bonding to nylon (polyamide) without the need for surface treatments such as plasma or flame treatment.

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Heat-resistant adhesive U-METAL AD1000

This is an inorganic high-temperature adhesive capable of withstanding 1000°C, primarily composed of amorphous silica and inorganic silicate materials, introduced to the market as a byproduct of rocket engineering.

The heat-resistant adhesive AD1000 was introduced to the market as a byproduct of rocket engineering and is an inorganic high-temperature adhesive primarily composed of amorphous silica and inorganic silicates. It is effective for bonding high-temperature materials such as metals, stones, bricks, and ceramics. AD1000 is a one-component adhesive that cures with only the base agent, requiring no mixing. The curing process can be accelerated by adding an activator. Since it is composed of inorganic, inert materials, it does not produce any gases and is resistant to concentrated sulfuric acid, concentrated hydrochloric acid, phosphoric acid, acetone, and benzene.

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  • Industrial Furnace
  • Repair Agent

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Optical Adhesive "Optocure Series" (Light-Curing Type)

Rich lineup! One-component light-curing adhesive developed for optoelectronics.

The "Optocleave Series" is a one-component, high-performance light-curing adhesive. It is a high-purity product that does not interfere with light propagation and contains no foreign substances. It achieves a fixation precision of μm and has a stable refractive index, providing long-lasting adhesive durability. We offer a rich lineup, including "UT20V," which has excellent adhesion to UV-cut glass, as well as "UT20" and "HR154," which excel in ultra-light resistance and precision adhesion. 【Features】 ■ No interference with light propagation ■ Stable refractive index ■ Achieves μm fixation precision ■ High-purity product containing no foreign substances ■ Long-lasting adhesive durability *For more details, please feel free to contact us.

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Visible light curing adhesive for plastics "Clear Luce MA21"

The connected resin can be processed with heat bending and more! It expands the applications of transparent plastic products.

"Clear Luce MA21" is a one-component adhesive suitable for surface bonding of transparent resin sheets such as acrylic and polycarbonate, developed independently by our company. It is a solvent-free adhesive made solely from acrylic monomers, allowing for strong bonding without dissolving acrylic resin or polycarbonate, enabling the production of various adhesive products that were previously considered difficult. 【Features】 ■ Solvent-free ■ One-component type ■ Ultra-low viscosity ■ Quick bonding ■ Excellent light resistance ■ Visible light polymerization *For more details, please feel free to contact us.

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Epoxy resin-based putty adhesive "S-Dine Joiner W"

Economical and beautifully finished! It cures underwater and on wet surfaces, demonstrating excellent adhesion.

"Esdine Joiner W" is a joint filling material for concrete structures made by blending special materials with epoxy resin. With a simple application method, it can effectively stop water, resolving previous issues all at once. Sealing concrete segments in areas with heavy groundwater has also become much easier. It has excellent adhesion even on wet surfaces and possesses good underwater curing properties, making it revolutionary for underwater applications. 【Features】 ■ Can adhere directly to wet surfaces ■ Cures in water and seawater ■ No pre-treatment required, easy to apply ■ Economical with a beautiful finish *For more details, please feel free to contact us.

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Tile adhesive "Super Cement"

This is an introduction to adhesives suitable for applications such as bonding tiles together and waterproofing at joints with walls!

"Super Cement" is an adhesive suitable for bonding and preventing displacement between tiles. There is no need for traditional methods such as "cement" or "plastering." Repair work for broken parts of tiles is also easy to carry out. It hardens in 1 to 3 days, which shortens the working days, and we offer four colors: black, gingro, new gingro, and shinch. [Features] - No need for cement or plastering - Easy to carry out repair work for broken parts of tiles - The hardened material is elastic, making it ideal for bonding and preventing displacement between tiles - Hardens in 1 to 3 days, reducing the number of working days *For more details, please feel free to contact us.

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One-component silicone-based elastic adhesive "Sekisui Bond #75"

Formaldehyde emission rate below 5 μg/m²h! It does not corrode metals, making it suitable for construction applications.

"Sekisui Bond #75" is an adhesive recommended by Sekisui for flooring and interior construction, taking health and environmental considerations into account. It is a multipurpose type that maintains high elasticity, is resistant to impact and vibration, absorbs the stress of expansion and contraction between adhered materials, and boasts excellent durability. Additionally, it can be easily removed from unnecessary areas such as the surface of the floor. It is easy to extrude even in winter, providing good workability. 【Features】 ■ Non-formaldehyde product compliant with building standards ■ JAIA F☆☆☆☆ certified ■ Low odor and does not corrode metals ■ Can be used as an adhesive in conjunction with double-sided tape ■ High-viscosity mastic type *For more details, please feel free to contact us.

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Psycholon B (Conductron)

High conductivity room temperature instant adhesive for discharge machining

It is the first room temperature curing adhesive that functions as a conductive adhesive.

  • glue

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Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 503

Alumina base. The coefficient of expansion is small, making it commonly used for bonding ceramics. It is also suitable for bonding materials such as platinum.

Alemco manufactured, based on alumina. It is a water-soluble inorganic heat-resistant adhesive. It is commonly used for bonding and sealing thermocouple deep probes used in high-temperature ranges. Being inert and chemically resistant, it does not produce outgassing even in high vacuum conditions. Additionally, it has excellent insulation properties, with an insulation strength of 171 volts/mil (at room temperature). The heat resistance limit is 1,650°C.

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Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 552

Alemco product, alumina-based. Suitable for bonding metals with low expansion coefficients such as molybdenum and tungsten, as well as ceramics and glass.

It is a one-component adhesive with alumina as the main filler. It is a high-temperature ceramic adhesive used for bonding soldering gun tips and for bonding electrical/mechanical assembly parts that require high heat resistance. The heat resistance limit is 1650°C.

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Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 569

Alumina base. Can be processed at room temperature and is widely used for bonding and coating between ceramics and between ceramics and metals, as well as for preventing screw loosening.

This is a new type of heat-resistant ceramic adhesive made by Alemco, based on alumina. It is a completely inorganic, one-component white paste that is widely used for bonding ceramics, metals, and crystals. It does not contain sodium and does not require heat curing. It can be processed at room temperature. It is ideal for bonding ceramics to each other, as well as for bonding ceramics to metals, such as sensors. The heat resistance limit is 1650°C.

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Heat-resistant adhesive | Ceramic adhesive (inorganic) Ultra Temp 516

Based on zirconia, the heat resistance limit is the highest among ceramic adhesives at 1760°C. It is a product with excellent insulation and adhesion properties.

Alemco's "Zirconia-based" ultra-high-temperature ceramic adhesive. It is a new type of inorganic ceramic adhesive based on zirconia, used for sensors and equipment that operate at high temperatures. The heat resistance limit reaches an impressive 1760°C, the highest for ceramic adhesives. It exhibits excellent electrical, mechanical, and thermal properties. Being water-soluble, it can be easily removed with warm water and soap before curing.

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Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 668

Based on alumina and silica. Can be processed at room temperature. Between ceramics and between ceramics and metals. Used for bonding and encapsulating small electronic components.

Alemco product, based on alumina and silica. It is a one-component adhesive that demonstrates excellent efficacy in bonding ceramics and metals (such as steel and stainless steel). Additionally, it is used for bonding and encapsulating small electrical components such as resistors, ignition devices, temperature sensing probes, and halogen lamps. After application, it should be air-dried at room temperature for about one hour, followed by firing at 93°C for 2 to 4 hours. The heat resistance limit is 1,371°C.

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