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glue - メーカー・企業273社の製品一覧とランキング

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glueのメーカー・企業ランキング

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  1. 寺田 Tokyo//Electronic Components and Semiconductors
  2. 理経 Tokyo//IT/Telecommunications
  3. スリーエム ジャパン Tokyo//Other manufacturing
  4. 4 積水フーラー Tokyo//Chemical
  5. 5 ノガワケミカル Tokyo//Building materials, supplies and fixtures
企業ランキングへ

glueの製品ランキング

更新日： 集計期間:Dec 24, 2025～Jan 20, 2026
※当サイトの各ページの閲覧回数を元に算出したランキングです。

  1. Epoxy adhesive Araldite RAPID 寺田
  2. Adhesives compliant with the Food Sanitation Act for the assembly of food machinery and equipment maintenance. 日本アイケミカル 本社
  3. Comprehensive Catalog "Industrial Adhesives" ノガワケミカル
  4. 4 Solvent-free low linear expansion adhesive NICBOND NB3004 DAIZO NICHIMOLY
  5. 5 Epoxy-based adhesive Araldite 2011 (TDS and SDS available) 寺田

glueの製品一覧

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Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 503

Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 503

Alumina base. The coefficient of expansion is small, making it commonly used for bonding ceramics. It is also suitable for bonding materials such as platinum.

Alemco manufactured, based on alumina. It is a water-soluble inorganic heat-resistant adhesive. It is commonly used for bonding and sealing thermocouple deep probes used in high-temperature ranges. Being inert and chemically resistant, it does not produce outgassing even in high vacuum conditions. Additionally, it has excellent insulation properties, with an insulation strength of 171 volts/mil (at room temperature). The heat resistance limit is 1,650°C.

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Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 552

Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 552

Alemco product, alumina-based. Suitable for bonding metals with low expansion coefficients such as molybdenum and tungsten, as well as ceramics and glass.

It is a one-component adhesive with alumina as the main filler. It is a high-temperature ceramic adhesive used for bonding soldering gun tips and for bonding electrical/mechanical assembly parts that require high heat resistance. The heat resistance limit is 1650°C.

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Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 569

Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 569

Alumina base. Can be processed at room temperature and is widely used for bonding and coating between ceramics and between ceramics and metals, as well as for preventing screw loosening.

This is a new type of heat-resistant ceramic adhesive made by Alemco, based on alumina. It is a completely inorganic, one-component white paste that is widely used for bonding ceramics, metals, and crystals. It does not contain sodium and does not require heat curing. It can be processed at room temperature. It is ideal for bonding ceramics to each other, as well as for bonding ceramics to metals, such as sensors. The heat resistance limit is 1650°C.

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Heat-resistant adhesive | Ceramic adhesive (inorganic) Ultra Temp 516

Heat-resistant adhesive | Ceramic adhesive (inorganic) Ultra Temp 516

Based on zirconia, the heat resistance limit is the highest among ceramic adhesives at 1760°C. It is a product with excellent insulation and adhesion properties.

Alemco's "Zirconia-based" ultra-high-temperature ceramic adhesive. It is a new type of inorganic ceramic adhesive based on zirconia, used for sensors and equipment that operate at high temperatures. The heat resistance limit reaches an impressive 1760°C, the highest for ceramic adhesives. It exhibits excellent electrical, mechanical, and thermal properties. Being water-soluble, it can be easily removed with warm water and soap before curing.

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Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 668

Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 668

Based on alumina and silica. Can be processed at room temperature. Between ceramics and between ceramics and metals. Used for bonding and encapsulating small electronic components.

Alemco product, based on alumina and silica. It is a one-component adhesive that demonstrates excellent efficacy in bonding ceramics and metals (such as steel and stainless steel). Additionally, it is used for bonding and encapsulating small electrical components such as resistors, ignition devices, temperature sensing probes, and halogen lamps. After application, it should be air-dried at room temperature for about one hour, followed by firing at 93°C for 2 to 4 hours. The heat resistance limit is 1,371°C.

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Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 618N

Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 618N

It is silica-based, characterized by a small thermal expansion coefficient and strong adhesion. It is suitable for bonding ceramics, glass, and quartz.

Alemco's products demonstrate strong adhesion to materials such as molybdenum and tungsten metals with low expansion coefficients based on silica, as well as ceramics, quartz, and glass. After application, allow to air dry at room temperature for 1 to 4 hours, then fire in stages at 93°C for 2 hours, 260°C for 2 hours, and 370°C for 2 hours to achieve complete curing. The maximum heat resistance is 1,650°C.

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Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 835

Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 835

Zirconium base, reinforced with ceramic fibers. For bonding ceramics to ceramics and ceramics to metals. An example of use is halogen lamps.

Alemco product, zirconia-based. It is a water-soluble one-component type that adheres well to ceramics, glass, and metals. It is reinforced with ceramic fibers and can be processed at room temperature. It is used for bonding ceramics to ceramics and ceramics to metals. Mainly used during the production of halogen lamps. After application, allow it to dry for about one hour, then it will cure after firing at 93°C for two hours. The heat resistance limit is 1,371°C.

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Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 865

Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 865

Based on aluminum nitride, it has high thermal conductivity and is insulating. It is used for sensors that require thermal conductivity, as well as for bonding ceramics to metals and ceramics to ceramics.

Alemco manufactured, aluminum nitride base. For bonding ceramics and metals such as ceramics, metals, semiconductors, and sensors that require high heat resistance and high thermal conductivity. After drying at room temperature for 1 to 4 hours, it is fired in stages at 93°C for 2 hours, 177°C for 2 hours, and 260°C for 2 hours. Heat resistance limit: 1,650°C.

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Heat-resistant adhesive | Temporary adhesive "Crystal Bond" series

Heat-resistant adhesive | Temporary adhesive "Crystal Bond" series

Used for temporarily holding parts that undergo dicing, grinding, or polishing processes.

This is a new type of temporary adhesive developed by AREMCO in the United States. It is used for temporary adhesion to backup blocks during dicing, grinding, and polishing processes. **Characteristics** It quickly and strongly adheres to ceramics, glass, and metals. **Examples of Applications** - Machining of the latest ceramics - Rough grinding and polishing of optical components - Metal piece processing for inspection under an electron microscope - Dicing of semiconductors - Dicing of ceramics and quartz materials

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Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 835M

Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 835M

Alumina-based with very strong adhesive properties and insulation. For bonding ceramics to ceramics and ceramics to metals. An example of use is halogen lamps.

Alemco product, alumina-based. It is a water-soluble one-component type that adheres well to ceramics, glass, and metals. It is ideal for use with automatic dispensers. Mainly used during the production of halogen lamps. After application, allow to dry for about 1 to 4 hours, then cure at 93°C for 2 hours. The heat resistance limit is 1,650°C.

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High thermal conductivity adhesive J-Thermo series thermal conductivity 3 W/m·K

High thermal conductivity adhesive J-Thermo series thermal conductivity 3 W/m·K

An adhesive that combines strong adhesion and high thermal conductivity. Among thermal conductive adhesives, it achieves an unprecedented high thermal conductivity.

By applying it between the heating element and the heat dissipation element, adhesion and thermal conduction can be achieved. 【Features】 ● A agent/B agent is mixed and used. ● Can be stored at room temperature. ● Highly flexible, making it easy to work with. ● Heat-resistant and cold-resistant, suitable for a wide range of environments. ● Made in Japan for peace of mind.

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Cold Welding/Structural Adhesive Belsona 7311 Catalog

Cold Welding/Structural Adhesive Belsona 7311 Catalog

Structural adhesives with excellent fatigue resistance are ideal alternatives to mechanical fastening, securing, and welding.

This structural adhesive, which requires high mechanical strength (resistance to shear and tear loads), is ideal for bonding applications where periodic and semi-permanent loads are applied to structures. It can be used as an alternative to mechanical fastening, fixing, and welding, and has heat resistance up to 60°C without the need for the following. It also has the following features: - Excellent adhesion to metal substrates - Engineering design data package - Solvent-free - Optimal temperature range of -30°C to 60°C - No special tools required - No fire hazard

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Adhesive Catalog

Adhesive Catalog

One-component, solvent-free types and hot melt adhesives! We have a wide range of products available.

This catalog introduces a variety of "adhesives" handled by Toa Gosei. Starting with the one-component, solvent-free "light-curing adhesive Alonix," which hardens quickly when exposed to light, we also feature "high-performance reactive adhesive Alon Mighty" and "instant adhesive Alon Alpha" among our lineup. Please use this for selecting products. [Featured Products (Excerpt)] ■ Light-curing adhesive "Alonix" ■ High-performance reactive adhesive "Alon Mighty" ■ Polyester-based hot melt adhesive "Alon Melt PES" ■ Instant adhesive "Alon Alpha" ■ Modified olefin-based hot melt adhesive "Alon Melt PPET" *For more details, please refer to the PDF document or feel free to contact us.

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Light-curing adhesive "Alonix Series"

Light-curing adhesive "Alonix Series"

Wide range of adhesion is possible with electronic components, metals, glass, plastics, etc.! Hardness, viscosity, and curing properties can be adjusted.

The "AroNix Series" is a light-curing adhesive that can bond over a wide wavelength range of ultraviolet and visible light. Starting with the visible light and ultraviolet curing type "LCR Series," we also offer the ultraviolet anaerobic curing type "BU Series" and the ultraviolet curing type "UV-3000 Series." Additionally, depending on the materials and the shape of the substrates, we have anaerobic types that can cure even in areas not exposed to ultraviolet light. 【Features】 ■ Single-component, lightweight, and no mixing required ■ Cures quickly with light ■ Reduces working time and lowers costs ■ Wide selection and design options for curing wavelengths, anaerobic properties, and cured material characteristics *For more details, please refer to the PDF document or feel free to contact us.

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Modified olefin-based hot melt adhesive "Alon Melt PPET"

Modified olefin-based hot melt adhesive "Alon Melt PPET"

Solidification and adhesion are possible in a short time! We also offer grades with added properties such as adhesion.

The "Alon Melt PPET Series" is a hot melt adhesive suitable for bonding difficult-to-adhere resins such as PP, PE, PET, and nylon, with modified olefin as the main component. It cures and bonds quickly, and is available in stick and pellet types, allowing for work with simpler handguns. The pellet, block, and stick types are 100% solid and are environmentally friendly adhesives. 【Features】 ■ Main component is modified olefin ■ Suitable for bonding difficult-to-adhere resins such as PP, PE, PET, and nylon ■ Grades with enhanced properties such as adhesion are also available ■ Cures and bonds quickly ■ Work with simpler handguns is also possible *For more details, please refer to the PDF document or feel free to contact us.

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